Module 2: Open Challenges Flashcards

1
Q

What are the Process Parameters of SLM?

A
  • Beam energy P
  • Layer thickness t
  • Scanning speed v
  • Hatch spacing h

Laser Power Density = P/hv
Volume Power Density VPD = P/hvt

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2
Q

What are the scanning strategies for SLM?

A
  • Depending on the applied scanning strategy, the condition for solidification changes -> formation of texture
  • Lower risk of unmolten material in adjacent tracks
  • In-plane anisotropy can be minimized by using an adapted laser strategy
  • Standard scanning strategy includes:
    1) Island scanning (checker board)
    2) Alternating bi-directional scanning
    3) 67deg hatch vector rotation between consecutive layers
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3
Q

Discuss about the thermal gradients in SLM.

A
  • During AM, only a localized portion of the part is molten followed by rapid solidification
  • High thermal gradients in the direction towards the build platform and the sides of the melt pool
  • Grains are usually elongated along the build-up direction and expand over more than one layer causing non-equilibrial columnar microsteructures
  • Part thickness variability, scan patterns, overhangs can result in different microstructure
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4
Q

Discuss defects in SLM (porosity and optimal process window)

A

A. At high laser power, a low scanning speed (high density energy) leads to increased porosity (keyhole effect)
B. For lower laser power, the decrease in energy density at high scanning speeds leads to incomplete melting and fusion of the material

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5
Q

What is the Key Hole Effect?

A
  • High laser energy input, plasma and evaporation of material
  • Instability in liquid metal can entral gas -> formation of pores
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6
Q

What is lack of fusion/porosity?

A
  • Poor bonding, due to insufficient molten metal or overlap between successive layers or adjacent melted tracks
  • Defects can cause a surface roughness that leads to interlayer defects. Interlayer defects may extend to multi-layer defects
  • Not sufficient energy introduced. Defects with un-melted metal powder, caused by low laser energy input
  • Metal alloys that oxidize easility may form an oxide layer at the surface, this leads to a poor bonding between layers
  • Often small residual porosities, in particular below the surface in the transition zone to the contour
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7
Q

What is balling/swelling?

A
  • Ball formation is the solidification of melted material into spheres instead of solid layers due to surface tension effects
  • Balling is observed in case the metal powder layer melted by the layer does not wet the substrate lying under it
  • Surface tension is the physical phenomenon that drives melt balling
  • Oxide contamination layer on the substrate and the surface of the melt might play a role
  • High speed and high power, may trigget melt balling
  • Swelling: can occur due to surface tension effects of the melt pool geometry (preliminary stage of balling)
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8
Q

Discuss cracking in SLM.

A
  • Cooling rates are extremly high, it leads to a great temperature gradient and correspondingly large residual thermal stresses
  • High temperature gradients combined with great residual stresses often cause crack intiation and propagation
  • High temperature gradients combined with great residual stresses often cause deformation or warping of parts
  • The following materials are regarded to be susceptible to thermal cracking:
    1) stainless steels
    2) Nickel-based alloys
    3) Titanium
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9
Q

What does roughness depend on and how can it be reduced?

A

Roughness depends on building direction and can be reduced by jet blasting or plasma polishing

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10
Q

What are the steps for an AM project?

A

1) Design
2) Material Supply
3) Processing
4) Post processing
5) Qualification

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11
Q

Discuss about design

A

Design:
- Is the first basic step for a successful project
- Shall take into account design limitations and manufacturing constraints
- Software covering orientation, design, simulation and supporting structure is needed
- Strength of supporting structure

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12
Q

Why is the need for design rules?

A

Processes to take into account:
- Powder Bed based processes
- Blown powder based processes
- Wire based processes
- Lamination based processes
- Electrochemical based processes

Materials to take into account:
- Metals
- Polymers
- Ceramics
- The exotics

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13
Q

What are the general design rules for powder bed processes?

A

Geometrical functional requirements:
- Circular, good finish, functional (eg optical)
- Orientation vs gas-flow and recoating direction

Manufacturing requirements
- Support structure - mechanical + thermal + removal
- Overhangs
- Mix of thin and think
- Build surface density
- Change of build surface density
- Layer thickness

Post manufacturing requirements
- Powder removal and cleanliness
- Tool access - liquid access
- Handling for finishing or testing
- Verification visual inspection or X-ray CT

Geometrical features, quality assurance, cleanliness requirements and instrumentation requirements.

