Miniaturização Flashcards
Vantagens do Multi-Core
- Potência: Parallel signal processing is an efficient method of achieving high performance. Several “cores” offer high performance per area for parallel
operations, when compared with a single core - Design: The behavior of a smaller and simpler core is much easier to predict using the conventional design tools. Reduced complexity makes it easier to
design and to produce. - Tolerância a defeitos: “Smaller cores represent a cheap way of improving the yield. Redundant cores can be used and those with defects can be deactivated.
Advantages da miniaturização
- Mais transistores
- Menor tensão de trabalho
Causam:
- Better functionality
- Better performance
- Cost reduction
- Lower power consumption
Miniaturization
- Scale down
-Constant electric field
-Constant voltage
-Quasi Constant Voltage
-General scaling law
Strained Silicon
– Growing silicon on a silicon-germanium alloy crystal
– Silicon atoms are farthest apart from each other which reduces the electrostatic forces to which charge carriers are subjected when crossing the crystalline structure
– Deformation in the lattice parameter in the order of 1% may increase the mobility of electrons in 70%
Propriedades Silicon-germaniun alloys
Germanio
* Diamond like structure
* Face centered cubic
* Covalent bonding
Alloys Si1-xGex
* Gap and resistivty decreases with the Ge
content
Strained silicon nos mosfets
P-MOSFET
* Mobility is improved when the semiconductor channel (Si or SiGe) is deformed by perpendicular compression or biaxial tension parallel to interface
N-MOSFET
* Mobility is improved when the semiconductor channel (Si or SiGe) is deformed by parallel tension or perpendicular compression
High- K dieletrics
– High dielectric constant
– Thermodynamic stability in contact with the silicon
– Formation of good quality interfaces (epitaxial growth or amorphous structures)
– Favorable band misalignment (reduced leakage current at the gate by carrier injection in the dielectric bands
High dielectric constant
High k materials have lower band gap than SiO2
Thermodynamic stability
-It is important to avoid reaction with silicon
-Decomposition in metallic phase or formation of silicides / silicates.
-It is required that the dielectric layer has a higher heat of formation than SiO2.
- Formation of interfacial layers decreases the effective dielectric capacitance
High-k dielectrics
* Structure and interfaces
– Stabilization of an amorphous structure up to high temperatures can be achieved by mixing two oxides for the gate dielectric
– Amorphous or crystalline structures are preferred (not polycrystalline). Grain
boundaries can act as preferred centers for leakage current appearance or
dopant diffusion.
-– Interface with high-κ dielectrics have at least an order of magnitude more
defects when compared with Si/SiO2
interface
– The high-κ dielectrics themselves have a higher internal defect density since
they are deposited and not thermally grown
High-k dielectrics
* Band misalignment
– A good insulator has at least 1 eV difference at the band gap to prevent the injection of carriers from the semiconductor
Conceitos
Multilayer:
-aumento da densidade de IC’s
-Usado em memorias
Short channel effects
As the technology scaling reaches channel lengths deeper into sub-micron dimensions, second order effects, that were ignored in devices with long channel length, became very important.
Short channel effects: MOSFET‘s
- In small transistors, source/drain depletion regions extend into the channel
- Impacts the amount of charge required to invert the channel
- And thus makes VT a function of channel length (and VD)
– The main second order effects are:
* Velocity Saturation
* Threshold Voltage Variations
* Hot Carrier Effects