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Engineering > IPC-A-610E_Table of Contents > Flashcards

IPC-A-610E_Table of Contents Flashcards

1
Q

 Introduction

A

Vorwort

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2
Q

Scope

A

Anwendungsbereich

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3
Q

Purpose

A

Zweck

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4
Q

Classification

A

Klassifikation

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5
Q

Definition of the requirements

A

Definition der Anforderungen

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6
Q

Acceptance Criteria

A

Abnahmekriterien

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7
Q

To be striving (ideal state)

A

Anzustreben (Idealzustand)

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8
Q

Permitted (Acceptance Capable)

A

Zula:ssig (Abnahmefa:hig)

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9
Q

error (Not ready for acceptance)

A

Fehler (Nicht abnahmefa:hig)

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10
Q

Disposition (Instruction)

A

Disposition (Handlungsanweisung)

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11
Q

Process Indicator

A

Prozessindikator

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12
Q

measures for the process indicator

A

MaSSnahmen fu:r den Prozessindikator

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13
Q

State

A

Zustand

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14
Q

Combined states

A

Kombinierte Zusta:nde

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15
Q

Nonspecified conditions

A

Nicht spezifizierte Zusta:nde

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16
Q

Special structures

A

Sonderkonstruktionen

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17
Q

Technical Terms & Definitions

A

Fachbegriffe & Definitionen

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18
Q

PCB orientation

A

LeiterplattenOrientierung

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19
Q

primary side

A

Prima:rseite

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20
Q

secondary side

A

Sekunda:rseite

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21
Q

solder source side

A

LotQuellseite

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22
Q

Lot landing page

A

LotZielseite

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23
Q

Cold solder joint

A

Kalte Lo:tstelle

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24
Q

Electrical isolation distance

A

Elektrischer Isolationsabstand

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25
Q

High voltage

A

Hochspannung

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26
Q

dealloying

A

Ablegieren

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27
Q

meniscus (component)

A

Meniskus (Bauteil)

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28
Q

Nonfunctional pad

A

Nichtfunktionale Anschlussfla:che

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29
Q

cable diameter

A

Leitungsdurchmesser

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30
Q

wire overwrap

A

Drahtu:berwicklung

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31
Q

Wire overlap

A

Drahtu:berlappung

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32
Q

Examples and Illustrations

A

Beispiele und Illustrationen

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33
Q

Inspection Methods

A

Inspektionsmethoden

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34
Q

Examining the dimensions

A

u:berpru:fung der Abmessungen

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35
Q

magnification aids

A

Vergro:SSerungshilfen

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36
Q

Lighting

A

Beleuchtung

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37
Q

Applicable Documents

A

Anwendbare Dokumente

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38
Q

EOS / ESD Association documents

A

EOS/ESD Association Dokumente

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39
Q

Electronics Industries Alliance documents

A

Electronics Industries Alliance Dokumente

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40
Q

Technical Publications

A

Technische Vero:ffentlichungen

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41
Q

Handling Electronic Assemblies

A

Handhabung elektronischer Baugruppen

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42
Q

EOS / ESD prevention

A

EOS/ESDVorbeugung

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43
Q

Electrical overload (EOS)

A

Elektrische u:berlast (EOS)

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44
Q

Electrostatic Discharge (ESD)

A

Elektrostatische Entladung (ESD)