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14
Q

Discuss about supports.

A
  • Due to induces thermal stresses resulting from reduction in tempearture from the melting point: metal would ben
  • Supporting structures keep part in its position
  • Thermal stresses
  • WIll be partially relieved when cutting the part off the base plate and when the supporting structure is removed
  • Different (elastic) deformation for different materialsW
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15
Q

What are some design rules for supports?

A

1) Flat, down-facing areas should be designed as archs. Otherwise the desig nwould most likely result in a building error and the surface quality is poor and the layer would be welded into loose powder bed leading to recoater crash

In the arch design only very small areas are welded into the loose powder bed.

2) Anisotropic surface roughness when building circular shapes in horizontal direction. Whenever possible, circular shapes should be built vertically

3) Flat, long parts buolt horizontally will bend after being removed from the base plate. This depends on the moduluts of elasticity (important for titanium or aluminium). Stress relief annealing of the whole base plate with parts.

4) Flat down-facing surfaces shall show an angle of a>45 degrees. The steeper is the angle, the better

5) Threads can readily be built. Dependent on achievable surface roughness of the certain material. Threads (circular shapes) shall be built vertically.

6) Any welded area must be connected to the base plate at any time, otherwise building error.

7) Specimens that were connected directly to the building platform had fractures occuring in the building platform.

A radius shall be created at the interface to the building platform to prevent stress concentration.

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16
Q

What are some PB processes not in the design rules?

A

Laser Path/Parameters:
1) Width of the stripes (or dimensions of the islands)
2) Strategy for the stripes
3) Strategy for the stack
4) Strategy for the contour
5) Variation in laser power density

Support structure and strategy:
1) Choice of orientation and support
- Mass production
- Fastest job
- Easiest removal

2) Verticality and stiffness of the support

3) Connection between part and platform
- Line support
- Cone support
- Tree support
- Open cell block support
- Ghost support
- Thin wall support

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17
Q

What are the general design rules for other processes?

A

1) Blown powder and wire fed processes rules
- Surface finish is substractive -> geometrical design rules same as substractive to allow final machining

2) Binder jetting process rules
- Need to remove entrapped powder -> same as powder bed for cleaning
- Need to debind -> competitive kinetic processes between “off gassing” and “sintering”, difficult to mix thin and thick sections

3) Slurry based processes
- Need to debind
- Shrinkage

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18
Q

What is not in the design rules for blown powder and wire fed processes?

A

1) Where to start, where to stop, tool path, which line first - from which direction comes the wire

2) How to accomodate (L and T) crossing

3) How to change wall thickness

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19
Q

What is not in the design rules for jet binding?

A

1) Raw material selection

2) Binder/powder ratio

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20
Q

Why is there the need for optimization?

A
  • Manual iterations are time consuming and the concept is driven by the engineer working on the project. No guarantee that the best solution was found
  • Optimization runs 100+ iterations within short time, converging to an optimal solution according to the defined constraints
  • Trend towards simulation driven design
  • FE model anyways needed, adding an optimizaiton formulation on top is simple. Of course a prerequisite in an FE model with a correct representation of the physical behaviour
  • Optimization in combination with AM.
  • Very limited manufacturing constraints, complex part can be realised
  • Mass reduction of component directly linked to cost reduction
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21
Q

What ar esome optimization aspects?

A

There are several aspects that constitute to an optimized product:
- Choice of material
- Performance (Mechanical, Thermal, Electrical, Flow,…)
- Manufacturability (optimized for manufacturing)
- Accuracy
- Integration concept
- Number of parts in assembly
- AM Specific: building direction, support structures, finishing process.

Not all aspects can be considered in an FE based optimization. Often the main focus is on the performance.

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22
Q

How to define the optimization problem?

A

An optimization problem consists of the following three main definistions and is added on top of the mechanical problems (loads, BC, …):
1) Objective: What is the goal of the optimization?
2) Design Variables (What can be changed to achiee the objective)
3) Constraints: What needs to be considered (eg static BC, dynamic analysis)

An optimization needs 1 objective and at least 1 design variable, but doesnt guarantee that the part fullfills its functions -> constraints needed. Evaluate relevant constraints for your part and define the complete problem formulation. Only defined constraints are considered by the optimization algorithm.

