Miniaturização Flashcards

1
Q

Vantagens do Multi-Core

A
  • Potência: Parallel signal processing is an efficient method of achieving high performance. Several “cores” offer high performance per area for parallel
    operations, when compared with a single core
  • Design: The behavior of a smaller and simpler core is much easier to predict using the conventional design tools. Reduced complexity makes it easier to
    design and to produce.
  • Tolerância a defeitos: “Smaller cores represent a cheap way of improving the yield. Redundant cores can be used and those with defects can be deactivated.
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2
Q

Advantages da miniaturização

A
  • Mais transistores
  • Menor tensão de trabalho

Causam:
- Better functionality
- Better performance
- Cost reduction
- Lower power consumption

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3
Q

Miniaturization

A
  • Scale down
    -Constant electric field
    -Constant voltage
    -Quasi Constant Voltage
    -General scaling law
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4
Q

Strained Silicon

A

– Growing silicon on a silicon-germanium alloy crystal
– Silicon atoms are farthest apart from each other which reduces the electrostatic forces to which charge carriers are subjected when crossing the crystalline structure
– Deformation in the lattice parameter in the order of 1% may increase the mobility of electrons in 70%

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5
Q

Propriedades Silicon-germaniun alloys

A

Germanio
* Diamond like structure
* Face centered cubic
* Covalent bonding

Alloys Si1-xGex
* Gap and resistivty decreases with the Ge
content

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6
Q

Strained silicon nos mosfets

A

P-MOSFET
* Mobility is improved when the semiconductor channel (Si or SiGe) is deformed by perpendicular compression or biaxial tension parallel to interface

N-MOSFET
* Mobility is improved when the semiconductor channel (Si or SiGe) is deformed by parallel tension or perpendicular compression

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7
Q

High- K dieletrics

A

– High dielectric constant
– Thermodynamic stability in contact with the silicon
– Formation of good quality interfaces (epitaxial growth or amorphous structures)
– Favorable band misalignment (reduced leakage current at the gate by carrier injection in the dielectric bands

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8
Q

High dielectric constant

A

High k materials have lower band gap than SiO2

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9
Q

Thermodynamic stability

A

-It is important to avoid reaction with silicon
-Decomposition in metallic phase or formation of silicides / silicates.
-It is required that the dielectric layer has a higher heat of formation than SiO2.
- Formation of interfacial layers decreases the effective dielectric capacitance

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10
Q

High-k dielectrics
* Structure and interfaces

A

– Stabilization of an amorphous structure up to high temperatures can be achieved by mixing two oxides for the gate dielectric

– Amorphous or crystalline structures are preferred (not polycrystalline). Grain
boundaries can act as preferred centers for leakage current appearance or
dopant diffusion.

-– Interface with high-κ dielectrics have at least an order of magnitude more
defects when compared with Si/SiO2
interface

– The high-κ dielectrics themselves have a higher internal defect density since
they are deposited and not thermally grown

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11
Q

High-k dielectrics
* Band misalignment

A

– A good insulator has at least 1 eV difference at the band gap to prevent the injection of carriers from the semiconductor

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12
Q

Conceitos

A

Multilayer:
-aumento da densidade de IC’s
-Usado em memorias

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13
Q

Short channel effects

A

As the technology scaling reaches channel lengths deeper into sub-micron dimensions, second order effects, that were ignored in devices with long channel length, became very important.

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14
Q
A
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15
Q

Short channel effects: MOSFET‘s

A
  • In small transistors, source/drain depletion regions extend into the channel
  • Impacts the amount of charge required to invert the channel
  • And thus makes VT a function of channel length (and VD)

– The main second order effects are:
* Velocity Saturation
* Threshold Voltage Variations
* Hot Carrier Effects

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16
Q

Short Channel Effects
* Channel length modulation

A

So far the lateral extension of the depletion layer into the channel (ΔL) has been ignored. Not anymore: for short channel devices, ΔL reduces the effective channel length and it is VD dependent.