12 - eMMC Overview

Question 1

What does eMMC stand for?

Answer 1

embedded Multi Media Card

Question 2

What is the current version?

Answer 2

5.x

Question 3

What does BGA stand for?

Answer 3

Ball Grid Array

Question 4

Name some types of BGAs?

Answer 4

• Ceramic Ball Grid Array (CBGA)
• Ceramic Column Grid Array (CCGA)
• Plastic Ball Grid Array (PBGA)
• Tape Ball Grid Array (TBGA)
• Low Profile Ball Grid Array (LBGA)
• Thin Profile Ball Grid Array (TBGA)
• Very Thin Profile Ball Grid Array (VBGA)

Question 5

What is the typical voltage of a VCC?

Answer 5

3. 3 volts DC
   * VCC = rail voltage*

Question 6

What is the typical voltage of a VCCQ?

Answer 6

1.8 volts DC?

VCCQ is the input output controller voltage. the VCCQ value must be equal to or less than the VCCQ value, so the VCC can not be a higher voltage value than the VCC.

Question 7

How many data channels has a eMMC?

Answer 7

8 - DAT0 to DAT7

Question 8

Name the five transmission modes of an eMMC?

Answer 8

• 1 bit Single Data Rate SDR ( 1 bit Bus sampling at rising edge)
• 4 bits SDR (4 bits Bus sampling at rising edge)
• 8 bits SDR (8 bits Bus sampling at rising edge)
• 4 bits Bus Double Data Rate
• 8 bits Bus DDR

Question 9

What does PoP stand for?

Answer 9

Package on Package - PoP is a stocked packaging method that has to ball grid array packages containing a random access memory or DRAM mounted above a processor with a standardized defined interface to route signals between them. E.g. Apple A9 chip.

Question 10

What is eMCP?

Answer 10

Single BGA package may contain EMMC and DRAM. This is commonly known as an embedded multi chip package. The eMCP package contains completely independent interfaces for connection to a separate processor chip.

Question 11

What is ePoP?

Answer 11

Commonly you will encounter a processor with EMC and LPD Ram in a single BGA package on package per PLP deployment. This is commonly known as an embedded package on package or ePoP.

Question 12

What is UFS?

Answer 12

The universal flash storage or UFS is the next generation flash memory technology.

• significant increase in read and write speed performance
• full duplex, low voltage differential signaling serial interface

Question 13

What is uMCP?

Answer 13

Combining UFS and LPD Ram into a multi chip package is known as a UFS spaced multi chip package or uMCP.