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23
Q

Describe the topology optimization process.

A
  • Within a defined volume (design space), the solver determines which elemends need to be present and which are not requiired by controlling the density of each element (design variable).
  • Tries to converge to a discrete solution: material/nomaterial -> main load path
  • Typically also intermediate density elements are density. Manufacturing of a 50% density element, not really possible.
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24
Q

Describe the design and non design spaces.

A

1) Interfaces (IF)
- Where the part is mounted to the structure, or a unit is mounted to the part

2) Stay-in volume (I)
- Envelope in which the part needs to be to avoid collisions with neighboring parts and allow enough clearance for integration

3) Stay-out volume (O)
- Locations within the stay-in volume where no material is allowed (eg due to bolt accessbility, cable pass through holes). In case of an inteface change, the stay-out volume moves along with the interface

4) Non-design space (N)
- To define volume where material has to be allocated although may not needed for a structural point of view. The goal is to minimize the non design space to the essential

5) Design space (O)
Volume inside ), outside ) and N in which the topology optimization algorithm decides where material is needed to fullfill the structural requirements of the part.

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25
Q

Discuss about the material supply.

A

1) Material supply: Essential for mechanical/physlcal properties

2) Typical processes include:
- Gas/water atomisation (non ferrous/ferrous metals)
- Tungstent rotating electrode process
- Electrolysis process -> costs, ecological footprint

3) Space quality? Chemical composition, shape, size, flowability, humidity -> Certification of Comformance (CoC)

4) Handlning/reuse specifications

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26
Q

Discuss about material supply challenges.

A
  • Material powder is essential for mechanical properties and final product’s performances
  • Often powder suppliers do not provide sufficient information on the powder quality
  • Poor mechanical properties discovered on the final samples may be linked to powder contamination
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27
Q

Discuss about CT -scan

A
  • The CT-scan is used for obtaining information on pores/voids/volumetric defects/inclusions
  • Non-destructive
  • No contact
  • 3D imaging of sample
  • Little or no sample preparation required
  • Obtainable internal and external information
  • When using CT scan to measure defects, we should always correlate with physical measurements (miscrosectioning)
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28
Q

Describe the powder procurement process.

A

Slide 76.
-First comes the procurement specification that is the responsibility of the customer. –From that, the procurement specification, there is a powder purchase order, which includes the material and the quantity.
- Passing to the supplier, there is an incoming order, the order is processed and passed to the powder provision.
- With the data of manufacture, blending, post-processing and order from other suppliers, the powder is tested.
- If the powder properties are as expected, a CoC is issued and the product is dispatched.
- Passing back to the customer, the product is delivered and the powder is tested and the results are compared with the CoC.
-Ultimately, the batch is accepted or refused.

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29
Q

What are AM raw material types?

A

1) Powder
- Powder bed fusion (laset, electron beam)
- Blown powder, cold spray

2) Wire
- Wire Arc AM (WAAM)
- Direct Energy Deposition (DED)
- FDM

3) Slurries
- Lithography

4) Liquids
- VAT process (polymer)

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30
Q

Discuss metal powders

A

Metal powders consists of solids (powder particles), liquids (moisture) and gases (interstitial air).

  • Powders are materials with components in different states
  • Powder properties are very difficult to predict
  • Have a crucialimpact on AM process and final part quality
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31
Q

What are the particle and powder properties?

A

Particle properties:
1) Particle size
2) Particle shape
3) Chemistry
4) Surface state
All these are influenced by the environment (humidity, air, gas)

Powder properties:
1) Flow
2) Density
3) Physical properties

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32
Q

Powder characterisation techniques: Chemistry

A

1) ICP- OES (inductively couples plasma - optimical emission spectrometry) - commonly used

2) SEM-EDS (scanning electro microscope - energy dispersive scepctroscopy)

3) GD-AES (glow discharge - atomic emission spectroscopy) - rarely used, wont detect hydrogen

