Corrosion Flashcards

1
Q

Oxidation reaction

A
  • When a metal loses electrons + becomes positive - takes place at anode + can be gain of oxygen/loss of H
  • Material removed from anode (corrosion)
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2
Q

Reduction reaction

A
  • Element gains electrons + becomes more negative - site of reduction is cathode + can be loss of oxygen/gain of H
  • Material added to cathode (electroplating)
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3
Q

Standard half cell

A

Pure metal electrode immersed in 1M solution of its ions at 25 degrees C

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4
Q

When are potentials calculated for EMF series valid?

A

For 1M solution at 25 degrees C + requires 0 current

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5
Q

Does Nernst equation require 0 current?

A

Yuh

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6
Q

Polarization

A

Change in electrode potential caused by some effect - when electrochemical cell doing work + current flowing through it the potential of each electrode changes due to polarization

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7
Q

Overvoltage

A

Difference between closed + open circuit voltage

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8
Q

Activation polarization

A

Potential difference beyond value of equilibrium needed to generate currents depending on energy activation of redox rxn - over voltage is driving force for rxn

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9
Q

Concentration polarization

A

Part of polarization of electrolytic cell resulting from changes in electrolyte concentration due to passage of current through electrode/solution interface - affects cathode only and when diffusion is rate limiting

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10
Q

Passivity

A

When thin oxide film forms as barrier to corrosion - occurs only on anode

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11
Q

Passive region

A

Oxide layer forms on surface which prevents passage of current

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12
Q

Transpassive region

A

Potential is high enough to break oxide layer

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13
Q

8 types of corrosion

A

Uniform, galvanic, crevice, pitting, intergranular, selective leaching, erosion-corrosion, stress corrosion

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14
Q

Galvanic corrosion

A

Occurs when 2 metals w/diff composition are electrically couples while being exposed to electrolyte

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15
Q

How to avoid Galvanic corrosion?

A

Choose metals close in galvanic series, avoid unfavourable anode-cathode area ratios, electrical insulation + connect to a more anodic metal

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16
Q

Crevice corrosion

A

Occurs because of concentration differences in ions - occurs in region of low concentration

17
Q

Pitting

A

Concentration difference driven like crevice corrosion but corrosion pit forms as deep well driven by gravity

18
Q

Intergranular corrosion

A

Occurs at grain boundaries often when metals are heated

19
Q

Selective leaching

A

When 1 element of alloy is selectively removed by corrosion process

20
Q

Erosion corrosion

A

Occurs from combined action of chemical attack and mechanical abrasion from fluid motion - especially harmful to alloys that normally passivate as it removes protective layer

21
Q

Stress corrosion

A

When metals that normally resist certain corrosive environment corrode when stress is applied in addition to corrosive environment - small cracks form + propagate in direction perpendicular to stress

22
Q

Hydrogen embrittlement

A
  • Reduction in ductility + tensile strength when atomic H penetrates structure of material - failure mode
  • May be induced by cathodic protection
23
Q

General corrosion prevention

A
  • Select material that doesn’t corrode in application environment
  • Make environment less corrosive
  • Use chemical corrosion inhibitors in environment which chemically bind surface + prevent corrosion
  • Make parts of interest a cathode
24
Q

Cathodic protection

A

Create electrical connection to more anodic metal which will preferentially corrode - can be forced by applying external potential

25
Q

Pilling-Bedworth ratio

A

Evaluates volume of oxide vs volume of metal it’s replacing

26
Q

P-B ratio < 1

A

Oxide takes less volume than metal

27
Q

P-B ratio = 1

A

Oxide takes same volume as metal

28
Q

P-B ratio > 1

A

Oxide takes greater volume than metal

29
Q

Kinetics of well-adhering films

A

Oxide growth limited by ionic diffusion described by Fick’s law - growth kinetics for these is parabolic

30
Q

Kinetics of films that are porous/flake off

A
31
Q

Kinetics of very thin oxides growing close to room temperature

A

Logarithmic growth kinetics