COMPUTER MAITENANCE Flashcards
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Is often referred to as the “brain” of a computer. It performs most of the processing inside a computer, executing instructions from programs through basic arithmetic, logic, control, and input/output operations.
Central Processing Unit
Typically, more powerful and designed for general computing, gaming, or workstation(e.g., Intel Core, AMD Ryzen.
Desktop CPUs
Found in smartphones and laptops, optimized for power efficiency)e.g., ARM processors like Qualcomm Snapdragon).
Mobile CPUs
Designed for high - performance task and server environment(e.g, Intel Xeon, AMD EPYC).
Server CPUs
Handles all arithmetic and logical operation(e.g., addition, subtraction, comparison),
ALU (Arithmetic Logic Unit)
Directs the operation of the processor. It tells the computer’s memory, ALU and input/output devices how to respond to a programs instruction.
CU (Control Unit)
Small, fast storage location within the CPU used to hold temporary data and instruction.
Register
A small amount of very fast memory located inside or very close to he CPU, usedd to store frequently accessed data to speed up processes.
Cache
Measured in gigahertz(GHz), it determines how many cycles per second the CPU can execute.
Clock Speed
- A higher clock speed generally means faster performance.
Modern CPUs have multiple cores, meaning they can perform multiple task simultaneously.
Cores
- More cores are better for multi tasking and running complex applications.
The set of commands the CPU understands, such as x86 or ARM.
Instruction Set Architecture (ISA)
Is a sequence of instructions that can be managed independently by a scheduler. CPUs can handle multiple______, with some CPU using hyper-threading to effectively double the number of threads per core.
Threads
- Introduced Turbo Boost and Hyper-Threading (in Core i7).
- Integrated memory controller, reducing latency.
- L3 cache introduced, shared between cores.
1st Generation (Nehalem) – 2008/2009
- Significant architectural redesign from Nehalem.
- Integrated GPU (Intel HD Graphics) in every CPU.
- Quick Sync introduced for hardware video encoding/decoding.
- Improved performance and power efficiency.
2nd Generation (Sandy Bridge) – 2011
- Refinement of Sandy Bridge with better power efficiency.
- Enhanced integrated graphics with DirectX 11 support.
- First Intel CPUs to support PCIe 3.0.
3rd Generation (Ivy Bridge) – 2012
- Focused on mobile efficiency, improving power consumption for laptops.
- Integrated voltage regulator for improved power management.
- Improved graphics performance with Intel HD 5000 series.
4th Generation (Haswell) – 2013
- Focus on reducing power consumption.
- Significant improvements in integrated graphics performance.
- Limited release for desktops, primarily a mobile-focused generation.
5th Generation (Broadwell) – 2014
- Major redesign and support for new technologies like DDR4 memory.
- Enhanced performance per watt, better than previous generations.
- Improved integrated graphics (Intel HD 530 and Iris Graphics).
6th Generation (Skylake) – 2015
- Incremental upgrade from Skylake, focused on higher clock speeds and better 4K video playback.
- Optane Memory support introduced for faster storage solutions.
- Enhanced video encoding/decoding performance (support for 4K HEVC, VP9).
7th Generation (Kaby Lake) – 2016
- AMD’s first true 8-core CPUs for consumers.
- Focused on high core count but had lower - —— Instructions Per Clock (IPC) compared to Intel’s counterparts.
- Based on the Bulldozer architecture, it featured a “module” design (2 integer cores shared floating-point units).
- Struggled to compete with Intel’s Sandy Bridge in performance.
AMD FX-Series (Bulldozer) – 2011
- Increased core counts: 6 cores in i5, 6 cores/12 threads in i7.
- Major performance leap in multi-core workloads.
- Improved Turbo Boost across more cores.
8th Generation (Coffee Lake) – 2017
- Up to 8 cores in mainstream i7 and i9 CPUs.
- Introduction of Core i9 in the mainstream platform.
- First CPUs to hit 5 GHz boost clocks on stock settings.
- Soldered TIM (Thermal Interface Material) for better heat transfer.
9th Generation (Coffee Lake Refresh) – 2018
- First generation to use a hybrid architecture: - - - Performance cores (P-cores) and Efficiency cores (E-cores).
- Support for next-gen technologies like DDR5 memory and PCIe 5.0.
- Significant performance uplift, especially in multi-threaded and power efficiency tasks.
Up to 16 cores (8P + 8E) and 24 threads.
12th Generation (Alder Lake) – 2021
- Tile-based architecture with different chiplets for different tasks (CPU, GPU, I/O).
- Significant IPC improvements and better power efficiency.
- Continuation of hybrid architecture with performance and efficiency cores.
- Focus on AI acceleration and improved integrated graphics performance with Intel Xe Gen 2.
14th Generation (Meteor Lake) – Expected in 2024
- Up to 10 cores and 20 threads on the desktop.
- Hyper-Threading returned for all models (including Core i3 and i5).
- Thermal Velocity Boost to achieve higher boost clocks
- First 10nm architecture from Intel, focusing on mobile processors.
- Gen 11 Iris Plus Graphics, supporting better integrated GPU performance.
- Integrated Wi-Fi 6 and Thunderbolt 3 support.
10th Generation (Comet Lake and Ice Lake) – 2020
- New Cypress Cove architecture backported from 10nm, improving IPC.
- First desktop CPUs to support PCIe 4.0.
- Improved single-core performance but reduced maximum core count (down to 8 cores).
- Introduced Intel Xe Graphics for improved GPU performance.
- Better AI and machine learning acceleration with DL Boost.
- First to support Thunderbolt 4 and USB 4.0.