4) Inert gas fusion - commonly used

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33
Q

Powder characterisation techniques: Particle Size and Morphology

A

1) Laser light diffraction - commonly used

2) Dynamic image analysis

3) Static image analysis

4) Automatic SEM - rarely used

5) Sieve analysis - commonly used

6) XCT (X-ray computer tomography) - rarely used

7) BET surface area - rarely used

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34
Q

Powder characterisation techniques: Physical properties

A

1) Hot disk (thermal conductivity)

2) Triboelectric charge (granucharge)

both rarely used

35
Q

Powder characterisation techniques: Rheological properties

A

1) Funnel flow (static) - commonly used

2) Freeman FT4 (dynamic) - rarely used

3) Angle of repose (static) - commonly used

4) Dynamic AOR (granudrum, revolution) - rarely ued

36
Q

Powder characterisation techniques: Density

A

1) Tapped and apparent - commonly used

2) Compaction (granupack) - rarely used

3) Helicum pycnometry - rarely used

4) XCT (internal porosity) - rarely used

37
Q

Powder characterisation techniques: Spreadability

A

1) 4 different (non commercial) methods - rarely used

38
Q

Powder characterisation techniques: Moisture

A

1) DVS - rarely used
2) Karl Fischer titration

Both rarely used

39
Q

How can you represent the Particle Size Distribution (PSD) and how can you measure it?

A

1) Histrogram
2) Frequency
3) Cumulative
4) Percentile

Measuring
1) Projection
2) Scatter
3) Sieve

40
Q

Dicuss the methods to calculate the particle size distribution.

A

1) Laser light diffraction
- Simple, fast
- Highly reproducible and repeatable
- Volume distribution: not easily comparable

2) Image analysis
i) Static image analysis
- Simple, fairly quick
- Sample lying flat
ii) Dynamic image analysis
- Simple, farily quick
- In flight method
iii) Automated SEM analysis
- Sample prep required
- Relatively simple once set up

3) X-ray CT
- Not mature enough yet

4) Sieve
- Crude method, but relatively simple and quick
- Inaccurate compared to other methods

41
Q

Dicuss the methods to calculate the particle morphology

A

i) Static image analysis
- Simple, fairly quick
- Sample lying flat
ii) Dynamic image analysis
- Simple, farily quick
- In flight method
iii) Automated SEM analysis
- Sample prep required
- Relatively simple once set up
iv) X-ray CT
- not mature enough yet
-

42
Q

Dicuss the methods to calculate the particle flowability

A

The behaviour of poweder depends on the machine:
- Filling, pouring
- Flow through orifice
- Storage
- Dosing
- Compaction
- Spreading, re-coating
- Plastic deformation
- Flow through gas stream
- Attachment to solid system

Methods:
1) Static flow
- Hall flow funnel (flow through orifice)
- Angle of repose (cohesiveness)
- Tapped density (compaction, storage)

2) Dynamic flow
- Drum method (granudrum) (spreading with reacoter blade, cohesiveness)
- Blade methods (Freeman FT4) Stresses in confined/compacted powder

3) Spreading layers(s)
- Various experimental, non commercial aproaches

43
Q

Describe the powder supply chain

A

1) Powder manufacturer
- Different atomisation techniques (eg gas/plasma atomisation)
- Batch-to-batch differences
- Adaptation of powder after atomisation
- Measuring of properties
- Packaging/storage/transport
- Tracability

2) 3rd party
- Buy from powder manufacturer
- Adapt properties (through sieving)
- Measuring of properties
- Selling on
- Traceability

3) AM service provider
- Buy from powder manufacturer or 3rd party
- Adapt properties (through sieving)
- Measuring of properties
- Use powder for AM
- Require reliability
- Traceability

4) End user
- Usually doesnt care or has little knowledge
- Wants high quality parts
- Traceability

High quality powder with high reliability -> High quality parts with high reliability

44
Q

What are some processing challenges?

A

1) Scanning strategy: island scanning, stripes, laser power, scanning speed, hatch distance, overlap, skin/core strategy, up/downskin

2) atmosphere in the building chamber: oxygen content, humidity

3) Position/number of parts on the building platform

45
Q

How is the horizonta and vertical l lack of fusion defects generated?

