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CPT01 > COMPUTER MAITENANCE > Flashcards

COMPUTER MAITENANCE Flashcards

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1
Q

Is often referred to as the “brain” of a computer. It performs most of the processing inside a computer, executing instructions from programs through basic arithmetic, logic, control, and input/output operations.

A

Central Processing Unit

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2
Q

Typically, more powerful and designed for general computing, gaming, or workstation(e.g., Intel Core, AMD Ryzen.

A

Desktop CPUs

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3
Q

Found in smartphones and laptops, optimized for power efficiency)e.g., ARM processors like Qualcomm Snapdragon).

A

Mobile CPUs

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4
Q

Designed for high - performance task and server environment(e.g, Intel Xeon, AMD EPYC).

A

Server CPUs

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5
Q

Handles all arithmetic and logical operation(e.g., addition, subtraction, comparison),

A

ALU (Arithmetic Logic Unit)

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6
Q

Directs the operation of the processor. It tells the computer’s memory, ALU and input/output devices how to respond to a programs instruction.

A

CU (Control Unit)

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7
Q

Small, fast storage location within the CPU used to hold temporary data and instruction.

A

Register

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8
Q

A small amount of very fast memory located inside or very close to he CPU, usedd to store frequently accessed data to speed up processes.

A

Cache

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9
Q

Measured in gigahertz(GHz), it determines how many cycles per second the CPU can execute.

A

Clock Speed

  • A higher clock speed generally means faster performance.
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10
Q

Modern CPUs have multiple cores, meaning they can perform multiple task simultaneously.

A

Cores

  • More cores are better for multi tasking and running complex applications.
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11
Q

The set of commands the CPU understands, such as x86 or ARM.

A

Instruction Set Architecture (ISA)

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11
Q

Is a sequence of instructions that can be managed independently by a scheduler. CPUs can handle multiple______, with some CPU using hyper-threading to effectively double the number of threads per core.

A

Threads

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12
Q
  • Introduced Turbo Boost and Hyper-Threading (in Core i7).
  • Integrated memory controller, reducing latency.
  • L3 cache introduced, shared between cores.
A

1st Generation (Nehalem) – 2008/2009

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13
Q
  • Significant architectural redesign from Nehalem.
  • Integrated GPU (Intel HD Graphics) in every CPU.
  • Quick Sync introduced for hardware video encoding/decoding.
  • Improved performance and power efficiency.
A

2nd Generation (Sandy Bridge) – 2011

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14
Q
  • Refinement of Sandy Bridge with better power efficiency.
  • Enhanced integrated graphics with DirectX 11 support.
  • First Intel CPUs to support PCIe 3.0.
A

3rd Generation (Ivy Bridge) – 2012

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15
Q
  • Focused on mobile efficiency, improving power consumption for laptops.
  • Integrated voltage regulator for improved power management.
  • Improved graphics performance with Intel HD 5000 series.
A

4th Generation (Haswell) – 2013

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16
Q
  • Focus on reducing power consumption.
  • Significant improvements in integrated graphics performance.
  • Limited release for desktops, primarily a mobile-focused generation.
A

5th Generation (Broadwell) – 2014

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17
Q
  • Major redesign and support for new technologies like DDR4 memory.
  • Enhanced performance per watt, better than previous generations.
  • Improved integrated graphics (Intel HD 530 and Iris Graphics).
A

6th Generation (Skylake) – 2015

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18
Q
  • Incremental upgrade from Skylake, focused on higher clock speeds and better 4K video playback.
  • Optane Memory support introduced for faster storage solutions.
  • Enhanced video encoding/decoding performance (support for 4K HEVC, VP9).
A

7th Generation (Kaby Lake) – 2016

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19
Q
  • AMD’s first true 8-core CPUs for consumers.
  • Focused on high core count but had lower - —— Instructions Per Clock (IPC) compared to Intel’s counterparts.
  • Based on the Bulldozer architecture, it featured a “module” design (2 integer cores shared floating-point units).
  • Struggled to compete with Intel’s Sandy Bridge in performance.
A

AMD FX-Series (Bulldozer) – 2011

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19
Q
  • Increased core counts: 6 cores in i5, 6 cores/12 threads in i7.
  • Major performance leap in multi-core workloads.
  • Improved Turbo Boost across more cores.
A

