Leggett - nanochemistry Flashcards

1
Q

What is the main problem for “nanobot” nanoparticles?

A

Brownian Motion - Very large forces acting on very small particles

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2
Q

Why can classic optical microscopy not be used for characterisation of nanoparticles?

A

Optical resolution limit.
Limit is approx. lambda/2 for the wavelength of light used.
Visible light is ca. 400-700 nm so resolution limit for optical microscopy is approx. 200nm

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3
Q

What must be taken into account when working at small length scales?

A
  • Surface effects become more dominant
  • Effects ignored at macro scale become important
  • High surface area to volume ratio of nps influence structures and reactivities
  • electrons may tunnel through thin insulators
  • optical properties change when particle size is smaller than the wavelength of light
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4
Q

Resolution limit formula

A

R = (0.61 lambda)/(n_r sin(alpha))
lambda = wavelength
n_r - refractive index of medium
n_rsin(alpha) = numerical aperture of lens

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5
Q

How does a scanning electron microscope work?

A

Electron gun fires electrons between a condenser lens (in a vacuum), this is focused by an objective lens through scan coils and through an aperture, onto the sample.
Electron beam interacts with the sample matter and electrons are scattered, leading to:
- Secondary electrons, with a yield of delta per primary electron (often delta > 1); mainly used for imaging
- Backscattered electrons, yield eta (often delta&raquo_space; eta)
- X-rays and Auger electrons
- Auger electron yield is small, but x-rays have energy characteristics of the element from which they are emitted –> use for elemental analysis

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6
Q

What advantages does TEM have over SEM

A

Thin samples may be analysed in transmission mode

  • Superior resolution
  • Higher acceleration voltage; 100-400 keV vs 1-30 keV for SEM
  • High voltages allow better resolution and deeper penetration
  • May obtain electron diffraction
  • Imaging contrast comes from mass contrast (thicker/more dense regions absorb more
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7
Q

Probability of tunnelling equation

A

T = A exp(-2kl)

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8
Q

How does TEM image a surface?

A

Large separation between tip and surface - little overlap
Small separation between tip and surface - effective overlap
This leads to current flow in external circuit
Tunnel current depends exponentially on the separation, decreasing by a factor of 10 for every 1A separation. –> basis of high resolution
Piezoelectric crystal detects very small movements
BUT sample must conduct electricity

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9
Q

How do you perform constant height TEM?

A

Hold tip at constant height
measure variation in tunnel current as surface is scanned
Image shows variation in tunnel current

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10
Q

How do you perform constant current TEM?

A
  • Measure instantaneous current
  • Adjust piezo-voltage to move tip until preset value of current is achieved
  • Image shows variation in v_z, approx. topography
  • Most widely used mode in practice
    Piezoelectric crystal is key to control of motion
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11
Q

Practical issues with TEM

A

Tip exerts mechanical load on sample:

  • Increases with i_t (current)
  • may be large at small gaps
  • May damage delicate materials
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12
Q

How is the TEM tip made?

A

(1) Mechanical - Cut Pt/Ir wire with wire cutters

(2) Electrochemical - Etch wire in caustic solution until end drops off to give a sharp tip

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13
Q

What problems can occur for the TEM tip?

A

Tip profile can become convoluted with the surface topography
Leads to self-imaging to give a regular, repeating geometric feature
Square or Double tip

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14
Q

How to use Scanning Tunnelling Microscopy for spectrosocpy

A

STm probes the Local Density Of States (LDOS) at the surface - i.e. the tunnel current depends on the surface electronic structure at high resolution and the electronic structure of the tip.
–> Changing the bias voltage changes electronic states involved in tunnelling

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15
Q

What is the basis of lithography and nanomanipulation?