A

Horizontal
1) low power/high speed settings
2) An attenuated laser (contaminated on surface)
3) Spatter falling on surface

Vertical
Vertical laco of fusion defects occur when the hatch spacing parameter is too wide

46
Q

What are short feed (skipped layer) and spherical porosity defects

A

1) Short feed defects occure when there is not a sufficient amount of powder to cover the powder bed. When enough powder is eventually uspplied, some number of layers layer, the layer is too thick for the laser to penetrate compeltely

2) Spherical porosity occurs when the energy density of the laser is high enough to generate a “keyhole” melt pools. Although we develop parameters to achieve 100% density, spherical posority generally “heals” in the hot isostatic press and we do not have data on their effect on mechanical properties.

47
Q

How are sub-surface defects created?

A
  • Subsurface defects are created wen the offset is too large
  • These defects will not heal during the hot isostatic press process
  • During HT the free surfaces of these defects will oxidize
  • This creates fatigue initiaton sites that reduce HCF life
48
Q

How to detached contours occur?

A
  • Deatched contours occur when the offset is too large
  • These usually result in parts with superior finish but the defect is undesirable for obvious reasons
49
Q

What are the defects consequences on mechanical properties?

A
  • H-LOF defects result lower than expected tensile properties
  • Noticable drop in the elongation
  • HLOF also reduce low-cycle fatigue life
50
Q

Discuss the defects consequences

A

1) Bulk defects

i) Lack of fusion (degradation of mechanical properties)
a) Horizontal lack of fusion
- Insufficient power (parameters)
- Laser attenuation (in process anomaly)
- Splatter (parameters)
b) Vertical lac of fusion defect
- Large hatch spacing (parameters(
c) Short feed (in process anomaly)

ii) Spherical porosity (minor or no observed effect on performance)
- Keyhole (parameters)

iii) Welding defects
- Cracking (minor or no observed effect on performance) (material prperty)

2) Surface defects

i) Worm tract (out of tolerance)
- High energy core parameters (out of tolerance) (parameters)
- Re-coater blade interactions (out of tolerance) (parameters)

ii) Core bleed through
- Small core offset (minor or no observed effect on performance) (parameters)
- Overhanging surface (uknown) (parameters)

iii) Rough surface
- Laser attenuation (degradation of mechanical properties) (in process anomaly)
- Overhanging surfaces (uknN) (parameters)

iv) Contour separation
- Sub-surface fefects (degradation of mechanical properties) (parameters)
-Detached skin (degradation of mechanical properties) (parameters)

51
Q

What does post-processing include?

A

1) Hipping (hot isostatic pressing)
2) Heat treatment (strength, ductility, defects)
3) Surface treatment: need for advanced processes for complex structures
4) Cleaning procedures

52
Q

What are the requirements for post-processing?

A

1) Cleanliness/contamination
2) Controlled homogeneous roughness (mechanical properties)
3) Electrical conductivity/thermal conductivity/optical properties (eg emissivity)
4) RF performance
5) Corrosion protesion
6) Dimensional requirementF

53
Q

From what are surface properties of AM parts impacted by?

A

1) Material printed
2) Surface orientation angle with the build platform
3) Layer thickness
4) Laser parameters and machine used
5) Supporting structures

54
Q

How can surface roughness properties be measured?

A

1) Surface roughness
- Stylus profilometer
- MX Alicona to calculate Sa and Sz from the SEM images
- Confocal microscope

2) Geometrical dimensions
- 3D scanner
- CT scan
- Tactile dimensional measurement device

3) Surface defects
- Eddy current
- DYe penetrant
- CT scan
- Visual inspection

4) Cleanliness/contamination
- Particle counting
- Residues from cleaning process shall be checked too

55
Q

What are the surface roughness properties?

A

1) Ra: arithmetical mean of the profile height
2) Rz: arithmetical mean, maximum height of the profile
3) Sa: arithmetical mean of the surface height
4) Sz: arithmetical mean of the surface height

56
Q

What are the available processes for surface?

