Ch 5 - Biomaterial Degradation Flashcards
Metallic degradation
• “Corrosion” = leaching of ions from metallic surface into surroundings
* Metals more suscep. (in vivo) than ceramics
Redox reactions
- OIL (of e-) → dissolution at \anode
* RIG (of e-) → deposition at \cathode
Nernst equation
ΔE=( E_2 - E_1 ) − (RT/nF) ∗ ln( [M_1^n] / [M_2^] )
Galvanic corrosion
• 2 metals electrically coupled in the body, connected by physiological fluid (\salt bridge)
• More active/anodic metal will dissolve at accelerated pace (dissolution), generates e-
* Redox rates must equal s.t. overall corrosion is rate-limited by slower one
** Mitigated by non-reactive/cathodic metals OR w/ passive oxide coatings
Pourbaix diagram
• Potential (V) v. pH
1 . \corrosion = +10^-6 M ions in sol’n (at equil.)
2. \immunity = “cathodic protection”
3. \passivation = stable solid film
* dashed lines = stability of water (WANT B/W LINES)
** CANNOT predict rate of rxns
Cathodic protection
Not energetically favorable to corrode/dissolve
Passivation
- Surface oxidation leads to formation of stable solid film that coats surface of metal
- Can slow or stop corrosion (e- transfer), even if energetically favorable
Corrosion by processing parameters
- ANY change in microstructure (processing, mech loading, proteins/bacteria) → change localized ion conc ∴ corrosion ↑
• Mech stress → higher energy state, # microcracks ↑
Crevice corrosion
- Depletion of O_2 in crevice (neces. for OH passive layer) → anodic rxn → pH ↓
- Frees H+ ∴ corrosion
Pitting corrosion
• Flaw disrupts passivation film
• Small anode, large cathode (signif. dissolution of anode)
* Dangerous b/c may be undetected until sudden device failure
Intergranular corrosion
• GB = heightened energy state
∴ more active/anodic susc.
* can lead to intergranular attack (corrosion of passivating layer)
** Mitigated by heat treating
Mech corrosion: stress corrosion cracking
• Metal under tension AND subjected to corrosive envir.
• Small cracks form ⊥ to direction of applied stress
• \crack propag, brittle fracture
* Dangerous b/c can occur at low loads and normally tolerated sol’ns
** Mitigated by design w/ min. stress raisers
Fatigue corrosion
- Con’t bending, loading or motion around implant may disrupt passivating film on surface → corrosion of local area
- ↓ max stress at failure as N cycles ↑ (fatigue life ↓)
Fretting corrosion
Removal of passivating layer by mechanical motion near implant
Corrosion by biological envir
- Inflam. cells: strong oxidizing agents, ↓ pH
- Proteins: scavenge metals (alter equil → further dissolution)
- Bacteria: infect device (affect passive layer by consuming H+ from cathode) → equil change, anodic dissolution