Electronics

Question 1

What is an IC?

Answer 1

Integrated circuit. Multiple components compiled into a single chip.

Question 2

What is the base for IC’s

Answer 2

Silicon

Question 3

What is photolithography?

Answer 3

Using light to transfer complex patterns to a material, like a semiconductor

Question 4

What is Moore’s Law?

Answer 4

Approximately, every 2 years, you can fit twice the amount of transistors into the same space in an IC

Question 5

Why is Moore’s Law possibly ending?

Answer 5

Limits on how fine masks can be made using photolithography due to wavelengths of light. Quantum tunnelling.

Question 6

Ribbon bonding

Answer 6

High frequency devices

Question 7

Ball Bonding

Answer 7

Arc produces ball on end of wire, allows for multi-angular ball placement approach. its pushed down and ultrasonically welded. Can be lead to a lead frame or the substrate. Usually used with gold wires

Question 8

Wedge bonding

Answer 8

Substrates and lead frames. Aluminium wire. 3-10 loops per second

Question 9

TAB

Answer 9

Tape Automating Bonding. Uses flexible tape instead of lead frame. Interconnects are simultaneously attached to silicone chip.

Question 10

Flip Chip

Answer 10

Active area of chip is flipped over. Surface area of chip can be used for interconnection, typically done through metal bumps of solder. These bumps are soldered to the substrate or PCB and underfilled with epoxy. Greatly reduces inductance and impedance. Not necessary to protect chip with mould cap.