Electrical/thermal properties Flashcards
Ohm’s law
V=IR
Relationship between resistivity and conductivity
O’ = 1/P
O’ = conductivity
P = resistivity
Range of conductivity between materials (Ohm-m)^-1
Conductors: 1-6.8x10^7
Semiconductors: 10^-6 -> 4x10^-4
Insulators: 10^-17 -> 10^-9
In terms of electron band structure, discuss reasons for difference in conductivity among metals, semicons, insulators.
Metals: -partially filled bands
-overlapping empty bands
Insulators : -wide band gap (>2eV)
-few electrons excited across band gap
Semicons: -narrow band gap (<2eV)
-more electrons excited
Describe drift velocity/ mobility of a free electron
Drift velocity: avg V in the direction of F app imposed on the app field
Electron mobility: how easily electrons can move in response to an electric field
Factors that influence resistivity
- temperatures (increase atomic separation)
-imperfections (scatter electrons so they take a less direct path)
Why are semiconductors useful, list examples
- unique intrinsic, extrinsic properties allows the development of diodes and transistors in replacement of vacuum tubes, miniturizing circuits
Compare intrinsic/ extrinsic semicons, list examples for each
Intrinsic: electrical properties of the pure material (not controlled by impurities)
- silicon/germanium
Extrinsic: elec properts determined by impurities which introduce excess electrons/holes
-SiP, SiB
Expression for conductivity of intrinsic semicons
o’= n|e|ųe + p|e|ųh
o’ = conductivity
n, ųe = electron side
p, ųh = hole side
e = Coulomb’s constant
Expression for extrinsic semicons:
o’ ~ n|e|ųe (n-type)
o’ ~ p|e|ųh (p-type)
Compare n-type and p-type
n-type : more electrons than holes
p-type: more holes than electrons
What is heat capacity, Cp and Cv
-Ability of material to absorb heat
-HC at constant pressure
-HC at constant volume
what is linear coef of thermal expansion/ volume coef of thermal expansion
Al = delta (L)/ Li (Tf-Ti)
Av = delta (V)/ Vi (delta T)
How do atoms influence thermal expansion
As atoms move more, they bump into each other and push each other away -> results in thermal expansion