11th Generation (Rocket Lake and Tiger Lake) – 2021
- Key Feature: Refinement of Alder Lake.
- Mnemonic: “Raptors Refine Power”
13th Gen: Raptor Lake (2022)
- Huge leap forward in terms of IPC and power efficiency.
- Ryzen 3000 series was the first to match and, in some cases, outperform Intel’s mainstream - —
- CPUs in both gaming and productivity tasks.
Chiplet design introduced: CPU cores manufactured on 7nm, while I/O die remained on 12nm, allowing for better scalability. - Support for PCIe 4.0, the first in mainstream CPUs.
- More cores and threads: Ryzen 9 series introduced up to 12-core and 16-core CPUs.
AMD Ryzen 3rd Generation (Zen 2) – 2019
- Major architectural overhaul with Zen 3, offering the highest single-threaded performance AMD had ever delivered.
- Redesigned core layout allowed for better communication between cores, resulting in lower latency and higher IPC.
- Zen 3 CPUs took the lead in gaming performance, overtaking Intel’s long-held crown.
- Better power efficiency and performance across all workloads, including gaming, productivity, and content creation.
- Ryzen 5000 series introduced up to 16 cores for mainstream desktops.
AMD Ryzen 4th Generation (Zen 3) – 2020
- APU (Accelerated Processing Unit): Combined CPU and integrated GPU (Radeon graphics) on the same die.
- Focused on providing budget-friendly solutions with good graphics performance.
- Entry-level to mid-range performance, with support for DirectX 11.
AMD A-Series APUs (Llano) – 2011
- A refinement of the Bulldozer architecture, focusing on power efficiency and slightly better IPC.
- Used in both desktops and servers.
- Multi-threading performance was strong due to the high core count but still lagged Intel in single-core performance.
AMD FX-Series (Piledriver) – 2012
- Improved over Llano and Trinity APUs.
- Heterogeneous System Architecture (HSA) introduced for better CPU-GPU collaboration.
- Radeon R7 graphics integrated for better multimedia and gaming performance on budget systems.
- First APU to support Mantle API, improving gaming performance in supported titles.
AMD A-Series APUs (Kaveri) – 2014
- First appearance of the Zen architecture, a massive leap over the Bulldozer and Piledriver generations.
- Significant IPC improvements, putting AMD back into competition with Intel after years of lagging behind.
- High core counts: 8-core/16-thread CPUs in the - Ryzen 7 lineup, 6-core/12-thread in Ryzen 5.
- Focused on multi-threaded performance, great for productivity and gaming.
- AM4 socket introduced, providing a long-term platform for upgrades.
AMD Ryzen 1st Generation (Zen) – 2017
This supplies the motherboard with power from the power supply.
24-pin ATX Power Connector
- Continuing with the chiplet design, Zen 5 is expected to bring further performance and power efficiency improvements.
- Potential focus on AI acceleration and more specialized workloads with hardware optimizations.
- Increased core counts, clock speeds, and architectural improvements to maintain AMD’s lead in performance.
- Expected continued support for DDR5 and PCIe 5.0, and possibly PCIe 6.0.
AMD Ryzen 6th Generation (Zen 5) – Expected in 2024
They are usually located near the CPU socket and are responsible for providing memory that the CPU can use to store active processes.
RAM (Memory) Slots
- Improved upon the original Zen architecture with Zen+.
- Higher clock speeds and better power efficiency due to the shift to 12nm.
- Precision Boost 2 and XFR2 improved clock speed management, enhancing performance under load.
- Refined cache latencies and improved memory support.
AMD Ryzen 2nd Generation (Zen+) – 2018
- Another significant leap with Zen 4, shrinking the process node to 5nm on the CPU cores.
- Introduced DDR5 memory and PCIe 5.0 support, pushing the boundaries of platform speed and capability.
- Increased power efficiency and performance, focusing on both single-threaded and multi-threaded workloads.
- Support for AVX-512 instructions for improved performance in specific workloads like AI and scientific applications.
- AM5 socket introduced, bringing a new platform for future upgrades.
AMD Ryzen 5th Generation (Zen 4) – 2022
Where the central processing unit (CPU) is installed. It is usually a square socket in the center of the motherboard. It varies depending on the type of CPU (Intel or AMD) and the generation of the processor.
CPU SOCKET
Provides additional power to the CPU, usually near the CPU socket.
8-pin CPU Power Connector
used for installing expansion cards, such as:
Graphics cards (GPUs)
Sound cards
Network cards
Storage controller cards
PCIe Slots (Peripheral Component Interconnect Express)
A critical part of the motherboard that acts as a communication hub between the CPU, memory, and other components.
Chipset
are used to connect storage devices like SSD (Solid-State Drives) or HDD (Hard Disk Drives). They are typically rectangular ports, often located near the edge of the motherboard.
Sata ports
used for installing high-speed SSDs. These are usually smaller and faster than SATA drives, and the slot is often found near the PCIe slots.
m.2 slot
Powers the BIOS/UEFI settings and keeps the system clock running even when the computer is off. It’s typically a small, round battery.
CMOS Battery
These are located at the back of the motherboard, connecting the internal components to external devices.
I/O Ports
This chip contains the BIOS (Basic Input/Output System) or UEFI (Unified Extensible Firmware Interface) firmware, which initializes and tests hardware during the boot process.
BIOS/UEFI Chip
The motherboard has several connectors for case fans and the CPU fan. These ensure that the system stays cool during operation.
fan and Cooling Connectors
Allow for connecting additional USB ports.
USB headers
Connect the power switch, reset button, power LEDs, and other controls on the front of the PC case.
Front panel headers
