2. Photopolymer based additive processes

Question 1

Definition electro magnetic wave

Answer 1

E= Eo*sin(kz-wt)
Eo = amplitude
w= ang. frequency
k= wave number= w/c

Question 2

Formula for T and Lambda

Answer 2

T = 2pi/w
L= 2pi/k

Question 3

Stereolithography (SLA)

Answer 3

layer-by-layer photoresist, selectively consolidated

down-top vs. top down

Question 4

Dis/Advantages SLA

Answer 4

precise
transparent materials
can be used as master model

Limited to photoresist,
materials expensive, toxic and age

Question 5

Direct light processing (DLP)

Answer 5

photoresist

UV flash cures plain selectively (mirror)

Question 6

Dis/Advantages DLP

Answer 6

cheap, simple machines

less precise, smaller work surface, lower productivity

Question 7

Solid Ground Curing (SGC)

Answer 7

UV flash passing through a mask

Masks made by xerography (printing)

Question 8

Dis/Advantages SGC

Answer 8

simple cheap machine

poor accuracy

Question 9

Photopolymer jetting

Answer 9

placement of build and support material through nozzles, UV Lamp cures photoresist

Question 10

Advantages Polyjetting

Answer 10

cheap simple machines
precise
possibility of combining materials

Question 11

Wavelength and colours

Answer 11

400nm to 750

purple, blue, green, yellow, red

Question 12

Build speed of an additive process

Answer 12

volume/MCR+ height/e*Tlayer/N

Preparation time added
MCR: build speed in mm^3/s