Section 2: CCDS & APS/CMOS Flashcards

1
Q

types of pixelated semiconductor devices used for digital imaging

A

CCDs
APS
CMOS (examples of APS)

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2
Q

CCDs readout image by

A

moving the stored charge across the image

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3
Q

both CCDs and APS are subject to

A

uneven response, thermal noise, hot pixels, electronic noise, cosmic ray hits…

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4
Q

CCDs/CMOS work via the

A

photoelectric effect in a semiconductor - electron energised by photon

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5
Q

semiconductors: in an isolated atom,the atomic energy levels are

A

well spaced out

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6
Q

semiconductors: in solids, atomic levels form

A

‘blended’ bands - the low energy bands are filled by electrons, up to fermi level

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7
Q

semiconductors: the last filled level is the

A

valence band

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8
Q

band gap

A

between valence and conduction bands

typically a few eV

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9
Q

for electrical conduction, electrons must be able to

A

move between energy levels (so the full bands cannot participate)

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10
Q

in conductors, the valence band

A

is not full and overlaps with conduction bands

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11
Q

electron conduction arises when

A

an electron moves from the valence band into a higher energy state

get an electron in conduction band and hole in valence band

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12
Q

how can a valence electron gain energy and jump the band gap?

A
  1. thermally (don’t like)
  2. photon transferring energy (ie photoelectric effect)
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13
Q

semiconductors: photons will produce

A

electron-hole pairs

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14
Q

doped semiconductors

A

adding a small amount of a different atom with more/less valence electrons

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15
Q

doped semiconductors are used to

A

improve condition and help store the charges

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16
Q

p type doping

A

eg boron into silicon
fewer valence electrons so extra hole above valence band

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17
Q

n type doping

A

eg arsenic into silicon
more valence electrons so extra electrons below conduction bands

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18
Q

can use p or n-type

A

individually or combined in a p-n junction to store the charge produced by the photons

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19
Q

p-type silicon held under a small bias voltage - setup

A

a thin insulator layer of SiO2 is placed onto the p-type Si and on top of this is a metal electrode (known as surface channel device)

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20
Q

p-type silicon held under a small bias voltage - depletion region

A

the positive holes are driven away from the small positive bias voltage near the electrode

electrons migrate to near electrode

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21
Q

electron hole pairs created by photons will have the electron stored

A

in the potential well near the electrode, at the top of p-type Si, below the SiO2

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22
Q

stored charge is directly proportional to the

A

number of photons falling on it (in IR/optical regime)

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23
Q

full well capacity

A

max no of electrons that can be held before pixel saturates

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24
Q

CCD readout by

A

applying sequences of voltages along the columns and down the rows of the CCD, transferring charge from one pixel to the next

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25
Q

charge transfer efficiency describes

A

the fraction of charge transferred per pixel with the semiconductor, typically >0.999

very little lost - very efficient

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26
Q

for speed, each column in the CCD is

A

shifted at the same time

(must be precisely timed)

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27
Q

analogue to digital converter

A

converts voltage to data numbers (DN)

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28
Q

CCD readout process

A
  1. move to next column
  2. last column shifts down
  3. readout pixel goes through amplifier, ADC and then into memory
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29
Q

some devices read out all rows simultaneously, in this case…

A

each row has its own amplifier and ADC

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30
Q

3 phase readout scheme

A

each pixel has 3 electrodes, connected in parallel at voltages Φ1, Φ2, Φ3

voltage is varied, allowing charge to migrate but also be kept separate

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31
Q

3-phasesteps of the 3-phase process

A
  1. charge stored in middle of each pixel below Φ2 (Φ1=0,Φ2=+V, Φ3=0)
  2. charge moves to right to below Φ3 (Φ1=0,Φ2=+Vdown, Φ3=+V up)
  3. charge moves to right to below Φ1 i next pixel (Φ1=+V up,Φ2=0, Φ3=+Vdown)
  4. read out rightmost column
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32
Q

contributions to the CCD DNs that must be dealt with in processing

A

Pij, Tij, Eij and Cij

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33
Q

Pij

A

contribution from pixel charge due to photons from the astronomical source

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34
Q

Tij

A

contribution from pixel charge due to thermal effects (also called dark current)