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45
Q

Warning signs

A

Warnkennzeichen

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46
Q

Protection materials

A

Schutzmaterialien

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47
Q

EOS / ESD safe work / EPA

A

EOS/ESDsichere Arbeitspla:tze/EPA

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48
Q

Handling

A

Handhabung

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49
Q

Guidelines

A

Richtlinien

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50
Q

Physical damage

A

Physische Bescha:digung

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51
Q

Pollution / contamination

A

Verunreinigung/Kontamination

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52
Q

Electronic components

A

Elektronische Baugruppen

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53
Q

After soldering

A

Nach dem Lo:ten

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54
Q

Gloves and Finger Cots

A

Handschuhe und Fingerlinge

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55
Q

Assembly and Fasteners

A

Montage und Befestigungsteile

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56
Q

Installation of assembly and mounting hardware

A

Einbau von Montage und Befestigungsteilen

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57
Q

impairments

A

Beeintra:chtigungen

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58
Q

heatsink

A

Ku:hlko:rper

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59
Q

insulator and thermal grease

A

Isolierko:rper und Wa:rmeleitpaste

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60
Q

Contact surface

A

Kontaktfla:che

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61
Q

bolted

A

Schraubverbindungen

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62
Q

Torque

A

Drehmoment

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63
Q

wires

A

Dra:hte

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64
Q

threaded stud mounting

A

GewindebolzenMontage

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65
Q

Contents

A

Inhaltsverzeichnis

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66
Q

connector contacts

A

SteckverbinderKontakte

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67
Q

Contacts for direct plugsocket connectors

A

Kontakte fu:r DirektsteckerBuchsenleisten

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68
Q

pressfit contacts

A

EinpressKontakte

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69
Q

soldering

A

Lo:ten

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70
Q

harness fuse

A

Kabelbaumsicherung

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71
Q

General

A

Allgemeines

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72
Q

cable lacing

A

Kabelverschnu:rung

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73
Q

Kabelverschnu:rung Damage

A

Kabelverschnu:rung Bescha:digung

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74
Q

cable guide

A

Kabelfu:hrung

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75
Q

line crossings

A

Leitungskreuzungen

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76
Q

Bending radii

A

Biegeradien

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77
Q

Coaxial

A

Koaxialkabel

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78
Q

Termination of unused cable

A

Abschluss nicht verwendeter Kabel

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79
Q

binding sites on splicing and sleeves

A

Bindestellen u:ber SpleiSSen und Hu:lsen

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80
Q

solder joints

A

Lo:tstellen

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81
Q

Acceptance criteria for solder joints

A

Abnahmekriterien fu:r Lo:tstellen

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82
Q

Lo:tstellenanomalien

A

Lo:tstellenanomalien

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83
Q

Exposed base metal

A

Freiliegendes Basismetall

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84
Q

pinholes / blowholes

A

Nadello:cher/Blaslo:cher

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85
Q

Reflow solder paste

A

Reflow der Lotpaste

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86
Q

Nonwetting

A

Nichtbenetzung

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87
Q

Cold solder joint / rosin solder connection

A

Kalte Lo:tstelle/KolophoniumLo:tverbindung

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88
Q

dewetting

A

Entnetzung

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89
Q

cracks in the solder

A

Risse im Lot

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90
Q

icicles

A

Lotzapfen

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91
Q

Withdrawn solder joint (fillet lifting) at

A

Abgehobene Lo:tstelle (Fillet Lifting)bei

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92
Q

leadfree solder

A

bleifreiem Lot

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93
Q

shrinkage cracks / voids in leadfree solder

A

Schrumpfriss/Lunker bei bleifreiem Lot

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94
Q

test needle marks and other similar

A

TestnadelAbdru:cke und andere a:hnliche

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95
Q

Surface Structures of solder joints

A

Oberfla:chenstrukturen bei Lo:tstellen

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96
Q

Connections

A

Anschlu:sse

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97
Q

rivet joint

A

Nietverbindungen

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98
Q

terminal base gap to the connection face

A

AnschlussBasis Spalt zur Anschlussfla:che

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99
Q

Connections Turmlo:tstu:tzpunkt

A

Anschlu:sse Turmlo:tstu:tzpunkt

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100
Q

Connections Gabello:tstu:tzpunkt

A

Anschlu:sse Gabello:tstu:tzpunkt

