Chapter 3 Flashcards
Point defects
Vacancies
Intersticial atoms
Substitutional impurities
Linear defects
Dislocations
Interfacial defects
Grain boundaries
Interstitial impurity
Favourable to maintain packaging factor less common than vacancy because of distortion
Substitutions
Occur when the atomic radius is less than 15 percent host atom size
Edge dislocation
Berger vector is perpendicular to dislocation line and produces extra half plane
Screw dislocation
Burger vector is parallel to dislocation line
Grain boundaries
More reactive, interstital impurities, high energy not fully bound
Stacking fault
Error in planar stacking sequence
Types of microscopes
Optical
Scanning electron
Transmition electron
Scanning probe microscopy
Optical microscopy
2000x magnification
Grain boundaries are etched an appear as dark lines from scattered light
Transmition electron microscope
1 million x mag
Scatters electrons further from microscope
Scanning electron microscope
50,000x mag
Reflects electeons off of surface
Scanning probe microscopy
10^9 mag
Generates 3D topo map of surface