8th Generation (Coffee Lake) – 2017

19
Q
  • Up to 8 cores in mainstream i7 and i9 CPUs.
  • Introduction of Core i9 in the mainstream platform.
  • First CPUs to hit 5 GHz boost clocks on stock settings.
  • Soldered TIM (Thermal Interface Material) for better heat transfer.
A

9th Generation (Coffee Lake Refresh) – 2018

19
Q
  • First generation to use a hybrid architecture: - - - Performance cores (P-cores) and Efficiency cores (E-cores).
  • Support for next-gen technologies like DDR5 memory and PCIe 5.0.
  • Significant performance uplift, especially in multi-threaded and power efficiency tasks.
    Up to 16 cores (8P + 8E) and 24 threads.
A

12th Generation (Alder Lake) – 2021

19
Q
  • Tile-based architecture with different chiplets for different tasks (CPU, GPU, I/O).
  • Significant IPC improvements and better power efficiency.
  • Continuation of hybrid architecture with performance and efficiency cores.
  • Focus on AI acceleration and improved integrated graphics performance with Intel Xe Gen 2.
A

14th Generation (Meteor Lake) – Expected in 2024

19
Q
  • Up to 10 cores and 20 threads on the desktop.
  • Hyper-Threading returned for all models (including Core i3 and i5).
  • Thermal Velocity Boost to achieve higher boost clocks
  • First 10nm architecture from Intel, focusing on mobile processors.
  • Gen 11 Iris Plus Graphics, supporting better integrated GPU performance.
  • Integrated Wi-Fi 6 and Thunderbolt 3 support.
A

10th Generation (Comet Lake and Ice Lake) – 2020

19
Q
  • New Cypress Cove architecture backported from 10nm, improving IPC.
  • First desktop CPUs to support PCIe 4.0.
  • Improved single-core performance but reduced maximum core count (down to 8 cores).
  • Introduced Intel Xe Graphics for improved GPU performance.
  • Better AI and machine learning acceleration with DL Boost.
  • First to support Thunderbolt 4 and USB 4.0.
A

11th Generation (Rocket Lake and Tiger Lake) – 2021

19
Q
  • Key Feature: Refinement of Alder Lake.
  • Mnemonic: “Raptors Refine Power”
A

13th Gen: Raptor Lake (2022)

19
Q
  • Huge leap forward in terms of IPC and power efficiency.
  • Ryzen 3000 series was the first to match and, in some cases, outperform Intel’s mainstream - —
  • CPUs in both gaming and productivity tasks.
    Chiplet design introduced: CPU cores manufactured on 7nm, while I/O die remained on 12nm, allowing for better scalability.
  • Support for PCIe 4.0, the first in mainstream CPUs.
  • More cores and threads: Ryzen 9 series introduced up to 12-core and 16-core CPUs.
A

AMD Ryzen 3rd Generation (Zen 2) – 2019

19
Q
  • Major architectural overhaul with Zen 3, offering the highest single-threaded performance AMD had ever delivered.
  • Redesigned core layout allowed for better communication between cores, resulting in lower latency and higher IPC.
  • Zen 3 CPUs took the lead in gaming performance, overtaking Intel’s long-held crown.
  • Better power efficiency and performance across all workloads, including gaming, productivity, and content creation.
  • Ryzen 5000 series introduced up to 16 cores for mainstream desktops.
A

AMD Ryzen 4th Generation (Zen 3) – 2020

19
Q
  • APU (Accelerated Processing Unit): Combined CPU and integrated GPU (Radeon graphics) on the same die.
  • Focused on providing budget-friendly solutions with good graphics performance.
  • Entry-level to mid-range performance, with support for DirectX 11.
A

AMD A-Series APUs (Llano) – 2011

19
Q
  • A refinement of the Bulldozer architecture, focusing on power efficiency and slightly better IPC.
  • Used in both desktops and servers.
  • Multi-threading performance was strong due to the high core count but still lagged Intel in single-core performance.
A