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101
Q

flared flange

A

Bo:rdelflansch

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102
Q

Spreizflansch

A

Spreizflansch

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103
Q

Defined columns

A

Definierte Spalten

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104
Q

Soldered

A

Verlo:tet

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105
Q

Isolation

A

Isolierung

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106
Q

Insulation damage

A

Isolierung Bescha:digungen

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107
Q

Insulation damage Before soldering

A

Isolierung Bescha:digung Vor dem Lo:ten

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108
Q

Insulation damage After

A

Isolierung Bescha:digung Nach

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109
Q

Isolation distance

A

Isolationsabstand

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110
Q

Insulation Flexible Conduit

A

Isolierung Flexibler Schutzschlauch

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111
Q

Mounting

A

Montage

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112
Q

Damage

A

Bescha:digungen

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113
Q

lines

A

Leitungen

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114
Q

Lines deformations

A

Leitungen Verformungen

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115
Q

Line Damage of individual wires

A

Leitung Bescha:digung von Einzeldra:hten

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116
Q

Single linespreading After

A

EinzelleitungAufspreizung Nach

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117
Q

Lead tin

A

Leitung Verzinnung

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118
Q

Service loops

A

Serviceschleifen

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119
Q

relief

A

entlastung

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120
Q

Cable bundle

A

Kabelbu:ndel

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121
Q

Ports Component connection /

A

Anschlu:sse Bauteilanschluss/

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122
Q

Wire positioning General

A

DrahtPositionierung Allgemeine

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123
Q

Requirements

A

Anforderungen

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124
Q

connectors solder General

A

Anschlu:sse Lo:tstellen Allgemeine

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125
Q

Connections Turmlo:tstu:tzpunkt and

A

Anschlu:sse Turmlo:tstu:tzpunkt und

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126
Q

straight pin

A

gerader Stift

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127
Q

component connection / wire positioning

A

Bauteilanschluss/DrahtPositionierung

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128
Q

component connection / wire positioning

A

Bauteilanschluss/DrahtPositionierung

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129
Q

Side feed

A

Seitliche Zufu:hrung

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130
Q

Feeding from above or below

A

Zufu:hrung von oben oder unten

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131
Q

Pinned wires

A

Fixierte Dra:hte

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132
Q

Connections Slotted

A

Anschlu:sse Geschlitzt

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133
Q

Table of Contents (continued)

A

Inhaltsverzeichnis (Fortsetzung)

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134
Q

Connections Stamped / Punched

A

Anschlu:sse Gestanzt/Gelocht

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135
Q

Connections hook connections

A

Anschlu:sse Hakenanschlu:sse

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136
Q

Connectors threaded coupler

A

Anschlu:sse Lo:thu:lse

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137
Q

Connections wires with AWG

A

Anschlu:sse Dra:hte mit AWG

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138
Q

or thinner

A

oder du:nner

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Perfectly
139
Q

Connections connected serial

A

Anschlu:sse Seriell verbunden

140
Q

Connections Edge Clips Position

A

Anschlu:sse Kantenclips Position

141
Q

through mounting technology

A

DurchsteckmontageTechnologie

142
Q

component mounting

A

Bauteilmontage

143
Q

Vertical

144
Q

Connection shaping

A

Anschlussformung

145
Q

Turn

146
Q

Voltage / trainrelief

A

Spannungs/Zug entlastung

147
Q

damage

A

Bescha:digungen

148
Q

Connections cross circuit traces

A

Anschlu:sse kreuzen Leiterbahnen

149
Q

obstruction of Lotdurchstiegs

A

Behinderung des Lotdurchstiegs

150
Q

DIP / SIP components and sockets

A

DIP/SIPBauteile und Sockel

151
Q

Radial Connections Vertical

A

Radiale Anschlu:sse Vertikal

152
Q

spacer

A

Abstandshalter

153
Q

Radial ports Horizontal

A

Radiale Anschlu:sse Horizontal

154
Q

Connector

A

Steckverbinder

155
Q

Right Angle

A

Rechter Winkel

156
Q

Straight male with collar and straight

A

Gerade Stiftstecker mit Kragen und gerade

157
Q

Female Connector

A

BuchsenSteckverbinder

158
Q

Performance Components

A

Leistungsbauteile

159
Q

Conductive housing

A

Leitfa:hige Geha:use

160
Q

component backup

A

Bauteilsicherung

161
Q

Mounting Clips

A

Montageclips

162
Q

Bonding

163
Q

Bonding Not highmounted components

A

Kleben Nicht hochgesetzte Bauteile

164
Q

Bonding Highlevel components

A

Kleben Hochgesetzte Bauteile

165
Q

Wiredown device

A

Drahtniederhalter

166
Q

Platedholes

A

Durchmetallisierte Lo:cher

167
Q

Axial wire leads Horizontal

A

Axiale Drahtanschlu:sse Horizontal

168
Q

Axial wire leads Vertical

A

Axiale Drahtanschlu:sse Vertikal

169
Q

Wire residual length

A

Drahtrestla:nge

170
Q

Drahtumbiegung

A

Drahtumbiegung

171
Q

Vertical filling (hole filling)

A

Vertikale Fu:llung (Lotdurchstieg)

