MOSFETS Flashcards

1
Q

The equation for oxide capacitance

A

the relative permittivity of oxide is epsilon ox

insulator thickness = dox

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2
Q

The equation for threshold voltage

A

Vfb= Φ ms–Q/C’o

  • Where Φms= Φm–Φs
  • Φm= workfunction of the gate material
  • Φs = workfunction of the semiconductor
  • Q is the number of charges per unit area
  • C’o= oxide capacitance per unit area
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3
Q

The equation for max depletion width under strong inversion

A
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4
Q

What is a unipolar device

A

A unipolar device is a device that uses one type of carrier for conduction- electrons or holes

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5
Q

What is a MOSFET

A

A Mosfet is a metal oxide semiconductor of the field-effect transistor family.

There is a thin silicon dioxide insulation layer, separating the metal and semiconductor.

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6
Q

What is a MOS Capacitor?

A

A metal-oxide-semiconductor which can have capacitor like behaviour

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7
Q

What does n-type mean?

A

n-type refers to the majority carriers in a semiconductor. In this case, electrons form the majority carrier flow in the material due to being dependent on the doping level. i.e. the device is doped with donor ions

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8
Q

What does p-type mean?

A

The p-type refers to the carriers within a semiconductor. The semiconductor is doped with acceptor ions, this means the majority carriers are the holes in the device.

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9
Q

What is a band diagram?

A

In solid-state physics of semiconductors, a band diagram is a diagram plotting various key electron energy levels as a function of some spatial dimension, which is often denoted x. These diagrams help to explain the operation of many kinds of semiconductor devices and to visualize how bands change with position.

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10
Q

What is accumulation in MOSFETs?

A

A MOS capacitor biased with a small negative voltage is in accumulation.

  • -ve charge induces equal opposite +ve charge in the silicon
  • +ve accumulation at the silicon due to holes
  • Minimum energy for holes level at the oxide
  • Applied voltage = sum of the voltage drop across the oxide and band bending in the silicon
  • Difference in Fermi level in metal and silicon = applied voltage
  • No band bending in silicon EF due to no current flows
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11
Q

Describe Depletion Condition

A
  • +ve charge induces equal opposite –ve charge in the silicon
  • -ve charge in the silicon due to depletion of holes in the silicon
  • Applied voltage = sum of the voltage drop across the oxide and band bending of silicon
  • Voltage drop across oxide and depletion region –determined by the capacitance of oxide and depletion
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12
Q

Describe Inversion Condition

A
  • V>>0, increase in voltage drop across oxide and depletion region
  • Increased voltage across depletion -> increased depletion width: p-n junction
  • EFnear to Ec
  • Induced n-type at the surface
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13
Q

Describe linear region

A

The linear region refers to low drain voltage, It has Ohmic characteristics.

  • Inversion layer like a resistive material (V=IR)
  • Electrons flow from Source to Drain
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14
Q

Describe Saturation Region

A

•Bias: VG> VT
As the voltage increases up to the voltage VSAT. It reaches the pinch-off point. here the inversion layer is reduced to zero.

Beyond the pinch-off point, the drain current remains essentially the same,
because for V, > V,,,,, at point P the voltage VDSarte mains the same. Thus, the number
of carriers arriving at point P from the source or the current flowing from the drain to
the source remains the same. This is the saturation region, since I, is a constant regardless
of an increase in the drain voltage.

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15
Q

What is Pinch Off?

A

Pinch off refers to what happens when the bias voltage reaches Vsat. Here the Inversion layer reduces to 0.

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16
Q

Define drift velocity

A

The drift velocity is the average velocity of the charge carriers in the drift current.

17
Q

Describe Inversion Layer

A

(EF- E,) > 0. Therefore, the electron concentration nP
at the interface is larger than ni, and the hole concentration given by Eq. 2 is less than
ni, The number of electrons (minority carriers) at the surface is greater than holes (majority
carriers); the surface is thus inverted.

18
Q

Describe NMOS

(substrate and channel)

A

NMOS has a p-substrate and form an n-channel.

19
Q

Describe PMOS

(substrate and channel)

A

n-substrate

p-channel

20
Q

Purpose of oxide in semiconductor

A

Oxide as an isolation layer to prevent current flow from top metal contact to bottom semiconductor contact

21
Q

Describe flat band condition

A
  • Assuming no applied gate voltage
  • Therefore no electric field
  • Assume qΦm= qΦs
  • Flat energy band in vacuum level for SiO2
22
Q

Draw Band Diagram of Flat Band Condition

A
23
Q

What does an applied gate voltage do to the semiconductor part of MOS?

A

Application of voltage -> band bending in the semiconductor part

24
Q

What is the effect of an applied voltage on the MOS capacitor?

A
  • Accumulation (small -ve voltage)
  • Depletion (small +ve voltage)
  • Inversion (large +ve voltage)
25
Q

Draw Band diagram for accumulation

A

Diagram From Top to bottom letters:

EC, EI, EF, EV

26
Q

Draw Band Diagram for Inversion

A

EC, Ei, EF, EV

27
Q

Draw Band Diagram For Depletion

A
28
Q

Draw Charge Graph For Accumulation

A
29
Q

Charge Graph For Depletion

A

W = depletion width

30
Q

Charge Graph For Depletion

A
31
Q

Charge Graph for Inversion

A

QM= qNAWm+ Qn

32
Q

The equation for majority carriers in accumulation

A

p = niexp((EI -EF)/kT)

33
Q

The equation for majority Carriers in Depletion Cond

A

n = niexp((EF -EI)/kT)

34
Q

The equation for majority Carriers in Inversion Cond

A

n = niexp((EF -EI)/kT)

35
Q

Features of Inversion Condition

A
  • Produces n-type semiconductor at the oxide-silicon interface by biasing
  • Without n doping
  • Advantages: no doping scattering and suppression of carrier ‘freeze-out
  • Can increase high carrier density by using large bandgap insulator: SiO2, HfO2
36
Q

What is the threshold voltage?

A

Defined as when strong inversion occurs, varies depending on the device. and is when EF–Ei> 0.

Vinv = 2 (kT)/q * ln NA/ni