CMP Equipment Flashcards

1
Q

AMRP451300 Workstation

A

WS: 04-3AMAT_PRIME_1300

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2
Q

AMRP451300 Workstation Group

A

D9228_8800_NXP

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3
Q

AMRP451300 General Info

A

SIF process, used by NAND

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4
Q

AMRP451300 Baseline Setup

A

A&C: NXP 6088, 5Z, D9228

B&D: NXP 6088 7Z, HS8800 and HSP7009

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5
Q

AMRP451300 Platens A&C

A

SIF_D9228_NXP_25UD_H_AC_7Z, Oxide buff steps for NAND

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6
Q

AMRP451300 Platens B&D

A

POLY_NXP_H_BD_5Z, Poly CMP steps for NAND

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7
Q

AMRP451300 Redundancy

A

Redundant with 1600 (not fully redundant)

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8
Q

AMRP4D1400 Workstation

A

04-3AMAT_PRIME_1400

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9
Q

AMRP4D1400 Workstation Group

A

CSOD_NITR_2401

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10
Q

AMRP4D1400 Baseline Setup

A

PA: VISIONPAD VP5, 7Z, PL6118
PB: NXP 6088, 7Z, D7800 and D7851
PC: NXP 6088, 7Z, STI2401 and STI2910
PD: No pad?, 7Z, STI2401 and STI2910

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11
Q

AMRP4D1400 Platen A

A

NITR_VP5K4_FSL_PL6118_H_A_7Z, Nitride CMP step for MTX

NITR_VP5K4_H_A_7Z, Nitride CMP step for MTX

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12
Q

AMRP4D1400 Platen B

A

SON_CABOT_1_1_NXP_H_B_7Z, CSOD CMP for MTX

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13
Q

AMRP4D1400 Platen C

A

SOP_STI_2401_NXP_H_C_7Z and SOP_STI_2401_NXP_H_C_7Z_1013, Oxide CMP step for NAND

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14
Q

AMRP4D1400 Redundancy

A

Redundant with 1800, 2200

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15
Q

AMRP451500 Workstation

A

04-3AMAT_PRIME_1500

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16
Q

AMRP451500 Workstation Group

A

PRIME_HORS

17
Q

AMRP451500 General Information

A

Low use process, 2 tools for redundancy

Quad platen process

18
Q

AMRP451500 Baseline Setup

A

Platens A, B, C: IC 1000, EVO, SRS1631

Platen D: IC 1000, EVO, HS8800 and KP3100

19
Q

AMRP451500 Platens A, B, & C

A

SIF_SRS1631_HHH_ABC_EVO, Oxide CMP step for NAND

20
Q

AMRP451500 Platens A, B, C, & D

A

SIF_SRS1631_HHHH_ABCD_EVO and SOP_SRS1631_4001_HHHH_ABCD_EVO, Oxide CMP steps for NAND

21
Q

AMRP451500 Redundancy

A

Redundant with 2000

22
Q

AMRP451600 Workstation

A

04-3AMAT_PRIME_1600

23
Q

AMRP451600 Workstation Group

A

D9228_8800_NXP

24
Q

AMRP451600 Baseline Setup

A

PB: NXP 6088, 7Z, D9228 and HS8800 and KP3100 and HSP7009
PC: NXP 6088, 5Z, HS8800 and dilute PL6116 and HSP7009 and KP3100
PD: NXP 6088, 7Z, HS8800 and dilute PL6116 and HSP7009 and KP3100

25
Q

AMRP451600 Platen B

A

SIF_D9228_NXP_25UD_H_B_7Z and SIF_D9228_NXP_H_B_7Z, POLY/Oxide CMP for NAND/MTX

26
Q

AMRP451600 Platen C

A

SOP_ALOX_H_C_7Z, Oxide CMP for NAND

27
Q

AMRP451600 Platen D

A

POLY_NXP_H_D_5Z, Poly CMP on NAND

28
Q

AMRP451600 Redundancy

A

Redundant with 1300, although ACPoly is not on 1300

29
Q

AMRP4D1800 Workstation

A

04-3AMAT_PRIME_1800

30
Q

AMRP4D1800 Workstation Group

A

PRIME_CSOD_NITR_2401

31
Q

AMRP4D1800 Platens A and B

A

SOP_STI_2401_HH_AB_EVO, Oxide CMP for MTX

32
Q

AMRP4D1800 Platen C

A

SOP_STI_2401_NXP_H_C_7Z_1013, Oxide CMP for NAND