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35
Q

Eij

A

contribution from readout process

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36
Q

Cij

A

contribution from pixel charge produced by cosmic ray hits

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37
Q

Xij=

A

Pij+Tij+Eij+Cij

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38
Q

thermal noise Tij arises from

A

thermal energy in the CCD material, leading to lattice vibrations, called phonons.

Energy of these vibrations can create electron-hole pairs in the absence of illumination.

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39
Q

what are dark frames

A

exposures with no illumination falling on the CCD

dark frames are exposed for long enough to capture thermal patterns

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40
Q

electronic noise can arise in

A

-Transfer of charge from pixel to pixel
– Amplification of readout voltage - need low-noise amplifier
– Measurement of amplified voltage

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41
Q

an average readout noise is often quoted as

A

σ0=the standard deviation of Eij

eg: σ0= 10 electrons RMS

(refers to the RMS readout noise in units of electrons per pixel)

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42
Q

quantisation noise

A

Conversion of the analogue voltage into a digital signal (DN) also
introduces an additional error term: “quantisation noise”

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43
Q

bias frames

A

exposures of zero duration, without light falling on the CCD, which capture the various sources of 𝑬𝒊j

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44
Q

bias frames also provide

A

the pixel to pixel structure in the electronic noise

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45
Q

Typically, a series of bias frames is acquired and averaged to reduce

A

the SNR on the bias frame values.

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46
Q

As the pixels are readout, the stored charged is converted to a

A

voltage, producing a time varying analogue signal often measured relative to an arbitrary reset voltage

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47
Q

why is the analogue voltage is often measured relative to an arbitrary reset voltage?

A

to help with noise reduction
“correlated double sampling”

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48
Q

the arbitrary reset voltage can result in negatives values due to noise in the reset level (electronics) and pixel signal (i.e. noisy in low light). So…

A

make sure the signal is always >0 (which the ADC needs),add a fixed offset voltage, the “bias level”, to the pixel signal.

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49
Q

the gain characterises

A

how many photoelectrons there are per integer value in the readout, i.e. the number of e- per DN
(normally chosen so max no of electrons stored = max DN value the electronics can handle

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50
Q

because semiconductor material may vary…

A

each CCD pixel responds differently to illumination.

Some give a higher number of photo-electrons per photon, some lower.

CCD can also have surface spots or flaws

51
Q

flat field

A

By exposing the CCD to a uniform light source we can see CCD response to illumination

this exposure is the flat field

52
Q

the flat field corrects for

A

non-uniform CCD response, giving the image that would be produced if every CCD pixel were identical

53
Q

what needs to be done to flat field to give Fij

A

normalise (divide by average)

54
Q

pixel variation corrected photo-electron is

A

Nij=Pij/Fij

55
Q

Thermal and electronic noise often cannot be distinguished in the
dark image so

A

combine into instrumental background Bij where
Bij=Tij+Eij

56
Q

to calibrate the CCD, we need to first

A

subtract the background from
the DN, and then adjust for the non-uniform response

57
Q

Nij

A

the DN per pixel due to astronomical dources

Nij=(Xij-Bij)/Fij

58
Q

cosmic rays are

A

energetic subatomic particles from space

originate from the sun and galactic/extragalactic sources

59
Q

if a CCD is exposed for a long time or a CCD is in space then

A

cosmic rays impact it and cause pixels or groups of pixels to saturate

60
Q

how to deal with cosmic rays - median or mean

A

median is more meaningful as CR values&raquo_space; normal so mean is misleading

61
Q

when is combining exposures not useful?