172
Q

primary side Lead Wiresleeve

A

Prima:rseite AnschlussdrahtHu:lse

173
Q

primary side restring cover

A

Prima:rseite Restringbedeckung

174
Q

secondary Lead Wiresleeve

A

Sekunda:rseite AnschlussdrahtHu:lse

175
Q

secondary restring cover

A

Sekunda:rseite Restringbedeckung

176
Q

Lo:tstellenzustand solder in the wire bending

A

Lo:tstellenzustand Lot in der Drahtbiegung

177
Q

Lo:tstellenzustand Lot touches the

A

Lo:tstellenzustand Lot beru:hrt den

178
Q

Component body

A

Bauteilko:rper

179
Q

Lo:tstellenzustand component Lackhose

A

Lo:tstellenzustand BauteilLackhose

180
Q

Reduction of wire length remaining after

A

Ku:rzung der Drahtrestla:nge nach

181
Q

Isolation of coated wires in Lot

A

Isolierung beschichteter Dra:hte im Lot

182
Q

connecting holes without connections (vias)

A

Verbindungslo:cher ohne Anschlu:sse (Vias)

183
Q

PCB to PCB

A

Leiterplatte auf Leiterplatte

184
Q

Nonmetallized holes

A

Nichtmetallisierte Lo:cher

185
Q

jumpers

A

Drahtbru:cken

186
Q

Wire selection

A

Drahtauswahl

187
Q

wire transfer

A

Drahtverlegung

188
Q

Wire Fixing with glue

A

Drahtbefestigung mittels Kleber

189
Q

Connections in the hole

A

Anschlu:sse im Loch

190
Q

Wrapped attachment

A

Umwickelte Befestigung

191
Q

Overlapping

A

u:berlappung

192
Q

Surface Mount Assemblies

A

Oberfla:chenmontierte Baugruppen

193
Q

Fixing adhesive

A

Fixierungskleber

194
Q

fixing adhesive adhesive mounting

A

Fixierungskleber Klebebefestigung

195
Q

the component

A

des Bauteils

196
Q

Fixing Adhesive Mechanical safety

A

Fixierungskleber Mechanische Sicherung

197
Q

SMT leads

A

SMT Anschlussdra:hte

198
Q

surface pressure

A

Flachpressung

199
Q

SMT solder joints

A

SMT Lo:tverbindungen

200
Q

Chip Components Subpage connectors

A

ChipBauteile Nur Unterseitenanschlu:sse

201
Q

side overhang

A

Seitenu:berhang

202
Q

Endu:berhang

A

Endu:berhang

203
Q

Width at the end of the solder joint

A

Breite am Ende der Lo:tstelle

204
Q

Length of the solder joint on the D)

A

La:nge der Lo:tstelle an der D)

205
Q

Maximum height of the solder joint

A

Maximale Ho:he der Lo:tstelle

206
Q

Minimum height of the solder joint

A

Minimale Ho:he der Lo:tstelle

207
Q

Lotspaltdicke

A

Lotspaltdicke

208
Q

end laps

A

Endu:berlappung

209
Q

Chip Components with rectangular or

A

ChipBauteile mit rechteckigen oder

210
Q

square end faces Connections

A

quadratischen Endfla:chen Anschlu:sse

211
Q

width of the solder joint on the end face

A

Breite der Lo:tstelle an der Stirnfla:che

212
Q

Connection options

A

Anschlussvarianten

213
Q

Assembly in lateral position (Bill boarding)

A

Montage in Seitenlage (Billboarding)

214
Q

Mounting supine

A

Montage in Ru:ckenlage

215
Q

Stacked components

A

Gestapelte Bauteile

216
Q

grave stone effect (tombstoning)

A

Grabsteineffekt (Tombstoning)

217
Q

connections

A

Anschlu:sse

218
Q

ports Minimum height

A

Anschlu:sse Minimale Ho:he

219
Q

the solder joint

A

der Lo:tstelle

220
Q

Cylindrical end caps connectors

A

Zylindrische EndkappenAnschlu:sse

221
Q

connection surfaces in recesses

A

Anschlussfla:chen in Einbuchtungen

222
Q

Minimum width of the solder joint

A

Minimale Breite der Lo:tstelle

223
Q

Minimum length of the solder joint

A

Minimale La:nge der Lo:tstelle an

224
Q

Flat Gullwing ports

A

Flache GullwingAnschlu:sse

225
Q

tip overhang

A

Spitzenu:berhang

226
Q

Minimum width at the end of the solder joint

A

Minimale Breite am Ende der Lo:tstelle

227
Q

Minimum length of the solder joint at the

A

Minimale La:nge der Lo:tstelle an der

228
Q

Maximum height of the solder joint

A

Maximale Ho:he der Lo:tstelle an

229
Q

Minimum height of the solder joint at the

A

Minimale Ho:he der Lo:tstelle an der

230
Q

coplanarity

A

Koplanarita:t

231
Q

Round or flattened (coined)