A

Processes available:
1) Electro discharge machining
2) Sandblasting
3) Chemical polishing
4) Electro chemical polishing
5) Abrasive grinding
6) Laser polishing
7) Machining
8) Cryogenic machning

Corrosion protection processes
- Anodic oxidation
- Chemical conversion coatings
- Plating

57
Q

Dicuss about post-processing challenges and CDR

A
  • Surface finishing scenario and machining plan shall be defined and tested on representative breadboards before the Critical Design Review (CDR)
  • Rounding of angles and compliance to geometrical requirements shall be tested before CDR
  • For fatigue loaded parts, samples with representative finishing shall be tested
  • The smaller lkayer thickness (eg 20μm) will have the best as processed surface properties (drawback on productivity)
  • Subsurface defects shall be controlled before applying a surface treatment to a part
  • Plating shall be qualified with environmental testing according to project requirements
  • For critical items a cleanliness/contamination control plan shall be defined at CDR and compliant NDI inspections evidenced
  • Corrosion behaviour shall be carefully assesses after surface treatment
58
Q

Discuss about verification/qualification.

A

Today, every qualification attempt is unique.
It depends on:
- Design
- Raw material
- Processing
- Post processing methods
- Machine used

Significant effort in material characterization to elaborate mechanical/physical properties achieved.

NDI/Microstructural characterization/Mechanical Properties/Corrosion/Stress Corrosion/ Fatigue/Fracutre mechanics

59
Q

Describe stress-corrosion cracking (SCC) testing

A

Stress corrosion cracking is the first go/no-go requirement for space materials

  • Three parallel speciments for each SCC test are subjected to a stress level of 75% of RP0.2 and immersed in 3.5% NaCl solution.
  • Three parallel specimens are used as unstressed control specimens for each SCC test
  • The control and the stressed specimens are immersed in 3.5%NaCl solution for 10 minutes and dried for 50minutes which is repeated over a period of 30 days.
  • After the axial microsections and the full thickness are examined at magnifications of x50 and x500
60
Q

What other tests are done for mechanical characterization?

A

1) Tensile testing (both at low temperature and high temperature, since its a function of T). 5 samples per build orientation and temperature. Results are anisotropic wrt to vertical and horizontal direction. Fractography is done afterwards to see if fracture is ductile (shear lips, dimples)
2) Fatigue testing
3) Fracture toughness testing
4) Fatigue crack growth
5) Hardness measurement (we can obtain mechanical properties from hardness)

All these are measured with optical microscopy and SEM, XRAY CT, Fractography

61
Q

Why is XRAY CT used?

A

For defects analysis -> measurement of pores/defects

62
Q

Discuss influencing factors for fatigue on metal additive manufacturing materials.

A

Fatigue tests are performed at constant level, with various printing parameters and surface conditions. High scatter and reduced fatigue strength due to different defect sized and near net-shaped condition.

These factors influence fatigue:
1) Surface roughness
2) Surface finish
3) Layer thickness (higher thickness results to higher porosity and critical defects)
4) Contour parameter(higher fatigue life without contour)

Conclusions:
1) Higher fatigue lives with more compressive residual stresses
2) Similar fatigue lives for 30 and 90μm speciments
- Surface features are much more detrimental than volumetric defects, porosity has far less influence than for machined samples
3) Significant yet overulling impact of residual stresses
4) Surface roughness with deep reaching features also has significant influence
- std roughness measurement techniques not suitable
5) Limitations: single load level, limited number of speciments, residual stress profile towards senter of speciment

63
Q

Discuss defects and their root cause.

A

1) Porosity
Poor selection of parameters, moisture or contamination of feed material or process environment, inadequate handling, storage, vaporization of minor alloying constituents depending on material feedstrock, errors in precision of beam delivery

2) Layer flaws
Interruption to powder supply, optics systems erros or errors in data. Contamination of build environment purity (inert gas interruption) or other process interuption such as changing the filament emitter within an electron beam gun. Powder supply blending or mixing between one batch and another, a new lot of filler wire etc

3) Under melted material/unconsolidated powder (LOF)
Poor selection of parameters, poorly developed and controlled process or a process out of control creating a poorly resolved flaw state. Errors in the precision of beam delivery.

4) Cracking
AM PBF failure to clean one alloy powder completely from the build environment prior to processing another, DED large assemblies extensive solidification stresses present with large buildups. There is a host of metallurgical issues associated with crack susceptability

5) Poor dimensional accuracy
Scaling/offset factors, beam intensity, density of the powder bed or build platform shift

6) Inclusions
Debris from AM or post processing equipment

7) Surface flaws
Includes partially fused powder, linear or planar conditions or irregularities. Similar to splatter, undercut, irregulat top bead, ropey bead and slumping noted for welded parts

8) Trapped powder
Cleanliness aspects not considered in design

64
Q

What is NDI and what do some examples of it include?

