Troubleshooting Bonder Machines Flashcards
You start the Bonding Machine #1’s [SLEMJEM] after cleaning the [Die Holds] to resume bonding. However, when you go to start the bonding machine pops up this error > [CD MODE: FAILED TO READ WAFER NUMBER]: How do we fix this error and resume bonding?
1st. Visually count the wafers in the [HOLDER] > Next grab the [Wafer Number Listings] on the bonding machine > 2nd. > Open the [SLEMJEMS FIU] > Click on > CODNEX (Should be on the toolbar already) > On the screen should be a blurry wafer number > Now using the wafer number listing and the noted wafer from the Holder > Verify the matching Wafer Number to the one that’s blurry on screen > 3rd. > When verified > Click Continue on the error message and then Manuel input > Lastly click > Retry = Completed
You get an error that requires you to open and clean the DIE HOLDERS in the bonding machine, when you go to place the DIE HOLDERS to clean you get an error message > [DFS COULD NOT DETECT DIE HOLDER: NO GLASS ON PICK HOLDER]: How do we fix this error and place the DIE HOLDER to clean?
Calibration > DIE HOLDER TRANSFER > BLOW UP DIE > Wait > BLOW UP DIE on HEADBONDER too Next > BOND MACHINE 1’S Console (BMC] >START BONDING > NUZZLE TAB > PLACE DIE HOLDER > Click “NO” = Done
IF > Error persists still then > Calibration > Arm.die > Blowup die > Pickup Die to the arm die > Blowup die again > Standby > NEXT > Auto > Nuzzle > Place Die Holder > Click “No” = Done
You need to get a new WAFER CONTAINER for the start up on a Bonding machine: How do we locate and find a new WAFER CONTAINER for the startup process?
CS [CONTROLLER STATIONS > Start menus > CUI > WAFER DISPAZ VIEW > Look for TCW related bundles in the collumns > Once found > Add a comment stating why this Bundle was taken for our machine. > Look for the correct recipe at the end of a collumn on the CUI > Make sure to pick a SLX STATION that’s nearby and not too far when you go claim the new bundle > When you find a unclaimed bundle > Click TAKE BUNDLE/READY > Now wait until the collum says [Ready for pickup] after processing
You run out of reels during the bonding cycle and need to order more from SDA: How do we order more reels, and what is required?
You need to submit a RSM to SDA, after creating the RSM using the FCACHE link in specs, write down or note the RSM number to give to a blue badge to pickup later when ready
You are starting a new batch to use in the bonding machine. Before adding the new WAFER CONTAINER, we need to do housekeeping first: What are the steps in housekeeping to continue adding the new WAFER BATCH outro to the bonding machine?
Remove COT > Trim black tape flush to feeders > empty all Bins, tape and die Bins > Clean banks > Clean the RDA under the front door of the Axis Table > Opening the magnetic door to the AXIS TABLE and grabbing the die tray using pliers to empty into a silicone container > inspecting the right stage and left stages for particals > Looking at Nuzzles on the left and right sides > Testing N2 = Done
You get a second: [Tol. Aligma.chek error:upbook dist] on the same wafer. We need to make a work order and log down the bonding machine for engineering to work on: How do we escalate and create a work order correctly for this error?
SC > FUI > PASSDOWN > Create a new order if one doesn’t exist > The order should only be the error code nothing else > after it’s been created we need to add a comment onto it describing the error and values it has included on the message pop up > IF theres an existing work order then dont add a new one, instead add a comment to the existing work order with the wafer ID, batch ID, die ID, error values, numer of occurrences. > LOG the tool down under Equip view under FUI > LOG tool down with a comment of the reason it was logged down and estimated time frame > Then send out an FC out using these receptants [R4 TEX], [ R4 COT] [R4 OWL TEXS] to let ENG know there’s a problem with a machine = Done
While doing a DIE SKIP we need to copy some settings to 10 different preset slots: How do we copy the global settings to all 10 preset slots for a DIE SKIP for an Entro?
First > uncheck ONSET BY HAM > Clear values to “0” > Check the box again > Now click “Copy data universal” and select each of the 10 presets > Lastly > Click “Update Data Presets”
Scanning in some reels after an ENTRO. You get an error saying “Reels do not belong to this batch and are claimed by another bonding machine”: How do we solve this error and continue bonding?
This happens if the files for the Reel IDs I’d corrupted or been tampered with. > Go into the P:Directory > Reel ID Folder > Delete any locked Reel IDs inside the folder > if theres no Reel info in the folder then create a new folder > Copy the information needed into the reel ID folder and continue feeder setup to start bonding
While bonding you get an error code that pops up > Error: “RUX MOD ERROR - Align nuzzle ID - Cannot Extract Circle”
Update later
After bonding for a while you get an error on screen. [ERROR: DUD TO NUZZLE TOL CHECK]: What are some ways we can fix this error before escalating?
First we need to Blow up the die on the HEADBAND > After that we need to adjust the force values up or down by 10 - 20. > When adjusting use “DIE TRY” to safely check the values > Keep adjusting until it meets the requirements for the die type and continue bonding
Bonding on two different machines, you get a Uplook error. However, you don’t see bumps this time on either bonding machine. On bonding machine 1, you see a white screen, and on bonding machine 2, you notice a black screen without bumps to line up: How do we solve these two machines’ issues and resume bonding again?
The black screen without bumps is a flipped die, and all we need to do is BLOW UP the die and bonding should continue.
The white screen is a misalignment, and we need to go to the right or left side of the die it’s looking at, then count to the opposite side > Next, divide the number in half and count the middle of the white screen. > Lastly, count up from the center screen and again divide it in half meeting back in the center of the white screen > Click okay and resume bonding.
During a [ME PLUS] we encounter some [CRACKS] in the columns after copying and loading data over: How do we open the TAB that shows the CRACKS information for ENG or Technicians to fix?
Look for the collumn that shows the number for thr gaps > Click the arrow that’s pointing down > Uncheck all the boxes but “1” or whatever number bonder your doing the ME PLUS on. > After this you will be able to see the issue caused by the cracks during this ME PLUS. > Send screenshot to TEAM chat and if needed FC the information to ENG via communication tools.
When bonding, you get a downlook error that can’t be fixed and needs to be escalated to ENG via Tractory communication. To do this, we need to include 3 groups in the recepitant before sending out the TC to notify all on call techs and engineers: What 3 groups should be included in the TC before sending out the message?
We need to add >[(RA4 OWLA COS) - (RA4) OWLA ON - CALL) - (OWLA TCW TECHS (RA4)] Before sending
Doing an ENTRO you need to do a ME PLUS check on the bonder machine but also on the FEMDIM side too manually: How do we successfully do a FEMDIM Manual ME PLUS check?
First > Go to FEMDIM > SYSTEM
While cleaning the DIE holder we close the machine and stop the FEMSLIM to check the WAFER being worked on, when we do stop the FEMSLIM the ARMROBBER in the machine thinks a Wafer is already in the machine but you unloaded it before cleaning so it tries to pickup a GHOST WAFER that doesn’t exist and you get an error on the FEMSLIM > “Align failed WAFER ED Could not Find wafer, Check Lazer beamers”: How do we fix this issue so we can safetly put the wafer back in the machine to begin bonding again?
Go into the FEMSLIM and then > System >
