E-MOSFET Flashcards

1
Q

E-MOSFET

A

Enhancement Mode - Metal Oxide
Semiconductor Field Effect Transistor

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2
Q

A ____________ is used as the foundation on which the device is constructed.

N-Channel E-MOSFET Construction

A

p-type substrate

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3
Q

The ________ and ________ terminals are connected through metallic contacts to n-doped regions.

N-Channel E-MOSFET Construction

A

Drain (D) and Source (S)

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4
Q

The ________________ between two n-doped regions is the primary difference between depletion and enhancement type MOSFET.

N-Channel E-MOSFET Construction

A

absence of channel

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5
Q

The ________ isolate the gate from the region between the source and drain.

N-Channel E-MOSFET Construction

A

SiO2 layer

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6
Q

when VGS=0V and VDS=0, the absence of channel between drain and source will result in __________.

N-Channel E-MOSFET Construction (Basic Operation)

A

zero current

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7
Q

when VGS=0 and VDS is some positive voltage, there exist ____________ biased junction between the n-doped regions and p-substrate and absence of channel between source and drain which cause zero current to flow.

N-Channel E-MOSFET Construction (Basic Operation)

A

two reversed

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8
Q

Thus, when VGS=0 and voltage VDS is applied across drain to source terminals, the absence of channel will result in ________________ as against the ________________ where ID=IDSS when VGS=0.

N-Channel E-MOSFET Construction (Basic Operation)

A

zero drain current, depletion type MOSFET

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9
Q

When VGS and VDS are set to some positive voltages, then the positive potential get established at ________ and the ________ with respect to the ________.

N-Channel E-MOSFET Construction (Basic Operation)

A

drain, gate, source

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10
Q

The positive potential at gate will repel the holes in ____________ along the edge of the SiO2 layer however the electrons which is ____________ in p-substrate will be attracted to the ________________ and get accumulated in the region near the surface of the SiO2 layer.

N-Channel E-MOSFET Construction (Basic Operation)

A

p-type substrate, minority carrier, positive gate

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11
Q

The insulating SiO2 layer prevent the electrons being _________________________.

N-Channel E-MOSFET Construction (Basic Operation)

A

absorbed by positive gate

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12
Q

As VGS increases, the concentration of___________ increases such that a channel is induced between drain and source which allow flow of electrons from drain to source hence the flow of ____________.

N-Channel E-MOSFET Construction (Basic Operation)

A

electrons, drain current

N-Channel E-MOSFET Construction (Basic Operation)

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13
Q

The level of VGS that starts flow of current is called ____________ VGS(th) ot VT. For N-type MOSFET it is referred to _______

A

threshold voltage, VTN

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14
Q

Since the channel is not in existent with VGS=0 and enhance by the application of positive VGS, this type of MOSFET is called an __________________.

N-Channel E-MOSFET Construction (Basic Operation)

A

enhancement mode MOSFET

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15
Q

Both the depletion and enhancement type MOSFETs have ________________.

N-Channel E-MOSFET Construction (Basic Operation)

A

enhancement region

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16
Q

The depletion type MOSFETs can operate in both depletion and enhancement regions whereas enhancement type MOSFET can only operate in ___________________.

N-Channel E-MOSFET Construction (Basic Operation)

A

enhancement regions

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17
Q

With a fixed VDS drain-source voltage connected across the ________, we can plot the values of drain current, ID with varying values of VGS to obtain a graph of the MOSFET’s forward DC characteristics. These characteristics give the ____________________, gm of the transistor.

N-channel E-MOSFET I-V Characteristics

A

E-MOSFET, transconductance

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18
Q

when VGS>VTN, application of a small VDS causes a current ID to flow through an ________________ which increases with increase in _____.

N-Channel E-MOSFET Construction (Basic Operation: Applying a small VDS)

A

induced channel, VDS

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19
Q

An E-MOSFET with a small VDS is applied acts as a ____________ whose value is determined by _____.

N-Channel E-MOSFET Construction (Basic Operation: Applying a small VDS)

A

resistance, VGS

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20
Q

when VGS<VTN, ID=___, R=_______

N-Channel E-MOSFET Construction (Basic Operation: Applying a small VDS)

A

ID=0, R=infinity

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21
Q

When VGS>VTN, a ________ is induced causing flow of electrons, hence flow of ID, making R __________.

N-Channel E-MOSFET Construction (Basic Operation: Applying a small VDS)

A

channel, finite

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22
Q

as VGS increases, free electrons increases, drain current increases and ____ decreases.