AMD FX-Series (Piledriver) – 2012

20
Q
  • Improved over Llano and Trinity APUs.
  • Heterogeneous System Architecture (HSA) introduced for better CPU-GPU collaboration.
  • Radeon R7 graphics integrated for better multimedia and gaming performance on budget systems.
  • First APU to support Mantle API, improving gaming performance in supported titles.
A

AMD A-Series APUs (Kaveri) – 2014

20
Q
  • First appearance of the Zen architecture, a massive leap over the Bulldozer and Piledriver generations.
  • Significant IPC improvements, putting AMD back into competition with Intel after years of lagging behind.
  • High core counts: 8-core/16-thread CPUs in the - Ryzen 7 lineup, 6-core/12-thread in Ryzen 5.
  • Focused on multi-threaded performance, great for productivity and gaming.
  • AM4 socket introduced, providing a long-term platform for upgrades.
A

AMD Ryzen 1st Generation (Zen) – 2017

20
Q

This supplies the motherboard with power from the power supply.

A

24-pin ATX Power Connector

20
Q
  • Continuing with the chiplet design, Zen 5 is expected to bring further performance and power efficiency improvements.
  • Potential focus on AI acceleration and more specialized workloads with hardware optimizations.
  • Increased core counts, clock speeds, and architectural improvements to maintain AMD’s lead in performance.
  • Expected continued support for DDR5 and PCIe 5.0, and possibly PCIe 6.0.
A

AMD Ryzen 6th Generation (Zen 5) – Expected in 2024

20
Q

They are usually located near the CPU socket and are responsible for providing memory that the CPU can use to store active processes.

A

RAM (Memory) Slots

21
Q
  • Improved upon the original Zen architecture with Zen+.
  • Higher clock speeds and better power efficiency due to the shift to 12nm.
  • Precision Boost 2 and XFR2 improved clock speed management, enhancing performance under load.
  • Refined cache latencies and improved memory support.
A

AMD Ryzen 2nd Generation (Zen+) – 2018

21
Q
  • Another significant leap with Zen 4, shrinking the process node to 5nm on the CPU cores.
  • Introduced DDR5 memory and PCIe 5.0 support, pushing the boundaries of platform speed and capability.
  • Increased power efficiency and performance, focusing on both single-threaded and multi-threaded workloads.
  • Support for AVX-512 instructions for improved performance in specific workloads like AI and scientific applications.
  • AM5 socket introduced, bringing a new platform for future upgrades.
A

AMD Ryzen 5th Generation (Zen 4) – 2022

21
Q

Where the central processing unit (CPU) is installed. It is usually a square socket in the center of the motherboard. It varies depending on the type of CPU (Intel or AMD) and the generation of the processor.

A

CPU SOCKET

22
Q

Provides additional power to the CPU, usually near the CPU socket.

A

8-pin CPU Power Connector

23
Q

used for installing expansion cards, such as:
Graphics cards (GPUs)
Sound cards
Network cards
Storage controller cards

A

PCIe Slots (Peripheral Component Interconnect Express)

24
Q

A critical part of the motherboard that acts as a communication hub between the CPU, memory, and other components.

A

Chipset

25
Q

are used to connect storage devices like SSD (Solid-State Drives) or HDD (Hard Disk Drives). They are typically rectangular ports, often located near the edge of the motherboard.

A

Sata ports

26
Q

used for installing high-speed SSDs. These are usually smaller and faster than SATA drives, and the slot is often found near the PCIe slots.

A

m.2 slot

27
Q

Powers the BIOS/UEFI settings and keeps the system clock running even when the computer is off. It’s typically a small, round battery.

A

CMOS Battery

28
Q

These are located at the back of the motherboard, connecting the internal components to external devices.

A

I/O Ports

29
Q

This chip contains the BIOS (Basic Input/Output System) or UEFI (Unified Extensible Firmware Interface) firmware, which initializes and tests hardware during the boot process.

A

BIOS/UEFI Chip

30
Q

The motherboard has several connectors for case fans and the CPU fan. These ensure that the system stays cool during operation.

A

fan and Cooling Connectors

31
Q

Allow for connecting additional USB ports.

A

USB headers

32
Q

Connect the power switch, reset button, power LEDs, and other controls on the front of the PC case.

A

Front panel headers

CPT01 (3 decks)

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