Week 11 - Physical Acquisition - eMMC and UFS Memory

Question 1

What is eMMC?

Answer 1

embedded Multi Media Card

Uses non volatile NAND memory.It consists of a controller and memory chips packaged together and embedded onto the PCB,which simplifies the design and reduces cost compared to other memory technologies. Can’t be removed like micro SD cards.

Used on older and more budget devices.

• Evolution of MMC association specification
• Adopted by JEDEC for embedded applications
• Contains controller and NAND memory
• Integrated in BGA package but with a multi media card interface
• Developed for mobile devices / digital cameras and other portable electronic devices
• Has evolved over time - maintains backward capability

Question 2

What are the different BGA Package Types?

Answer 2

BGA Package Types:
* Ceramic Ball Grid Array (CBGA)
* Ceramic Column Grid Array (CCGA)
* Plastic Ball Grid Array (PBGA)
* Tape Ball Grid Array (TBGA)
* Low-Profile Ball Grid Array (LBGA)
* Thin-Profile Ball Grid Array (TBGA)
* Very-Thin-Profile Ball Grid Array (VBGA)

Question 3

What is UFS?

Answer 3

• Universal Flash Storage

Universal Flash Storage (UFS) is a high-performance storage technology used in modern mobile phones, tablets, and other electronic devices. It provides fast read and write speeds, which helps to improve the overall performance of the device. UFS has become the standard for storage in smartphones, replacing older technologies like eMMC (embedded MultiMediaCard), due to its superior speed, efficiency, and capabilities

• Simultaneous read/write
• Low-Voltage Differential Signalling (LVDS)
• Command Queue technology
• Significant read/write speed increase over eMMC
• Increased battery life and data transaction
  *Lower power consumption
• Faster boot time
  *Improved multitasking with apps opening and closing more smoothly
• UFS + RAM (UFS based Multi Chip package) (uMCP)