A
Tip exerts a mechanical force
Problems: - sweeping of adsorbates
- Scratches inorganic materials
- Damage to tip
BUT can be exploited
Voltage pulse: +ve: field emission from sample to tip
-ve: redeposit atom
--> leads to mechanical sliding (but only occurs at 4K)
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16
Q

Describe the principles of Atomic Force Microscopy

A

Sharp tip attached to a flexible cantilever is rastered across a sample
As the interaction forces between the tip and surface changes, the deflection of the lever changes
Typically measured by deflecting a laser off the back of the cantilever onto a photodetector
–> No requirement for conductivity

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17
Q

Hooke’s law equation

A

F = -kx

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18
Q

AFM design criteria

A

Small spring constant (k) - large deflection for small F, but need a high resonant frequency to avoid noise
Need micro-engineered, high stiffness material
Use Si3N4 (contact mode) or Si (non-contact/tapping mode)
Measure deflection of laser beam from back face of cantilever
Usually have triangular cantilever and pyramidal tip

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19
Q

Lennard-Jones Potential

A

epsilon = 4E {(sigma/r)^12 - (sigma/r)^6}

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20
Q

Explain Contact mode AFM

A
  • Operate in the repulsive region
  • Tip in mechanical contact with sample
  • Sample deforms under loading
  • Cantilever bends upwards
  • Can use in air or liquid
  • Can use for all types of material
21
Q

Explain Constant Height contact mode AFM

A

Vary deflection - piezo height is fixed, only one end moves

22
Q

Explain constant force contact mode AFM

A

Move piezo in z-axis, constant set point –> both ends move

23
Q

Explain non-contact mode AFM

A

Very difficult in practice

  • Operates in the attractive region
  • Tip doesn’t touch sample
  • Cantilever bends down
  • -> Useful in ultrahigh vacuum for atomic resolution work
24
Q

Explain tapping mode AFM

A
  • Intermittent contact mode
  • High k Si tip
  • Tip oscillates close to resonant frequency
  • Tip makes contact, striking surface at end of downward part of cycle before being retracted
  • Eliminates frictional drag –> less sample damage
25
Q

Explain Lateral force microscopy

A

Measures lateral deflection of cantilever in contact mode

  • Deflection proportional to friction force
  • Taking forard and reverse measurements remove surface contour defects
26
Q

What is the Amonton’s Law equation

A

F = uL
F: Friction force
u: friction coeff.
L: Load applied perpendicular to surface

27
Q

How is Amonton’s law used for lateral force microsopy

A
Polar tip (Si3N4 covered in SiOH layer) and on a polar surface --> gives high u
on non-polar surface --> gives low u
- Maps variation in chemical structure
28
Q

Explain how a Force-Distance measurement is made

A
(A) Approach tip to sample
(B) Tip snaps to contact
(C) Push tip further in
(D) Withdraw tip
(E) Hysteresis Occurs
(F) Can measure pull-off force F_adh
29
Q

Explain how Mechanical force Microscopy works

A

Functionalise tip with a Self Assembled Monolayer
Allow tip to contact surface and then measure force required to break contact
–> like attracts like

30
Q

Explain the concept behind near-field nano-optical methods

A

Adaption of Scanning Probe Microscopy for optical measurements
Rayleigh criterion applies to propagating electromagnetic waves
BUT
Evanescent waves are non-propagating
–> decay rapidly with r
–> Does not diffract in near-field
PROBLEM: How to scan an aperture?
Even a 1 um dust particle would lift the screen and cause diffraction

31
Q

How is an optical fibre for nano-optical methods made?

A

(1) Glass core in sleeve
(2) Etch or heat/pull
(3) Deposit Al onto tip
- -> Al coating on tip; ca. 50 nm aperture

32
Q

How is near-field nano-optical microscopy used to image a surface?

A
  • Couple optical fibre to a laser
  • Attach fibre to a tuning fork
  • Interaction with surface leads to sheer force and damping
  • Feedback mechanism detects damping and lifts probe to restore set point
  • Light from probe excites sample
  • Far-field detection
33
Q

How does a MOS diode work?

A
Layered structure:
----------
Metal
----------
Oxide
---------
Semiconductor
----------
Metal
----------

Smal +ve voltage: Depletion
- Region near oxide has reduced number of holes
- Effectively increased separation of plates
Large +ve voltage: Inversion
- Depletion region grows no further
- Electrons collect at oxide-Si interface
Large -ve voltage: Accumulation
- Holes accumulate at Oxide-Si interface
Capacitance is solely due to the oxide

34
Q

What is MOSFET enhancement mode?