A

Runde oder abgeflachte (gepra:gte)

232
Q

Gullwing ports

A

GullwingAnschlu:sse

233
Q

Minimum width of the solder joint at the end

A

Minimale Breite der Lo:tstelle am Ende

234
Q

Maximum height of the solder joint at the

A

Maximale Ho:he der Lo:tstelle an der

235
Q

“J” connectors

A

“J“Anschlu:sse

236
Q

Width of the solder joint at the end

A

Breite der Lo:tstelle am Ende

237
Q

StoSSlo:tstellen / I connectors

A

StoSSlo:tstellen/IAnschlu:sse

238
Q

Maximum side overhang

A

Maximaler Seitenu:berhang

239
Q

Flat solder tail connectors

A

Flache Lo:tfahnenAnschlu:sse

240
Q

High components with connections only

A

Hohe Bauteile mit Anschlu:ssen nur

241
Q

on the bottom

A

auf der Unterseite

242
Q

Band connections

A

BandAnschlu:sse

243
Q

The surfacemount components with surface

A

Oberfla:chenmontierte Bauteile mit fla:chig

244
Q

terminals arranged

A

angeordneten Anschlu:ssen

245
Q

orientation

A

Ausrichtung

246
Q

Lotkugelabstand

A

Lotkugelabstand

247
Q

pores

248
Q

underfill / fix

A

Unterfu:llung/Fixierung

249
Q

cabinet stack (Package on Package)

A

Geha:usestapel (PackageonPackage)

250
Q

Components with Bottom

A

Bauteile mit Unterseiten

251
Q

Connections (BTC)

A

Anschlu:ssen (BTC)

252
Q

Components with Bottom connections

A

Bauteile mit UnterseitenAnschlu:ssen

253
Q

to heat sinks

A

an Wa:rmesenken

254
Q

Connections with flattened pins

A

Verbindungen mit abgeflachten Stiften

255
Q

Maximum connection overhang

A

Maximaler Anschlussu:berhang

256
Q

Square solder pad

A

Quadratische Lo:tAnschlussfla:che

257
Q

Round solder pad

A

Runde Lo:tAnschlussfla:che

258
Q

Maximum height of the solder joint

A

Maximale Ho:he der Lo:tstelle

259
Q

Special SMT Connectors

A

Spezielle SMTAnschlu:sse

260
Q

Connectors for Surface Mount

A

Steckverbinder fu:r Oberfla:chenmontage

261
Q

Jumpers SMT

A

Drahtbru:cken SMT

262
Q

Chip Components and components with

A

ChipBauteile und Bauteile mit

263
Q

cylindrical end caps

A

zylindrischen Endkappen

264
Q

“J” shaped connections

A

“J“fo:rmige Anschlu:sse

265
Q

indentations

A

Einbuchtungen

266
Q

PCB connection surface

A

LeiterplattenAnschlussfla:che

267
Q

component damage

A

Bauteilbescha:digungen

268
Q

Loss of metallization

A

Verlust der Metallisierung

269
Q

Chip Resistor Resistor Element

A

Chipwiderstand Widerstandselement

270
Q

Components with / without connecting legs

A

Bauteile mit/ohne Anschlussbeine

271
Q

Ceramic chip capacitors

A

Keramische Chipkondensatoren

272
Q

Relay

273
Q

Damage to transformer cores

A

Bescha:digungen an Transformatorenkernen

274
Q

connectors.. handles.. pull lever..

A

Steckverbinder.. Griffe.. Auszugshebel..

