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ME2162 > Chapter 5.1 Additive Manufacturing > Flashcards

Chapter 5.1 Additive Manufacturing Flashcards

1
Q

What are the advantages of AM?

A
  • Create complex geometries
  • Customise every item
  • Lower fixed costs (No tools + moulds)
  • Rapid prototyping (Less fiscally risky to produce)
  • Less waste material
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2
Q

What are the drawbacks of AM

A
  • Higher costs for large production runs
  • Less material choics / colours / finishes
  • Limited strength & endurance
  • Lower precision
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3
Q

What is the purpose of AM supports?

A
  • Prevent deformation & curl
  • Separate part from platform
  • Anchor unattached sections
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4
Q

What are the Advantages of STL?

A
  • Simple method of representing 3D CAD data
  • De facto standard
  • Small and accurate files for certain shapes
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5
Q

What are the disadvantages of STL?

A
  • Redundant information eg. Duplicate vertices & edges -> Larger file size
  • Geometry flaws generated from CAD models, needs repairing
  • Long time to slice large STL files
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6
Q

Problems in STL Files

A
  • Missing Facets / Gaps
  • Degenerate Facets
  • Overlapping Facets
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7
Q

Subtypes of binder jetting

A
  • ColorJet Printing (CJP)
  • Digital Part Materialisation (DPM)
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8
Q

Subtypes of Material Extrusion

A
  • Fused Deposition Modelling (FDM)
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9
Q

Subtypes of Material Jetting

A
  • Polyjet
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10
Q

Subtypes of PBF (Powder Bed Fusion)

A
  • Selective Laser Sintering (SLS)
  • Selective Laser Melting (SLM)
  • Electron Beam Melting (EBM)
  • Multi Jet Fusion
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11
Q

Vat Photopolymerisation Subtypes

A
  • Stereolithography (SLA)
  • Digital Light Processing (DLP)
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12
Q

Subtypes of DED (Directed Energy Deposition)

A
  • Electron Beam Direct Manufacturing (EBDM)
  • Laser Metal Deposition (LMD)
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13
Q

Sheet Lamination Subtypes

A
  • Laminated Object Manufacturing (LOM)
  • Selective Deposition Lamination (SDL)
  • Ultrasonic Additive Manufacturing (UAM)
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14
Q

Sources of energy in DED (Directed Energy Deposition)

A
  • Laser
  • Friction stir
  • Electron beam
  • Arc
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15
Q

Binding mechanisms in PBF (Powder bed fusion)

A
  • Solid state sintering
  • Chemically induced binding
  • Liquid phase sintering (Partial melting)
  • Full melting
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16
Q

Advantages of binder jetting

A
  • Wide range of materials (polymers, metals, ceramics (sand))
  • Faster (Main bulk of material that’s actually deposited is via powder spreader, small portion through print heads)
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17
Q

Disadvantages of binder jetting

A
  • Poor accuracy and surface finish
  • Post-processing (Infiltration / furnace / sintering) needed for high density / good mechanical properties (Binders need to be removed)
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18
Q

Advantages of CJP (Colour Jet Printing)

A
  • High speed
  • Versatile
  • Simple to operate
  • Minimal material wastage
  • Complex colours
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19
Q

Disadvantages of CJP (ColorJet Printing)

A
  • Limited functional parts (Relative to SLS)
  • Poor surface finish
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20
Q

Advantages of DPM (Digital Part Materialisation)

A
  • Fast (85000 cm^3 / hr)
  • Flexible
  • Reliable
  • Large Parts (1800 x 1000 x 700 mm)
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21
Q

Disadvantages of DPM
(Digital Part Materialisation)

A
  • Large space
  • Limited materials (Metal / sand)
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22
Q

Advantages of DED
(Directed Energy Deposition)

A
  • Can produce fully dense parts
  • can repair defective / damaged components
23
Q

Disadvantages of DED
(Directed Energy Deposition)

A
  • Poor resolution + surface finish
  • Low complexity only
24
Q

Advantages of EBDM
(Electron Beam Direct Manufacturing)

A
  • Fast and cost effective for large metal parts
  • Multi-material printing
  • High deposition rate (relative to other DEDs)
  • Near 100% usage efficiency -> Less material waste (Compared to powder bed fusion)
  • Wire feedstock less flammable, cheaper than powder feedstock
25
Q

Disadvantages of EBDM
(Electron Beam Direct Manufacturing)

A
  • Poor resolution (No fine details)
  • No supports (No complex internal geometries)
  • Only weldable metals that aren’t highly flammable
26
Q

Advantages of LMD
(Laser Metal Deposition)

A
  • Superior material properties (Fully dense)
  • Complex parts (Worse than powder bed fusion, better than EDM)
  • Add material on to existing parts (Use for repairs / hybrid manufacturing)
  • Multiple materials can be blended
  • Low powder cost (Wide powder size range - 150-200mm usually)
27
Q

Disadvantages of LMD
(Laser Metal Deposition)

A
  • Geometric complexity (Worse than powder bed fusion)
  • surface finish (Rougher than powder bed fusion)
  • Dimensional accuracy (Worse than powder bed fusion)
28
Q

Advantages of FDM
(Fused Deposition Modelling)

A
  • Can fabricate functional parts
  • Minimal wastage
  • Ease of support removal
  • Ease of material change
  • Large build volume (eg. 900 x 900 mm)
29
Q