N-Channel E-MOSFET Construction (Basic Operation: Applying a small VDS)

A

R

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23
Q

The dashed line between the source and drain in enhancement type MOSFET reflects that ____________ is physically constructed between source to drain. Channel get induced when _________.

Symbol of MOSFET

A

no channel, VGS>VT

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24
Q

This transconductance relates the output current to the input voltage representing the gain of the ____________. The slope of the transconductance curve at any point along it is therefore given as: ____________ for a constant value of VDS.

N-channel E-MOSFET I-V Characteristics

A

transistor, gm = ID/VGS

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25
When VGS>VTN, a ________ is induced and application of positive VDS cause ____________ to flow. ## Footnote N-Channel E-MOSFET Construction (Basic Operation)
channel, drain current
26
Now if you keep VGS fixed and VDS is increased, the drain terminal becomes more positive than ________. The charge carriers get attracted towards drain rather getting accumulated near SiO2 surface and hence the charge density in the channel towards drain decreases. Therefore, increase in "VDS" will ____________ the induced channel towards drain but the "high potential" at drain attract increased number of charge carriers to flow through ______________. ## Footnote N-Channel E-MOSFET Construction (Basic Operation)
gate, narrow down, narrow channel
27
with further increase in VDS, the drain current will eventually reach to a ________________ that occurs due to ________ process depicted by the narrower channel. ## Footnote N-Channel E-MOSFET Construction (Basic Operation)
saturation level, pinch-off
28
Increase in VGS will cause the pinch-off to occur at higher value of ____ than the earlier. ## Footnote N-Channel E-MOSFET Construction (Basic Operation)
VDS
29
Thus higher the VGS, higher is the current flow and higher is the value of VDS that cause ________________ condition. ## Footnote N-Channel E-MOSFET Construction (Basic Operation)
pinch-off or saturation
30
The saturation value of VDS is given by _____________ ## Footnote N-Channel E-MOSFET Construction (Basic Operation)
VDsat = VGS - VT
31
If VGS < VT, the drain current ID = ____ and the MOSFET is said to be in __________ ## Footnote N-Channel E-MOSFET Construction (Basic Operation)
ID=0, cutoff region
32
for VGS > VT and VDS <= VGS-VT, the MOSFET operate in _______________ or _______________ ## Footnote N-Channel E-MOSFET Construction (Basic Operation)
non-saturation or triode region
33
for VGS >VT and VDS >= VGS-VT, the MOSFET operate in __________ or _______________ ## Footnote N-Channel E-MOSFET Construction (Basic Operation)
saturation, pinch-off region
34
when VGS > VTN and for a small values of VDS, a complete ________ from ________ to ________ is __________ ## Footnote N-Channel E-MOSFET Construction (Drain Characteristics Curve)
channel, drain to source, induced
35
____________ acts as a resistor whose value is determined by VGS ## Footnote N-Channel E-MOSFET Construction (Drain Characteristics Curve)
E-MOSFET
36
when VGS > VTN and VDS is larger value but VDS < _________ ## Footnote N-Channel E-MOSFET Construction (Drain Characteristics Curve)
VDS(sat)
37
the _______________charge density near the drain _____________ and hence the incremental conductance of the channel at the drain ____________, ## Footnote N-Channel E-MOSFET Construction (Drain Characteristics Curve)
induced inversion, decreases, decreases
38
when VGS > VTN and VDS = VDS(sat) , the ____________charge density at the drain terminal is _______ hence the incremental channel conductance at the drain is zero ## Footnote N-Channel E-MOSFET Construction (Drain Characteristics), po
induced inversion, zero
39
_____________ is at drain ## Footnote N-Channel E-MOSFET Construction (Drain Characteristics)
Pinch-off point
40
when VGS >VTN and VDS > VDS(sat), the ________ in the channel at which the inversion charge is zero moves toward the ____________ ## Footnote N-Channel E-MOSFET Construction (Drain Characteristics)
point, source terminal
41
The ________________________ is similar to the n-channel except that the voltage polarities and current directions are reversed. ## Footnote p-channel Enhancement-type MOSFET
p-channel Enhancement-type MOSFET
42
The ___________ operate in pinch-off/saturation region ## Footnote N-Channel E-MOSFET Construction (Drain Characteristics)
MOSFET
43
An essential step in the design of a MOSFET amplifier circuit is the establishment of an appropriate __________________. ## Footnote Biasing Circuits used for MOSFET
