Toho Technology Flashcards
Scan Range
Programmable up to 200mm
Measurement Range
1 to 4,000MPa (For oxide filler on Si wafer)
Repeatability
1.3MPa
Accuracy
Less than 2.5% or 1MPa
Minimum Radius
2.0m
Maximum Radius
33km
Wafer Sizes (mm)
25mm, 50mm, 75mm, 100mm, 125mm, 150mm, 200mm
Minimum Scan Step
0.02mm
What wave length are the lasers?
670nm / 780 nm
What is the laser power rating?
4mW
Heating rates
up to 25˚c per minute
What does the cooling unit use?
LN2
What does WinFLX recalculate?
Automatic recalculation of stress when film or substrate thickness is corrected
What is dual wavelength technology?
Enables the system to select the wavelength most suitable for challenging films such as silicon nitride
Name 5 data analyst features of WinFLX
1) Biaxial modulus of elasticity
2) Linear expansion coefficient
3) File subtraction
4) Trend plotting
5) Calculation of water diffusion coefficient in dielectric film
Name at least 4 stress related problems
1) Aluminum stress-induced void
2) Passivation cracking (nitride oxide)
3) Stress-induced dislocations in Si
4) Tungsten Silicide cracking
5) Stress increase in oxides during temperature cycling
6) Matching metallization expansion on GaAs
7) Si cracking due to high film stress
What wafer sizes can be measured?
50mm (optional), 75 mm,
100mm, 125mm, 150mm, and
200mm
Maximum Points per scan?
1250
Weight of the system? (kg & lbs.)
45.5kg & 100lbs.
Scan range for the 4 systems
FLX-2320-S: 200mm
FLX-2320-R: 200mm
FLX-3300-T: 300mm
FLX-3300-R: 300mm
Which systems have automatic 3-D mapping?
FLX-2320-R and FLX-3300-R
Which systems have manual 3-D mapping?
FLX-2320-S and FLX-3300-T
What are the sample sizes of the systems?
FLX-2320-S: 75-200mmØ FLX-2320-R: 75-200mmØ
FLX-3300-T: 150mmØ, 200mmØ, 300mmØ
FLX-3300-R: 150mmØ, 200mmØ, 300mmØ