A

when the source is changing (often in solar astronomy)

63
Q

CCD quantum efficiency peaks in

A

the optical but the wavelength response can be broadened into the UV by coatings

63
Q

when source is changing - what are the solutions

A

can replace ‘bad’ pixels by spatial filtering

common methods are mean or median filtering

each pixel in an image is replaced by the mean/median value of the immediate surrounding pixels

64
Q

CCD material (semiconductor and the SiO2 insulating layer is very

A

reflective shortwards of 400nm

65
Q

anti-reflection coatings improve quantum efficiency down to

A

about 350nm

66
Q

below about 350nm, reponse is further improved by

A

a coating called Lumogen which absorbs UV and re-emits as optical

67
Q

Short wavelength photons (UV/EUV: 10-400nm) have a 1/e absorption
depth of

A

10-100nm

so absorbed before they reach the depletion region

68
Q

CCD materials can now be made very thin (<10nm) and illuminated from the ‘rear’ side to give

A

increased sensitivity at wavelengths <400nm

69
Q

at wavelengths <250nm, one photon can generate

A

more than one electron hole pair

non-linear response

70
Q

the limited full well of a CCD pixel limits the

A

CCD dynamic range and can lead to blooming

71
Q

dynamic range

A

ratio between the brightest and faintest sources that can be recorded

72
Q

blooming

A

photoelectrons overflow from one potential well to the next along conduction paths (rows)

leads to bright streaks which cannot be corrected other than cosmetically.

73
Q

An “APS detector” is a detector in which

A

individual pixels contain the
photosensitive material and an amplifier

each pixel can be read out individually

no moving charge about like in a CCD

74
Q

most common APS

75
Q

CCD noise

A

Single amplifier deals with
output from all pixels; high
bandwidth needed, leading
to high noise. But many
years of development of
materials so dark and
readout noise small

76
Q

CMOS noise

A

Each pixel has own
amplifier; can be low
bandwidth, leading to
low noise. But suffer
from larger dark and
readout noise (less
heritage than CCD)

77
Q

CCD vs CMOS nosie

A

Overall, CCD
historically better for
low noise and hence
preferred for low light,
but CMOS are
catching up

78
Q

CCD QE

A

> 90% with appropriate
adaptations, and > 60% over
large range in wavelength

79
Q

CMOS QE

A

Best ~60% (due to
additional circuitry on
pixel), lower in the red

80
Q

CCD vs CMOS qe

A

CCD preferred for
operation at low light
levels, but CMOS
catching up fast

81
Q

CCD readout rate

A

Slower (10ms) - charge must
be stepped across in
sequence; shutter closed
during readout

82
Q

CMOS readout rate

A

Fast (ms) - all charge
read out (near)
simultaneously; shutter
can be open during
readout or no shutter

83
Q

CCD vs CMOS readout rate

A

Unimportant for most
astronomy (but fast is
good for AO systems
and solar work)
CMOS better

84
Q

CCD uniformity of response

A

Can be made large and very
uniform. Single substrate,
single readout process.

85
Q

CMOS uniformity of response

A

Can be very nonuniform! Each pixel and its amplifier can be
different.

86
Q

CCD vs CMOS uniformity of response

A

CCD preferred when
need larger and more
uniform coverage (i.e.
synoptic surveys).
CMOS need more flatfielding.

87
Q

CCD dynamic range

A

Larger full well capacity
(bigger pixels and lower
noise)

88
Q

CMOS dynamic range

A

Often smaller pixels,
and higher noise, so
lower full well capacity

89
Q

CCD vs CMOS dynamic range

A

CCD preferred for higher
dynamic range, but is
blooming an issue?

