Exam 1 Flashcards
Material Selection Procedure:
- For a specific application -> Determine desired properties
- From list of properties -> Identify Candidate material
- Best candidate material -> Specify processing technique
Properties of Metals
Strong, ductile, high thermal & electrical conductivities, opaque (not transparent), reflective
Properties of Plastics
Soft, ductile, low strength, low densities, low thermal and electrical conductivities, (opaque, translucent or transparent)
Properties of Ceramics
Hard, brittle, low thermal and electrical conductivities, (opaque, translucent, or transparent)
Quantum numbers
Comprised of
n = principal (shell); K, L, M, N, O (1,2,3,4, etc.)
l = sub shell; s, p, d, f (0, 1, 2, 3, etc.)
ml = magnetic (from -l to l)
ms = spin; -1/2 or 1/2
Valence electrons determine:
Materials chemical, electrical, thermal, and optical properties
Ionization process
metal atom donates electrons while nonmetal atoms accept electrons
Electronegativity
Defines the tendency of an element to acquire electrons
Ionic Bonding
Between metal and non-metal resulting in TRANSFER of electrons from the metal to the nonmetal
(Large difference in electronegativity)
Covalent bonding
Between two nonmetals and is characterized by SHARING of electrons
Metallic bonding
Between two metals and is associated with DELOCALIZED electron pool (“sea of electrons”)
Force of attraction
Fa = -(kZ1Z2)/r^2
Ionic bonds are common in ceramics and result in properties such as
Non-directional, relatively high bond energy, hard and brittle, electrically and thermally insulated, conduct electricity if melted or dissolved, high melting and boiling points
The stronger the ionic bond
The higher the melting point
Covalent bonds determined by hybridization
sp - polyyne
sp2 - graphite, graphene, nanotube, fullerene
sp3 - diamond
Covalent bonds are common in polymers
polymers have strong forces within molecules and weak forces between molecules
Due to delocalized electrons in metallic bonding metals…
Have moderately high melting and very high boiling points, can be pounded to sheets or drawing into wires, very good electrical and thermal conductors, easily form alloys with other metals
Secondary bonding force ranking
Ion-dipole
H bond
dipole-dipole
ion-induced dipole
dipole-induced dipole
dispersion forces
Classification of Solids
Crystalline (molecular, metallic, covalent, or ionic solid) or amorphous
edge of sc unit
a = 2r