dc operating point
44
Biasing circuit ensures operation of MOSFET in the ______________ for all expected input-signal levels. ## Footnote Biasing Circuits used for MOSFET
saturation region
45
The operating point of the MOSFET is located at the coordinate (VDS, ID) on the ___________________. ## Footnote Biasing Circuits used for MOSFET
characteristic graph
46
A popular biasing arrangement for enhancement-type MOSFETS
Feedback Biasing
47
Here the large feedback resistance ___ forces the _________ at the gate to be equal to that at the drain (because IG = 0 ). Since IG = 0mA and VRG=0 V, the dc equivalent network appears as shown ## Footnote Feedback Biasing
RG, dc voltage
48
A direct connection now exists between _______ and ______ ## Footnote Feedback Biasing
drain and gate
49
Another popular biasing arrangement for enhancement-type MOSFETS
Voltage Divider Biasing
50
It is the ratio of change in the drain source voltage (Δ VDS ) to the change in drain current (ΔlD) at constant gate-source voltage. ## Footnote Parameters of E-MOSFET
AC drain resistance (rd)
51
It is the ratio of change in drain current (ΔlD) to the change in gate source voltage (ΔVGS). ## Footnote Parameters of E-MOSFET
Transconductance parameter (gm)
52
It is the ratio of change in drain-source voltage (ΔVDS) to the change in gate-source voltage (ΔVGS) . ## Footnote Parameters of E-MOSFET
Amplification Factor (µ)
53
The __________ behaves as a voltage- controlled current source. ## Footnote AC equivalent circuit of n channel E-MOSFET
MOSFET
54
It provides a drain current proportional to vgs. ## Footnote AC equivalent circuit of n channel E-MOSFET
E MOSFET
55
The input resistance is very high ideally infinite. ## Footnote AC equivalent circuit of n channel E-MOSFET
E-MOSFET
56
The output resistance is also high ## Footnote AC equivalent circuit of n channel E-MOSFET
E-MOSFET
57
Since rd is __________, it can be neglected from the ckt ## Footnote AC equivalent circuit of n channel E-MOSFET
very high
58
In the ______________, the MOSFET acts as a voltage-controlled current source: Changes in the ___________ voltage VGS causes changes in the _______ current ID. ## Footnote E-MOSFET as an Amplifier
saturation region, gate-to-source, drain
59
Thus the saturated MOSFET behaves as ________________ amplifier ## Footnote E-MOSFET as an Amplifier
trans-conductance
60
changes in vi causes changes in ID which in turn changes ____. ## Footnote E-MOSFET as an Amplifier
Vo
61
Thus, the trans-conductance amplifier is converted into a __________ amplifier. ## Footnote E-MOSFET as an Amplifier
voltage
62
Load line equation: ## Footnote Large signal Transfer Characteristic of MOSFET Circuit
Vo = VDS = VDD - (RD)(ID)
63
for vi < VTH the ____________ will be cut off, ID will be ______, and VO = VDS = VDD (point A). ## Footnote Large signal Transfer Characteristic of MOSFET Circuit
transistor, zero
64
As Vi exceeds VTH the transistor turns ____, ID ________, and VO __________. This corresponds to points along the segment of the load line from A to В. ## Footnote Large signal Transfer Characteristic of MOSFET Circuit
on, increases, decreases
65
_________________ operation continues until VO decreases below VDSsat ## Footnote Large signal Transfer Characteristic of MOSFET Circuit
Saturation-region
66
When VDS < VDSsat the MOSFET enters its ______________ ## Footnote Large signal Transfer Characteristic of MOSFET Circuit
triode region
67
For Vi > VIB, the transistor is driven deeper into the triode region and voltage decreases slowly towards ______. ## Footnote Large signal Transfer Characteristic of MOSFET Circuit
zero
68
When the MOSFET is used as a _________, it is operated at the extreme points of the _____________. ## Footnote MOSFET as a Switch
switch, transfer curve
69
The device is ____________ by keeping, V < VTH which provide VO = VDD ## Footnote MOSFET as a Switch
turned off
70
The switch is turned on by applying a voltage close to _____. Here, vo is ____________. ## Footnote MOSFET as a Switch
VDD, very small
71
For the FET to operate as a ______________, the transistor must be biased in the ___________ region, and the instantaneous drain current ID and drain-to-source voltage VDS must be confined to the ___________ region. ## Footnote E-MOSFET Common Source Amplifier
linear amplifier, saturation, saturation
72
The device is biased at a somewhere near to the middle of the curve. The voltage signal to be amplified vi is then ________________ on the dc bias voltage. ## Footnote E-MOSFET Common Source Amplifier
superimposed