275
Q

Locks

A

Verriegelungen

276
Q

contacts in direct malefemale connectors

A

Kontakte in DirektsteckerBuchsenleisten

277
Q

pressin pins

A

EinpressSteckerstifte

278
Q

connector pins in

A

Steckerstifte in

279
Q

Rear wall wiring plates

A

Ru:ckwandverdrahtungsplatten

280
Q

(Backplane)

A

(Backplane)

281
Q

circuit boards and assemblies

A

Leiterplatten und Baugruppen

282
Q

Areas goldplated contact surfaces

A

Bereiche vergoldeter Kontaktoberfla:chen

283
Q

laminate spacing

A

Laminatzusta:nde

284
Q

staining and tissue disruption

A

Fleckenbildung und Gewebezerru:ttung

285
Q

blistering and delamination

A

Blasenbildung und Delaminierung

286
Q

Surface tissue structure /

A

Oberfla:chenGewebestruktur/

287
Q

Fabric outlet

A

Gewebeaustritt

288
Q

haloing and edge delamination

A

Hofbildung und Kantendelaminierung

289
Q

burns

A

Verbrennungen

290
Q

Bow and Twist

A

Wo:lbung und Verwindung

291
Q

Separation

A

Vereinzelung

292
Q

Traces / connection surfaces

A

Leiterbahnen/Anschlussfla:chen

293
Q

reducing the crosssectional area

A

Reduzierung der Querschnittsfla:che

294
Q

Lifted Pads / connection surfaces

A

Abgehobene Pads/Anschlussfla:chen

295
Q

Mechanical damage

A

Mechanische Bescha:digungen

296
Q

Flexible and rigidflexible PCB

A

Flexible und Starrflexible Leiterplatten

297
Q

delamination

A

Delaminierung

298
Q

discoloration

A

Verfa:rbung

299
Q

Creepage

A

Lotunterwanderung

300
Q

solder mounting

A

Lo:tmontage

301
Q

Labelling

A

Kennzeichnung

302
Q

Etched (Including hand print)

A

Gea:tzt (EinschlieSSlich Handdruck)

303
Q

Screen Printing

304
Q

stamp printing

A

Stempeldruck

305
Q

Laser

306
Q

labels

307
Q

Barcode

308
Q

readability

A

Lesbarkeit

309
Q

adhesion and damage

A

Haftvermo:gen und Bescha:digung

310
Q

Position

311
Q

use of.. means of radio signals

A

Verwendung von.. mittels Funksignalen

312
Q

readable.. labels (RFID transponder)

A

lesbarer.. Kennzeichnungen (RFIDTransponder)

313
Q

purity

314
Q

flux residues

A

Flussmittelru:cksta:nde

315
Q

foreign particles

A

Fremdpartikel

316
Q

chlorides.. carbonates and white

A

Chloride.. Carbonate und weiSSe

317
Q

Residues

A

Ru:cksta:nde

318
Q

flux residues Process

A

Flussmittelru:cksta:nde Prozess

319
Q

without cleaning (noclean)

A

ohne Reinigung (NoClean)

320
Q

Manifestations

A

Erscheinungsformen

321
Q

Surface corrosion

A

Oberfla:chenKorrosionserscheinungen

322
Q

soldermasks

A

Lo:tstoppmasken

323
Q

wrinkling / cracking

A

Faltenbildung/Rissbildung

324
Q

voids.. bubbles.. scratches

A

Fehlstellen.. Blasen.. Kratzer

325
Q

Protective Coatings

A

Schutzbeschichtungen

326
Q

cover

327
Q

thickness

328
Q

Grouting

329
Q

single wiring

A

Einzelverdrahtungen

330
Q

Solderless wrap connection

A

Lo:tfreie Wickelverbindung

331
Q

turns

A

Windungszahl

332
Q

winding distance

A

Windungsabstand

333
Q

winding outlet.. winding insulation

A

Wicklungsauslauf.. Wicklung mit Isolierung

334
Q

overlaps by aloof

A

u:berlappungen durch abgehobene

335
Q

Turns

336
Q

Arrangement of connections

A

Anordnung der Verbindungen

337
Q

wire feed

A

Drahtzufu:hrung

338
Q

line game

A

Leitungsspiel

339
Q

wire metallization

A

Drahtmetallisierung

340
Q

damage to the insulation

A

Bescha:digungen an der Isolierung

341
Q

damage to wire and

A

Bescha:digungen an Draht und

342
Q

Connector post

A

Anschlusspfosten

343
Q

Component assembly Voltage / train

A

Bauteilmontage Spannungs/Zug

344
Q

to connectors

A

zu Steckverbindern

345
Q

Heel

346
Q

component lead

A

Bauteilanschluss

347
Q

wire forming

A

Drahtformung

Engineering (13 decks)

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