A

NDI/NDE/NDT are commonly used as equivalent terms, which are understood as the determination of the physical condition of an object without affect that object’s ability to fullfill its intended function

Some examples include:
i) Computed tomography (CT)
ii) Eddy current testing (ET)
iii) Infrared thermography (IRT)
iv) Metrology (MET)
v) Process compensated resonance testing (PCRT)
vi) Penetrant testing (PT)
vii) Radiographic testing (RT=)
viii) Ultrasonic testing (UT)
ix) Visual testing (VT)

two kind of methods:
- volume characteristics (eg pores and lack of fusion) with CT scan
- search for cracks (eg penetrant, ultrasound

65
Q

What are advantages and limitations of each NDI technique?

A

Slide 186

66
Q

Why doesn’t ESA have a material list?

A

Material + process -environment-> application.

the processes, environments and applications are very different each time.

67
Q

What is the definition of critical material,critical mechanical part, process, critical process and special process

A

Critical material:
A material that is new to new to an individual company or non-verified for the application in question os has caused problems during previous use that remain unresolved

Critical mechanical part:
Mechanical part that required specific attention or control due to fracutre mechanics aspects and limited-life aspects, or with which the supplier has no previous experience of using the mechanical part in the specific application and environment or that are new or non-qualified or that has caused problems during previous use that remain unresolved

Process:
A set of inter-related resources and activities which transforms a material or semi-finished product into a semi-finished product or final product

Critical Process
Process new to an individual company or non-verified for the application in question os has caused problems during previous use that remain unresolved

Special process
Process where quality cannon be completely ensured by inspection of the end article only

68
Q

What does the graph on slide 219 say?

A

Slide 219

69
Q

What is the declared materials list (DML)

A

It is a list with the following data:

1) Iten no and user code
2) Commercial identification or standardized designation

3) i) Chemical nature, ii) product type

4) i)Manufacturer/supplier name, ii) Procurements spec

5) Summary of process parameters

6) Sybsystems, equipment, use

7),8)

9.1) acronym/rating/validation red for applicable properties
9.2) Justification for approval and prime com,ments
9.3) Prime approval status

10) Customer approval status/comments

70
Q

What is the declared mechanical parts list (DMPL)

A

Similar as the DML

71
Q

What is the declared process list (DPL)

A

Similar as the DML

72
Q

What are some general rules on DML/DMPL and DPL?

A

1) The prime shall organize materials, mechanical parts and processes control board not later than PDR
2) Each supplier shall establish, collect, review and deliver the DML, DMPL, DPL
3) Materials are approved in conjuction with the associated process, the application and the associated environment

Why have these? for traceablity
1) Used to identify potential impact when non conformanced occur
2) Exhaustive list to check qualification status
- ALready tested for similar environment
- Already used in flight with similar environment
- If not, to be tested

73
Q

What is included in the standard VDI3405?

A

1) Testing of powdered materials
- Generally, unmolten powder can be re-used but must be sieved
- Changes to process behaviour and component quality due to decreasing powder quality have to be taken into account

2) Metallographic testing methods
3) Density
- Archimedean method
- Image analysis of metallographic speciments
4) Determining the mechanical characteristics
- Static
- Dynamic testing
5) Surface quality
6) Form, dimensional and positional tolerances
7) Post-production processes
8) Heat treatment`

74
Q

Describe the standard working logic of esa (AM definition phase, verification phase and hardware production phase)

A

1) Definition phase:
Hardware requirement vs end to end manufacturing constraints. After this phase the PMCR is issued (Preliminary Manufacturing Concept Review, requirements, safety class, AM end to end process). Also the pAMP is issued ( preliminary additive manufacturing procedure (density, tensile tests))

2) Afterwards comes the AM verification phase.
Material/process capabilities evaluation (sample level) and design verification (prototype level)
After this phase three documents are issued:
- AMP: Additive Manufacturing Procedure (end to end process parameters documentation to ensure AM part repeatability,. Eg powder batch, machine identification, processing parameters). Mechanical tests to define allowable (A or B values) NDI capabilities (CDR)
- HFP: Hardware fabrication procedure (definition of the conditions on how the hardware has to be produced. eg build job configuration, witness samples).
- MRR: Manufacturing Readiness Review

3) Hardware production phase:
Production and testing of flight hardware
From this the HPR: hardware production report is issued.

