Particles, bonding and structure Flashcards

1
Q

What factors effect the rate of diffusion?

A

Temperature
Concentration gradient
Molecular mass

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2
Q

What is chromatography?

A

A method used to separate pigments(coloured substances) using filter paper and a solvent.

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3
Q

How do you calculate Rf value?

A

Distance travelled by dye/distance travelled by solvent

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4
Q

What is a radioactive isotope?

A

An isotope with an unstable nucleus which emits various types of radiation (hydrogen 3).

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5
Q

Medical use of isotopes

A

Cancer treatment (radiotherapy)

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6
Q

Industrial use of isotopes

A

Checking for leaks in gas and oil pipelines

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7
Q

How can you test for metals?

A

Electrical conductivity, malleability, ductility

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8
Q

Properties of ionic compounds

A
  • high melting points
  • hard but brittle
  • uniform repeated structure
  • unreactive when solid
  • dissolves in water to create a solution
  • conducts electricity only when in a solution or when molten.
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9
Q

Properties of covalent compounds

A
  • Low melting points
  • small finite structures
  • can be very reactive due to size and combination of non metals.
  • soft and brittle when solid (usually)
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10
Q

Properties of giant covalent structures

A
  • very high melting points
  • very hard but brittle
  • uniform, covalently bonded structure
  • unreactive when solid because of many strong bonds holding atoms in place.
  • does’nt conduct electricity (except graphite and silicon)
  • Doesn’t dissolve in water
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11
Q

Properties of diamond (C)

A

High melting points- many covalent bonds must be broken to separate atoms.

Very strong- each carbon atom is joined to 4 others in rigid structure.

Non-conductor of electricity- no free electrons; all used for bonding

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12
Q

Properties of graphite (C)

A

High melting points- many covalent bonds must be broken to separate atoms

Soft- each carbon atom joined to three others in layers. Layers held together by weak forces.

Conductor of electricity- only three carbon atoms are used for bonding; the fourth moves freely between layers

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13
Q

Properties of metallically bonded structures

A

High melting and boiling points- strong metallic bonds in all directions. Strong under compression and tension

Malleable and ductile- hammered and drawn out; layers slide without changing bonding.

Electrical and thermal conductors- close packed ions pass energy efficiently and mobile electrons carry charge

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14
Q

Properties of silicon dioxide

A

Each silicon atom joined to four oxygen atoms

Forms hard, colourless Chrystals.

High melting points- a lot of energy needed to break strong covalent bonds.

Doesn’t conduct electricity- no delocalised electrons

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