SR02 Planetary environment I Flashcards

Planetary environment I

1
Q

List the main environmental factors

A
  1. Vacuum
  2. Gravity
  3. Illumination
  4. Temperature
  5. Radiation
  6. Impacts
  7. Dust
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2
Q

What is the average orbit distance from the Sun for Earth, Moon, and Mars?

A

Earth: 1.4959789 x 10^8 km (1 AU)
Moon: 3.84400 x 10^5 km (0.00257 AU)
Mars: 2.2793664 x 10^8 km (1.523662 AU)

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3
Q

What is the equatorial radius for Earth, Moon, and Mars?

A

Earth: 6.37814 x 10^3 km
Moon: 1.734 x 10^3 km
Mars: 3.397 x 10^3 km

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4
Q

What is the escape velocity on Earth, Moon, and Mars?

A

Earth: 11.180 km/s
Moon: 2.380 km/s
Mars: 5.020 km/s

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5
Q

What is the surface gravity on Earth, Moon, and Mars?

A

Earth: 9.78033 m/s²
Moon: 1.622 m/s²
Mars: 3.711 m/s²

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6
Q

What is the orbital eccentricity of Earth, Moon, and Mars?

A

Earth: 0.01671022
Moon: 0.05490
Mars: 0.0934

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7
Q

Why is a life support system necessary on the Moon and Mars?

A

Due to lack of atmospheric pressure and oxygen (Earth: 1013 mbar, Mars: 6 mbar, Moon: ultra-high vacuum), humans need a life support system for survival.

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8
Q

What are the main environmental challenges of vacuum in space?

A

-Lack of oxygen, requiring life support.
-Pressure difference leading to need for pressure suits.
-No convection, causing thermal stress.
-No atmospheric drag, increasing risk of meteoroid impacts.

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9
Q

What happens to a human exposed to vacuum in space?

A

Air is sucked from the lungs, blood and bodily fluids boil, oxygen transport to the brain stops, leading to unconsciousness and suffocation within seconds.

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10
Q

Low Gravity consequences

A

Reduced contact to ground –> reduced traction and control, risk of bouncing off
Increased dust aggregation –> compromised vision, increased contamination
Varied fluid behavior –> bubble growth/detachment and reduced convection (for reactors)

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11
Q

How does gravity vary on Earth, Moon, and Mars, and what are its effects?

A

-Earth: 9.8 m/s²
-Moon: 1.6 m/s²
-Mars: 3.7 m/s² Effects: Reduced ground contact (bouncing risk), increased dust aggregation, and altered fluid behavior.

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12
Q

Moon: 14 days illumination vs. 14 days dark
Causes and consequences:

A

Limited power supply –> energy storage, other power sources
Reduced radiation intensity –> other power sources
Extreme temperature gradients –> thermal stress, damage, wide design envelope
Psychological effects –> psychological stress, mood

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13
Q

Solar irradiance on moon

A

Solar irradiance is
𝐼_solar =1361 W/m²

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14
Q

What is the inverse square law of illumination in space?

A

The intensity of solar radiation is inversely proportional to the square of the distance from the Sun:
𝐼=1/𝑑^2

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15
Q

What are Peaks of Eternal Light (PEL) and Permanently Shadowed Regions (PSR)?

A

PEL refers to regions (like on the Moon) that receive illumination >80% of the time, useful for continuous power. e.g. Moon, Mercury, Ceres
* Benefit: continuous power close to potential resource deposits

PSR refers to areas in permanent darkness, the coldest places in the solar system.

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16
Q

How does temperature differ between Earth, Moon, Mars, and Mercury?

A

-Earth: -88°C to +58°C
-Moon: -247°C to +123°C
-Mars: -128°C to +21°C
-Mercury: -180°C to +430°C

17
Q

Temperature
Causes and consequences:

A

Temporal/spatial gradients –> thermal stress (dynamic/static), thermal expansion
Extreme values –> enhanced outgassing, increased power demand

18
Q

What are the major sources of space radiation

A

Galactic cosmic rays (GCR), mainly protons and alpha particles.
Solar particle events (SPE), including x-rays, gamma rays, and protons.

19
Q

What are the risks of space radiation to humans and electronics?

A

For humans: DNA and cell damage, gene mutations, cancer risk.
For electronics: Jamming, glitches, and damage from high-energy particles.

20
Q

Earth‘s magnetic field

A

Earth‘s magnetic field shields radiation
But: the magnetic field also traps highly energetic particles in the Van-Allen Belts
* Inner belt: ~0.2 to 2 Earth radii (mainly protons)
* Outer belt: ~3 to 10 Earth radii (protons and electrons, highest intensity around 4 to 5 Earth radii)
* Between both main belts: safe zone

21
Q

Effects of radiation on CMOS (Complementary metal–oxide–semiconductor)

A

Total Ionising Dose: Ionisation process causes energy to be trapped in the materials (dose), leading to:
* Oxide doping (fixed charge, leading to lower barrier, threshold shifts)
* Leakage current (device stays „on“ even with no gate voltage)

Single Event Effects:
* Single Event Transients (heavy ion creates voltage pulse along its path)
* Single Event Upsets (device changes its logical state, e.g. bitflip)
* Single Event Latch Up (low impedance, electric short, loss of device functionality)

22
Q

The luck of Apollo (or: the solar cycle)

A

No major solar-particle events occurred during Apollo
* Individual solar eruptions are impossible to forecast
* Time between observation of an eruption and arrival in
the Earth-Moon system is <1 h up to 4 h
* Only ~20% of the flares result in particle events
* The maximum operational dose (MOD) limit for each of
the Apollo missions was set to 400 rads (X-ray
equivalent) for skin and 50 rads for the blood-forming
organs
* The average for all Apollo missions was 0.38 rad,
equivalent to 2 CT scans of the head
* Shielding level differed between command module, lunar
module less, and EVA

23
Q

Radiation counter measures

A
  • Radiation avoidance:
  • Timing of a mission (during lower solar activity)
  • Careful planning of orbital trajectory
  • Shielding: Aluminium provides limited shielding, propellant tanks are much more effcient
  • Risk of secondary radiation depending on material and thickness
  • Different materials are suitable for different types of radiation
    Radiation hardening by architecture
  • Redundancy è increases overhead in voting logic, power consumption, mass
  • Multiple levels of redundancy (i.e. component, board, system, spacecraft level)
  • Radiation hardening by design
  • Triple Modular Redundancy (TMR) strategies within the chip layout
  • Dopant wells and isolation trenches in the chip layout
  • Error detecting and correction circuits
  • Device spacing and decoupling
  • Radiation hardening by process,
  • Employ specific materials, processing techniques
  • Usually performed on dedicated rad-hard foundry fabrication lines