75
Q

In the AM definition phase, what are the functional hardware requirements, AM design constraints, criticality of the AM process, post processing techniques and NDI techniques?

A

1) Functional hardware requirements
- Required mechanical properties
- Leak, burst pressure
- Dimensions & geometrical tolerances
- Cleanliness and surface roughness
- Environmental requirement

2) AM design consdtraints
- Build envelope
- Inspectability of the design with NDI
- Design rules
- Machine-material properties link
- Post processing

3) Criticality of the AM process
- Material properties, acceptance criteria for defects
- Achievability of cleanliness requiremants
- Safety class

4) Post processing techniques
- Suitability for selected material, design, etc
- Machining constraints

5) NDI techniques
- Detection limits
- Acceptance criteria

76
Q

What is included in the AM manufacturing procedure (AMP)?

A

Successful verification on specimen level leads to additive manufacturing procedure (AMP)

  • Feedstock
  • AM process parameters
  • Post processing windows at sample level
  • NDI technique verification
77
Q

What in included in the hardware fabrication procedure (HFP)?

A

Successful verification on part (prototype) level leads to hadware fabrication procedure (HFP)

  • Supporting structure strategy
  • In process samples definition
  • Post-processing windows at hardware level
  • NDI technique verification at hardware level
78
Q

What are the parameters which have an impact on the final product and what ar esome important points?

A

Definition of all parameters which have an impact on the final product:
- Powder properties
- Machine setup and scanning parameters
- Postprocessing techniques

Important points
- The AMP is developed for one material on one machine (one serial number)
- It can/should be reused for different designs
- Different designs may require different AM processing parametrs

79
Q

What is included in the AM verification phase on specimen and part/prototype level level?

A

Specimen level:
Verification is done through testing. Test methods for safety class 1.1, 1.2 and class 2 parts include:
- Visual inspection
- Metallography
- Tensile testing
- Fatigue testing (not required for class 1.2)
- X-Ray CT
- Powder testing
- Customised tests

Part/prototype level:
The build job configuration is essential. The location and number of parts and witness speciments is known to have an impact on the final properties.
- Design of parts can have a severe impact on final properties
- Different geometrical elements can have different mechanical/physical properties
- Different machines build the same geometries differently

80
Q

What are the saftery classes of parts?

A

Safety class 1.1 parts
- Critical and structural
- Faulure reuslts in loss of S/C, major components, loss of life, or loss of control of the S/C

Safety class 1.2 parts
- Critical but non-structural
- Failure can reduce efficiency of the system, but not cause loss of the S/C

Safety class 2 parts
- Non-critical but structural
- Failure can reduce efficiency of the system, but not cause loss of the S/C

Safety class 3 parts
- Non-critical and non-structural
- Failure does not affect other flight elements

81
Q

Describe the personnel and facilities for AM.

A

1) AM supervisor
- Facility and equipment maintenance
- Health and safety
- The AMP
- Build job configuration

2) AM operator
L-BPF
E-PBF

3) Personnel for NDT

4) Facilities
Rooms shall be conditioned to 20-25 degrees with relative humidity of 50%

82
Q

What is the Powder Management Plan (PMP)?

A

A PMP is required to describe how the powders are:
1) Tested
2) Procured
3) Safely handled
4) Stored
5) Loaded
6) Recycled
7) Blended
8) Disposed

83
Q

What are the key points for powders during the whole ECSS AM life cycle?

A

1) Estabilisment of a Powder Management Plan
2) Powders should be procured with a CoC
3) Check at incoming inspection (CoC or test)
4) Powder testing is only done if recycled powder is used
5) For virgin powder, a CoC is sufficient, no testing is used

84
Q

What is auditing?

A

Auditing is done for
1) New suppliers
2) Suppliers where major changed to the end to end processes were made

Auditing is usually done by the customer