Important Definitions Flashcards
PAULI’S EXCLUSION PRINCIPLE
Each electron state can hold no more than two electrons, which must have opposite spins.
Ground state
When all the electrons occupy the lowest possible energies.
Valence electron
Those that occupy the outermost shell.
Ionic Bonding (primary)
Metallic + Nonmetalic elements. All atoms acquire stable configuration and electrical charge.
Coulombic Force
Attractive bonding force between positive and negative ions.
Covalent Bonding (primary)
Shared pair of electrons form stable configurations.
Metallic bonding (primary)
Found in metals and their alloys. One, two or three valence electrons ‘free’ to drift through the metal.
Secondary, van der Waals, or physical bonds
Weak compared to primary/chemical bonds. Exists between virtually all atoms or molecules, but obscured if any primary bond is present.
Dipole (secondary bonds arise from dipoles)
Exist whenever there is some separation of positive and negative portions of an atom or molecule.
Hydrogen Bonding (secondary)
Exists between some molecules that have hydrogen as one of the constituents.
CRYSTALLINE
A material in which the atoms are situated in a repeating or periodic array over large atomic distances.
Crystal structure
The manner in which atoms, ions, or molecules are spatially arranged in a crystalline material.
LATTICE
in the context of crystal structures A three-dimensional array of points coinciding with atom positions (or sphere centers).
Unit cells
Small repeat entities arising from subdivisions of a crystal structure.
Face-centered cubic (FCC)
A unit cell of cubic geometry, with atoms located at each of the corners and the centers of all the cube faces.
COORDINATION NUMBER
Number of nearest-neighbor/touching atoms.
Atomic packing factor (APF)
The sum of the sphere volumes of all atoms within a unit cell divided by the unit cell volume.
Body-centered cubic (BCC)
A unit cell of cubic geometry with atoms located at all eight corners and a single atom at the cube center.
Hexagonal close-packed (HCP)
Unit cell is hexagonal. The top and bottom faces consist of six atoms that form regular hexagons and surround a single atom in the center. Another plan that provides three additional atoms is situated between the top and bottom planes.
POLYMORPHISM
Metal or nonmetal having more than one crystal structure.
Allotropy
Polymorphism condition found in elemental solids.
Lattice parameters
The three interaxial angles alpha, beta, and gamma.
Crystal system
Groups of crystal structures defined according to unit cell configuration and/or atomic arrangements.
Miller indices
Crystallographic planes are specified by three Miller indices as (hkl).
Single crystal
When the periodic and repeated arrangement of atoms is perfect or extends throughout the entirety of the specimen without interruption.
POLYCRYSTALLINE
A crystalline solid that is composed of a collection of may small crystals or grains.
Grain boundary
An atomic mismatch within the region where two grains meet.
ANISOTROPIC
Substances in which measured properties are dependent on the direction of measurement.
ISOTROPIC
Substances in which measured properties are independent of the direction of measurement.
NONCRYSTALLINE/AMORPHOUS
Solids which lack a systematic and regular arrangement of atoms over relatively large atomic distances.
Point defect
Defects associated with one or two atomic positions.
Vacancy
The simplest of the point defects.
Self-interstitial
An atom from the crystal that is crowded into an interstitial site, a small void space that under ordinary circumstances is not occupied.
Alloy
A solid in which impurity atoms have been added intentionally to impart specific characteristics to the material.
Solid solution
Formed as a result of adding impurity atoms to a metal.
Solvent
The element or compound that is present in the greatest amount.
Solute
An element or compound present in a minor concentration.
SUBSTITUTIONAL POINT DEFECT
Solute or impurity atoms replace or substitute for the host atoms.
INTERSTITIAL POINT DEFECT
Impurity atoms fill the voids or interstices among the host atoms.
Weight percent
The weight of a particular element relative to the total alloy weight.
Atom percent
The number of moles of an element in relation to the total moles of the elements in the alloy.
DISLOCATION
A linear or one-dimensional defect around which some of the atoms are misaligned.
Edge dislocation
A linear defect that centers on the line that is defined along the end of the extra half-plane atoms.
Dislocation line
For the edge dislocation the dislocation line is perpendicular to the page.
Screw dislocation
Thought of as being formed by a shear stress. The upper front region of the crystal is shifted one atomic distance to the right relative to the bottom portion. Also linear and along a dislocation line.
BURGERS VECTOR
The magnitude and direction of the lattice distortion associated with a dislocation.
Engineering stress
(F/A) where F is the instantaneous load applied perpendicular to the specimen cross section, and A is the original cross-sectional area before any load is applied.
Engineering strain
(∆l/l) where ∆l is the change in length and l is the original length.
MODULUS OF ELASTICITY or Young’s modulus
The constant of proportionality in the relationship between stress and strain.
ELASTIC DEFORMATION
Deformation in which stress and strain are proportional.
Anelasticity
Time-dependent elastic strain behavior once a load is released. For metals this component is normally small and is often neglected.
Viscoelastic behavior
When the magnitude of the time-dependent elastic behavior is significant it is termed viscoelastic behaior.
Poisson’s ratio
The ratio of the lateral and axial strains.
PLASTIC DEFORMATION
Permanent, nonrecoverable deformation where stress is no longer proportional to strain.
Yielding
The stress level at which plastic deformation begins.
YIELD STRENGTH
The stress corresponding to the intersection of the strain offset line and the stress-strain curve as it bends over in the plastic region.
TENSILE STRENGTH
Corresponds to the maximum stress that can be sustained by a structure in tension. If applied and maintained, fracture will result.
DUCTILITY
The measure of the degree of plastic deformation that has been sustained at fracture.
Resilience
The capacity of a material to absorb energy when it is deformed elastically and then, upon unloading, to have this energy recovered.
TOUGHNESS (fracture toughness)
A material’s resistance to fracture when a crack is present.
True stress
Stress calculated using the instantaneous cross-sectional area.
True strain
The natural logarithm of instantaneous length divided by original length.
HARDNESS
A measure of a material’s resistance to localized plastic deformation (e.g., a small dent or a scratch)
Design stress
The calculated stress level (on basis of estimated max load) multiplied by a design factor, N’.
Safe stress or working stress
The yield strength divided by a factor of safety, N.
SLIP
The process by which plastic deformation is produced by dislocation motion.
DISLOCATION
The total dislocation length per unit volume.
SLIP SYSTEM
The combination of the slip plane and the slip direction.
SOLID-SOLUTION STRENGTHENING
Alloying with impurity atoms that go into either substitutional or interstitial solid solution.
STRAIN HARDENING OR COLD WORKING
The phenomenon whereby a ductile metal becomes harder and stronger as it is plastically deformed. Termed cold working as the temperature at which deformation takes place is “cold” relative to the absolute melting temperature of the metal.
GRAIN GROWTH
The process by which the strain-free grains, after complete recrystallization, will continue to grow if the metal specimen is left at the elevated temperature.
CLEAVAGE
The successive and repeated breaking of atomic bonds along specific crystallographic planes.