P2 Quiz 1

Question 1

is the portion of an electronic structure that protects an electronic/electrical
element and its environment from each other

Answer 1

electronic package

Question 2

is the bridge that interconnects the ICs and
other components into a system-level board to form electronic products

Answer 2

packaging

Question 3

An integration of many circuits or components on a single chip is defined as an

Answer 3

IC (integrated circuit)

Question 4

SSI

Answer 4

small scale integration

Question 5

MSI

Answer 5

medium scale integration

Question 6

LSI

Answer 6

large scale integration

Question 7

VLSI

Answer 7

very large scale integration

Question 8

ULSI

Answer 8

ultra large scale integration

Question 9

GLSI

Answer 9

gigascale integration

Question 10

is a concept where electrical optical,
mechanical, chemical, and biological devices are integrated on a single chip

Answer 10

system on chip

Question 11

, IC packages can be classified into two categories

Answer 11

through hole and surface mount

Question 12

represent the older of the two technologies, there are still valid
reasons for using them. For example, any hobbyist with a soldering iron can assemble a through-hole
PCB (Printed Circuit Board

Answer 12

through hole

Question 13

functions of electronic package

Answer 13

1. signal distribution
2. power distribution
3. heat dissipation
4. circuit support and protection

Question 14

commonly used ic packages

Answer 14

1. dual in-line package (DIP) tht (through hole)
2. sop (small outline package)/soic/so smt (surface mount)
3. qfp (quad flat package) smt (surface mount)
4. qfn/lcc (quad flat non-leaded package) smt (surface mount)
5. bga (ball grid array) smt (surface mount)

Question 15

is an electronic device package with a rectangular housing
and two parallel rows of electrical connecting pins.

Answer 15

dual in-line package (DIP) through hole

Question 16

The pins are drawn in an L shape from both sides of the body, the materials include plastic and
ceramic

Answer 16

small in-line package (SOP) surface mount

Question 17

The leads are led out from four sides in an L-shape, the materials are ceramic, metal and plastic,
among which, plastic packaging accounts for the vast majority

Answer 17

quad flat package (QFP) surface mount

Question 18

The four sides of this IC packaging are equipped with electrode contacts. Due to the absence of leads,

Answer 18

quad flat non-leaded package (QFN) surface mount