Lec11 Flashcards
disadv of traditional machining
1 large amount of energy goes into producing unwanted chips
2 a lot of energy ends up was undesirable heat
3 unwanted residual stress burs req further processing
4 some geometries are too delicate
Adv of traditional machining
ability to machine
1 Complex geometries beyond simple planar or cylindrical features
2 extreme surface finish and tolerance
3 components that cannot withstand large cutting forces
4 no burs or residual stresses
5 brittle materials or very high hardness
Types of nontraditional machining
chemical
electrochemical
mechanical
thermal
Chemical non traditional machining
a chemical reaction between liquid reagent and the workpiece results in etching
Electro chemical
an electrolytic reaction at the
workpiece surface is responsible for material removal
Mechanical
high velocity abrasives or liquids are used to remove materials e.g. Ultrasound, water jet
etc
Thermal
high temp. in very localised region evaporates materials
General chemical machining steps
cleaning
masking
etching
stripping
Cleaning for chemical machining
contaminants on surface are removed to permit uniform etching
pickling rinsing degreasing
Masking for chemical machining
etch resistant maskant to cover a certain region of a workpiece - uncovered is exposed to etching
Etching for chemical machining
Spraying etchant onto a workpiece or immersing workpiece in etchant
chemical reaction stopped by rinsing
Stripping for chemical machining
maskant is removed from the workpiece and its surface is cleaned
Etch rate proportional to
etchant concentraction adjadcent to the region of machining
disadv of chemical machining x2
1 MRR is very slow in terms of unit area exposed
2 handling of dangerous chemicals and disposal of harmful products
Photochemical machining is a type of
chemical machining
How does photochemical machining work
Photoresist used as mask
CAD used to develop design
develop photographic negative (phototool)
bring phototool in contanct with workpiece using vacuum frame
expose workpiece to intense UV light
expose regions more resistant to solvents
dip or spray in etchant
remove mask
Types of photoresists
dry film - use a hot roller lamination
lquid - dipping flowing rolling electrophoresis