Intro to Lithography Flashcards
Lithography
Transforms complex circuit diagrams into pattern w/c are defined on the wafer in a succession of exposure and processing steps to form a number of superimposed layers of insulator, conductor and semiconductors materials
How many lithography steps are required to fabricate a packed IC?
typically 8-25 steps
semiconductor manufacturing processes
design, wafer prep, front-ed processes, photolithography, etch cleaning, thin films, ion implantation, planarization, test and assembly
Die cut and assembly
good chips are attached to a lead frame package
soft lithography
uses photolithography to make a mold for PDMS (polydimethylsiloxane), w/c gets permanently bonded onto glass to make a microfluidic device; fast and cheap prototyping method
2 types of lithography
photolitography and soft lithography
type of lithography that makes a mold on a silicon wafer using UV light to etch a design
photolithography
type of lithography that uses the mold to make a chip from PDMS polymer
soft lithography
a unique comb. of properties resulting from the presence of an inorganic siloxane backbone and organic methyl groups attached to silicon
PDMS (Poly(dimethylsiloxane))
why are PDMS fluids iat room temp?
b/c they have very low galss transition
how can PDMS be readily converted into solid elastomers?
by crosslinking
Properties/Benefits of PDMS
- Optical: transparent, optical detection from 240-1100 nm
- Electrical: insulating, breakdown voltage (2x10^7 V/m); allows embedded surfaces, intentional breakdown to open connections
- Mechanical: elastomeric, high youngs module (-70 kPa); conforms to surface when not polymerized, reversible deformation
- Thermal: insulating, thermal conductivity of 0.2 W/(mk); can be used to insulate heated solutions
PDMS device applications
configurable gradient generator, valving via electrical breakdown of PDMS, cell patterning through surface modifications
Design saved in a DXF file format and sent to the printing company
SolidWorks Design
Fabrication of the mold (Photolitography) steps
- clean silicon wafer and dry
- spincoat a thin layer of SU-8 pthotoresist
- soft bake to evaporate the solvent
- align the mask
- flood exposure to UV light
- hard bake to cross-link the exposed portions of the photoresist film
- develop to wash away the non-exposed area of the photoresist
- rinse with isopropanol and dry with nitrogen gun