A

If no bias is appied, have two n-type regions separated by a p-type region (n-p-n junction)
At a gate voltage >V_T, inversion occurs
Electrons accumulate under the gate
Inversion layer connects source to the drain
Current increases with V_G until it saturates

35
Q

Explain MOSFET depletion mode

A

Permanent conductivity channel from source to drain

Application of a large enough voltage depletes channel by “pinching off” conduction

36
Q

Explain how to make a p-n junction by photolithography

A

(a) Bare n-type Si wafer
(b) Wet or dry oxidation of water gives SiO2 layer
(c) Apply photoresist by spin-coating
(d) Expose to UV light through mask (pattern of opaque & transparent regions, usually on Cr or Silica)
(e) Development of resist by exposure to solution of developer
(f) Etch oxide –> dry (plasma etch) for high fidelity work
- -> Wet (HF or NH4F to remove SiO2; KOH/isopropyl alcohol to etch Si)
(g) Final result after complete lithographic process –> patterned oxide layer; resist removed
(h) Metallisation
(i) Complete formation of a p-n junction

37
Q

What is a positive resist?

A
  • Exposure causes material to degrade and become soluble
  • Contain photosensitive compound, resin and organic solvent
  • Exposure causes structural modification, leading to solubility in developer solution
38
Q

What is a negative resist?

A
  • Exposure causes material to become cross-linked and insoluble in developer
  • Developer removes unexposed material
39
Q

Explain why a clean room is necessary

A

Dust particles can cause defects:

  • May disrupt crystal growth
  • May disrupt gate oxide –> enhanced conductivity –> electrical breakdown
  • May adhere to photomask –> extra opaque areas in exposure –> electrical defects in structures
  • -> Use clean room with controlled dust, humidity, and temperature
40
Q

Explain the classification of a clean room

A
A class n clean room contains n dust particles bigger than 500 nm per cubic foot
For most IC fabrications, a class 100 clean room is used.
For lithography - a class 10 or better is required
41
Q

What are the two exposure methods for p-n junction formation

A

(1) Contact - Mask is in contact with photoresist

(2) Proximity - Mask is 10-50 um from resist

42
Q

Problems for contact exposure method

A

Dust: May damage mask
Proximity overcomes this
Diffraction occurs at feature edges due to small gap, degrading solution

43
Q

Critical Dimension equation

A

CD = sqrt (lambda g)

lambda: wavelength
g: gap width

44
Q

Explain Projection Lithography

A

Developed to address problems with contact and proximity exposure
Involves lens between mask and wafer layer
Depth of Focus degrades ore rapidly by increasing the numerical aperture so tend towards shorter wavelength to improve resolution

45
Q

Resolution and depth of focus equations for projection lithography

A
r  = k_1 lambda/NA
DOF = k_2 lambda/(NA)^2
46
Q

What problems are associated with miniaturisation of devices

A

To maintain device performance and reduce size:

  • voltage must reduce
  • source and drain junctions become very shallow
  • oxide thickness must decrease linearly with gate length
  • High leakage powers lead to large change in temp.
  • Need new materials (dielectrics, interconnects)
  • Need new processes (thinner dielectrics)
  • New architectures
47
Q

MOSFET capacitance equation

A

C = (k epsilon_0 A)/t
C: capacitance
k: relative dielectric constant of dielectric material
epsilon_0: Permittivity of free space
A: Capacitor area
Dielectrics in a MOSFET can be modelled as a parallel plate capacitor with capacitance, C.

48
Q

Briefly describe a parallel plate capacitor

A

Two parallel charged plates separated by an insulator

49
Q

How to maintain MOSFET performance as size decreases

A

Increase C to drive current
t has decreased, but as t gets small, tunnelling increases –> increase k
Use high k dielectrics in place of thermally grown SiO2
- HfSiO4
- ZrSiO4
- HfO2
- ZrO2