90
Q

CCD blooming

A

No insulation along rows,
all pixels exposed for
same duration ->
blooming

91
Q

CMOS blooming

A

Individual pixels can be
read out, draining
charge before
blooming

92
Q

CCD vs CMOS blooming

A

CMOS preferred but
“anti-blooming”
techniques help in CCDs

93
Q

CCD spectral coverage

A

CCDs adapted to function
across the spectrum

94
Q

CMOS spectral coverage

A

CMOS have poor IR
response and are
harder to thin for UV/Xray (but possible)

95
Q

CCD vs CMOS spectral coverage

A

CCD better outside the
optical range. But
APS/CMOS can count
individual high energy
photons

96
Q

CCD flexibility

A

On-chip binning and
region-of-interest
selection possible.

97
Q

CMOS flexibility

A

Arbitrary groups of
pixels can be read out.

98
Q

CCD vs CMOS flexibility

A

CCD readout needs
circuits; CMOS readout
needs software &
computing power

99
Q

CCD power

A

High power, to drive
readout voltages and
maintain potential wells.

100
Q

CMOS power

A

Low power - amplifiers
only turned on at
readout

101
Q

CCD vs CMOS power

A

If power an issue (i.e.
small satellite) then
CMOS preferred.

102
Q

steps to change the DN into physical units steps

A
  1. convert DN to photo-electrons per pixel
  2. covert photo-electrons per pixel to photons per pixel an CCD illumination
  3. convert illumination to flux arriving at telescope
103
Q

to Convert DN to photo-electrons per pixel, need to know

A

gain (e per DN)

N=n/g +/- sigma0

N=readout nosie, n=no of e-, sgima0=readout noise

104
Q

total noise (sigma (N)) is a combination of

A

readout noise (sigma0) and photo-electron counting noise (sigman = sqrt(n)) -poisson

105
Q

photon-counting noise in electrons

106
Q

photon-counting noise in ND

A

sqrt (Ng)/g = sqrt(N/g)

107
Q

adding readout and photon-counting in quadrature gives

A

sigma^2(N) = sigma0^2 +N/g

form of y=mx+c with m=1/g

108
Q

can calculate the read noise and gain from CCD output by

A
  1. Take several flat fields images at different illumination levels
    (giving different N)
  2. Divide each flat field image into different sub-areas, and
    measure ⟨𝑵⟩, 𝛔(𝑵) (the stdev) in each sub-area
  3. Plot 𝝈^𝟐 (𝑵) vs ⟨𝑵⟩
  4. Fit with an equation of the form 𝝈^𝟐 (𝑵) = b +k⟨𝑵⟩
  5. So 𝒃 is gives the readout noise, and 𝒌=𝟏/𝒈
109
Q

how to estimate the gain and readout noise without having to fit a line to the data

A

If the 𝝈^𝟐 (𝑵) vs <𝑵> is given as a
log-log plot</𝑵>

110
Q

The number of photo-electrons produced by a pixel 𝒏𝒊𝒋 is

A

𝒏𝒊𝒋 = Nij g

111
Q

quantum efficiency

A

Q: number of photo-electrons generated per incident photon.

Q=1 = 100% efficiency

112
Q

number of photons incident at that pixel is

A

nph = nij/Q

113
Q

The illumination, 𝑱, of the CCD in the telescope focal plane is

A

the energy s-1 m-2 arriving at the CCD.

114
Q

J can be calculated from nph if

A

the pixel size is known, duration of
exposure, and if we define a mean energy of detected photons.

115
Q

CCD and instrument will respond differently to

A

photons of different
wavelengths, described by passband 𝑷(lambda)

116
Q

passband

A

probability of detecting a photon of wavelength lambda

117
Q

mean wavelength of the photons detected

A

integral of P(λ) s(λ) λ dλ / integral of P(λ) s(λ) dλ

where s(λ) is a normalised source spectrum

118
Q

For an extended source, covering many pixels, 𝑱 will typically

A

change from pixel to pixel

119
Q

equation relating illumination to integrated flux assumes

A

no losses in the telescope

120
Q

how to find surface brightness B from equation relating J to F

A

Dividing by the solid angle 𝛀 subtended by the pixel, and the width ∆𝝂 of the spectral passband