Drawbacks of FDM
(Fused Deposition Modelling)

A
  • Limited accuracy (By filament, between 0.2-0.5mm)
  • Slow process (Restricted by extrusion rate / flow rate)
  • Unpredictable shrinkage (Due to rapid cooling, needs compensation)
30
Q

Advantages of Polyjet

A
  • High quality
  • High accuracy
  • Fast process speed
  • Smooth surface finish
  • Wide range of materials (Acrylic, plastic, rubber etc)
  • Easy usage (Cartridges)
  • SHR (Single head replacement) - Replace nozzles instead of whole unit
  • Safe, clean, Low noise
  • Multiple materials in 1 run (Also multiple colours)
31
Q

Disadvantages of Polyjet

A
  • Post-processing required to wash away support material
  • Wastage of support material
32
Q

Advantages of PBF
(Powder bed fusion)

A
  • Wide range of materials (Polymers, metals, ceramics)
  • Fast
33
Q

Disadvantages of PBF
(Powder bed fusion)

A
  • Support structures needed for metals
  • Expensive and time consuming post processing (for metals)
  • Lower resolution and accuracy (Compared to liquid processes for polymers)
34
Q

Advantages of SLS
(Selective Laser Sintering)

A
  • Good part stability (Precise controlled environment)
  • Wide range of processing materials (Any material in powder form)
  • No parts supports required
  • Little postprocessing required
  • No post-curing required
35
Q

Disadvantages of SLS
(Selective Laser Sintering)

A
  • Large physical size
  • High power consumption (High laser wattage)
  • Poor surface finish (Large particle size of powders)
36
Q

Advantages of SLM
(Selective Laser Melting)

A
  • High quality metal parts (100% density)
  • Large range of metal materials (Stainless steel, titanium, aluminium, etc)
  • Fast and low cost
  • High accuracy
  • Complex geometries
37
Q

Disadvantages of SLM
(Selective Laser Melting)

A
  • Large physical size
  • High power consumption
  • Slow process (Compared to machining)
38
Q

EBM Advantages
(Electron Beam Melting)

A
  • Superior material properties (Fully dense parts)
  • Excellent accuracy (Less shrinkage, no impurities from oxides)
  • Excellent finishing
  • Good build speed
39
Q

EBM Disadvantages
(Electron Beam Melting)

A
  • Need to maintan vacuum chamber
  • High power consumption
  • Gamma rays
40
Q

Multi Jet Fusion Advantages

A
  • Fast (Faster than FDM and SLS)
  • Low cost per part (Cheaper than FDM and SLS)
  • High quality functional parts
  • High accuracy and fine details
  • Add additional parts whilst printing
41
Q

Multi Jet Fusion Disadvantages

A
  • Only STL files can be used
  • Post-processing required to clean and cool part
  • Only thermoplastics and elastomers can be used
42
Q

Vat Photopolymerisation Advantages

A
  • High accuracy, resolution, good surface finish
  • Compatible with different sizes and machine configs
43
Q

Vat Photopolymerisation Disadvantages

A
  • Only photopolymers
  • Lower impact strength and durability compared to injection moulding
  • Material ages and mechanical properties degrade over time
43
Q

SLA Advantages
(Stereolithography)

A
  • Unattended round the clock operation
  • Various build volumes
  • High accuracy
  • Good surface finish
  • Wide range of materials
44
Q

SLA Disadvantages
(Stereolithography)

A
  • Support structures required
  • Post-processing required for support removal
  • Post-curing required to ensure structure integrity
45
Q

DLP Advantages
(Digital Light Processing)

A
  • High building speed (Faster than SLA)
  • Office friendly process
  • Small quantity of resin during build
  • No wiper / leveler (No stability issues to part)
  • Less shrinkage (immediate curing)
  • Safe supply cartridges (Lower risk of user coming into contact)
  • Additional components (Integrated into system to allow for higher quality tougher parts)
46
Q

DLP Disadvantages
(Digital Light Processing)

A
  • Limited build volumes (Structures build from bottom)
  • Peeling of completed part (May damage model during peeling process)
  • Post-Processing (And maybe post curing) required
47
Q

Sheet Lamination Advantages

A
  • High speed
  • Low cost
48
Q

Sheet Lamination Disadvantages

A
  • Strength depends on bonding strength
  • Highly anisotropic (Non-uniform), may delaminate due to weak interlayer bonding
  • Material wastage
49
Q

SDL Advantages
(Selective Deposition Lamination)

A
  • Low cost (Its literally paper)
  • High precision (0.012mm precision, 0.1mm accuracy)
  • Safe (Its literally paper)
  • Eco-friendly (Its literally paper)
  • High resolution in colour printing (More than 1 million colours, 5760 × 1440 × 508 dpi)
50
Q

SDL Disadvantages
(Selective Deposition Lamination)

A
  • Low strength (Its literally paper)
  • Small build volume (Only A4 / letter size area because its literally paper)
51
Q

UAM Advantages

A
  • No concerns on shrinkage, residual stress or distortion (Low temp operation)
  • Can process multiple materials which are dissimilar
52
Q

UAM Disadvantages

A
  • Low interfacial bonding and bonding strength
  • Fixed layer thickness

ME2162 (6 decks)

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