Chapter 4 Flashcards
Ideal Diode IV Characteristics
Non-linear over large scale
What is Reserve Bias?
VC < 0
iD = 0
Open Circuit
Flows in through the line diode from positive to negative
What is Forward Bias?
VC = 0
iD > 0
Short Circuit
Flows in through the triangle diode from positive to negative
SLA
Stereolithography
Laser curing of liquid plastic
* Earliest 3D method, based on UV-set polymers.
* Resolution quite good: 0.002” layers.
* Curing needed before part can be used.
Example: COVID 19 Swabs and Celiac Axis Printing
SLS
Selective Laser Sintering
Similar with SLA, laser fuses powder
LOM
Laminated Object Modeling
Laser cuts paper one layer at a time
* Paper or film is the base material used in this technology
* Layers of adhesive-coated plastic, paper or metal laminates are fused together and cut into shapes with the aid of a knife or laser cutter
FDM
Fused Deposition Modeling
A thread of plastic is melted through a moving head
* FDM is one of the most versatile 3D methods
– Many materials can be used: solvent-based or thermo-plastics. e.g., PLA, ABS, etc.
– Requires X-Y-X motion (like a CNC machine).
Example: da Vinci Jr. 1.0w, Respirator Frames, Face Shield Frame
Application of Diode Logic Gate
OR Gate (3 Diodes at the top and one resistor connected to ground at the bottom)
AND Gate (3 Diodes at the bottom and one resistor connected to voltage source at the top)
Exponential Characteristic
ID = Is [exp (vD/nVt) - 1]
Exponential Iterative
VD = 0.736 V
ID = 4.264 mA
Piecewise-Linear
VD = 0.735 V
ID = 4.265 mA
Constant Voltage
VD = 0.7 V
ID = 4.3 mA
Ideal
VD = 0 V
ID = 5 mA
Instantaneous Signal Voltage
vD(t) = VD + Vd(t)
Diode Voltage = DC Voltage + AC Voltage
Instantaneous Signal Current
iD(t) = ID + Id(t)
iD(t) = Is[ exp (vD(t) / nVt)]