CMP Equipment Flashcards
AMRP451300 Workstation
WS: 04-3AMAT_PRIME_1300
AMRP451300 Workstation Group
D9228_8800_NXP
AMRP451300 General Info
SIF process, used by NAND
AMRP451300 Baseline Setup
A&C: NXP 6088, 5Z, D9228
B&D: NXP 6088 7Z, HS8800 and HSP7009
AMRP451300 Platens A&C
SIF_D9228_NXP_25UD_H_AC_7Z, Oxide buff steps for NAND
AMRP451300 Platens B&D
POLY_NXP_H_BD_5Z, Poly CMP steps for NAND
AMRP451300 Redundancy
Redundant with 1600 (not fully redundant)
AMRP4D1400 Workstation
04-3AMAT_PRIME_1400
AMRP4D1400 Workstation Group
CSOD_NITR_2401
AMRP4D1400 Baseline Setup
PA: VISIONPAD VP5, 7Z, PL6118
PB: NXP 6088, 7Z, D7800 and D7851
PC: NXP 6088, 7Z, STI2401 and STI2910
PD: No pad?, 7Z, STI2401 and STI2910
AMRP4D1400 Platen A
NITR_VP5K4_FSL_PL6118_H_A_7Z, Nitride CMP step for MTX
NITR_VP5K4_H_A_7Z, Nitride CMP step for MTX
AMRP4D1400 Platen B
SON_CABOT_1_1_NXP_H_B_7Z, CSOD CMP for MTX
AMRP4D1400 Platen C
SOP_STI_2401_NXP_H_C_7Z and SOP_STI_2401_NXP_H_C_7Z_1013, Oxide CMP step for NAND
AMRP4D1400 Redundancy
Redundant with 1800, 2200
AMRP451500 Workstation
04-3AMAT_PRIME_1500