Section 10 Flashcards
the interior water piping system of the building _______ be used as a telecommunications bonding backbone
Shall NOT
commercial building bonding and grounding requirements are found?
ANSI/J-STD-607-C
In Multi-floor facilities, the _____ is Installed on the First floor, top floor, and every third floor in between.
Backbone Bonding Conductor
which document would be referenced to properly install a mesh common bonding network in in a data center
ANSI/TIA 942
SBB
secondary bonding busbar
what is the minimum size of a bonding conductor
6AWG
for each telecommunications bonding conductor there shall be a _____ and is shall be located on the conductor as close as practical to the point of termination
Label
which element of a telecommunication grounding and bonding system would be located in the Entrance facilities and serves as the dedicated extension of the building grounding electrode system
Primary bonding busbar
PBB
Primary bonding busbar
the J-STD-607 standards states that you may need to increase the bonding conductor from NO.6 AWG to 750 KcMill. what circumstances would dictate this increase
Longer length
higher frequencies
Backbone bonding conductor definition
A conductor that interconnects the telecommunications bonding backbones within a building is a
how many primary bonding busbar should be installed per building?
one
in the entrance facility, the primary protectors for the inter-building cable shall be bonded to the
primary bonding busbar
TBC
telecommunications bonding conductor
DR Define
The Distribution Room (DR) is the critical point between the work area and the Equipment Room or main cross-connect, through backbone cabling (equipment room to TR) and horizontal distribution (TR to work area).
a busbar placed in a convenient and accessible location and bonded to the power service equipment room
Primary bonding busbar
A conductor that interconnects the telecommunications bonding backbones within a building is a
backbone bonding conductor
BBC
Backbone bonding conductor
what is the purpose of running the grounding equalizer between distribution rooms on the first floor, top floor, and every third floor in between?
to equalize potential differences
In Multi-floor facilities, the Backbone Bonding Conductor is Installed on the ______ floor, ____ floor, and ____ floor in between.
First floor, top floor, and every third floor
what is the maximum size for a bonding conductor
750KC Mill