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1
Q

Cleanscrub1 with CP72B

A

ZWFSCRB1 and B2

AKA: Yes 450-PB8 Vacuum Bake Oven

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2
Q

PreMetalDeposition Bake VacBakeTI

A

ZOVEN21, 22, 23

AKA: Yes 450-PB8 Vacuum Bake Oven; Vacuum Bake

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3
Q

Cont Metal Deposition Ti:

A

ZSPUTR09

AKA: AMAT Endura HP Sputter System; Metal Sputter Deposition

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4
Q

Foil Bond

A

ZLSRBND02 ZLSRBND03 ZLSRBND05

AKA: 8451 ILT Laser Bonder Model 5000; 8539 ILT Laser Bonder Model 5000;
8700 ILT Laser Bonder

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5
Q

FOL Laser Scribe:

A

ZLASRMK3

AKA: Coherent-Rofin Waferlase 200D Marker UV SPECTRUM LSR MKR

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6
Q

Clean Scrub2.0 with CP72B

A

ZWFSCRB1
ZWFSCRB2

AKA: Lam Ontrak Series 1 Wafer Scrubber Lam Ontrak DSS-200 Series 2? Wafer Scrubber

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7
Q

PreMetal Dep BAKE VacBakeM1

A

ZOVEN21 ZOVEN22 ZOVEN23

AKA: Yes 450-PB8 Vacuum Bake Oven Yes 450-PB8 Vacuum Bake Oven

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8
Q

M1 Metal Deposition:

A

ZSPUTR09 ZSPUTR12

AKA: AMAT Endura HP Sputter System AlCu Deposition

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9
Q

M1 Photo Coat Bake:

A

ZCODEV04 ZCODEV06

AKA: TEL Clean Track Mark7 Coater Developer System; Coat

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10
Q

M1 Align Expose:

A

ZALIGN15 ZALIGN16

AKA: EVG IQ Aligner/TBR 300 Neutronix-Quintel NXQ 8008 Mask Aligner

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11
Q

M1 Photo Develop:

A

ZCODEV04 ZCODEV06

AKA: TEL Clean Track Mark7 Coater Developer System; Develop

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12
Q

M1 ADI

A

ZINSP71

AKA: Nikon NWL-860 Wafer Microscope System; Develop Inspection

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13
Q

M1 Descum:

A

ZSTRIP22L ZSTRIP22R ZSTRIP24 ZSTRIP26

AKA: Gasonics Pep 3510 Plasma Asher Trymax NEO2120 Plasma Stripper

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14
Q

M1 Wet Etch Al:

A

ZSTRIP12B

AKA: SVP Wet Hood Right Tank Aluminum 16:1:1:2 Wet Etch

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15
Q

M1 AEI

A

ZINSP72

AKA: Nikon NWL-860 Wafer Microscope System Expose Inspection

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16
Q

M1 Strip Resist Photo

A

ZCODEV04

AKA: TEL Clean Track Mark7 Coater Developer System Photo Strip

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17
Q

M1 Strip Resist Dry:

A

ZSTRIP22L ZSTRIP22R ZSTRIP24 ZSTRIP26

AKA: Gasonics Pep 3510 Plasma Asher; Trymax NEO2120 Plasma Stripper

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18
Q

M1 ACI

A

ZINSP72

AKA: Nikon NWL-860 Wafer Microscope System; Clean Inspection

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19
Q

VIA1 Dielectric Deposition:

A

ZPECVD14 ZPECVD15

AKA: Novellus Glassivation System; PECVD

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20
Q

VIA1 Photo Prime Coat Bake:

A

ZCODEV04 ZCODEV06

AKA: TEL Clean Track Mark7 Coater Developer System; APF Photoresist Track

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21
Q

VIA1 Align Expose

A

ZALIGN15 ZALIGN16

AKA: EVG IQ Aligner/TBR 300 Neutronix-Quintel NXQ 8008 Mask Aligner

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22
Q

VIA1 Photo Develop

A

ZCODEV04 ZCODEV06

AKA: TEL Clean Track Mark7 Coater Developer System Develop

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23
Q

VIA1 ADI

A

ZINSP70

AKA: Nikon NWL-860 Wafer Microscope System; Develop Inspection

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24
Q

VIA1 Descum

A

ZSTRIP22L ZSTRIP22R ZSTRIP24 ZSTRIP26

AKA: Gasonics Pep 3510 Plasma Asher; Trymax NEO2120 Plasma Stripper

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25
Q

VIA1 Dry Etch (D19)

A

ZETCHD19; ZETCHD14

AKA: LAM 4520i Rainbow Oxide Etcher; Oxide etch

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26
Q

VIA1 AEI Inspection

A

ZINSP72

AKA: Nikon Eclipse microscope; inspection

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27
Q

VIA1 Strip Resist Dry

A

ZSTRIP22L ZSTRIP22R ZSTRIP24 ZSTRIP26

AKA: Gasonics Pep 3510 Plasma Asher; Trymax NEO2120 Plasma Stripper

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28
Q

VIA1 WetEtch Defreckle

A

ZCLEAN47B

AKA: Wet Etch Clean Hood Tank B; Defreckle

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29
Q

VIA1 ACI

A

ZINSP72

AKA: Nikon NWL-860 Wafer Microscope System; Clean Inspection

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30
Q

M2 Metal Deposition

A

ZSPUTR09 ZSPUTR12

AKA: AMAT Endura HP Sputter System; AlCu Deposition

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31
Q

M2 Photo Coat Bake

A

ZCODEV04 ZCODEV06

AKA: TEL Clean Track Mark7 Coater Developer System; Coat

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32
Q

M2 Align Expose

A

ZALIGN15 ZALIGN16

AKA: EVG IQ Aligner/TBR 300; NEUTRONIX-QUINTEL NXQ 8008 Mask Aligner

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33
Q

M2 Photo Develop

A

ZCODEV04 ZCODEV06

AKA: TEL Clean Track Mark7 Coater Developer System; Develop

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34
Q

M2 ADI

A

ZINSP72

AKA: Nikon NWL-860 Wafer Microscope System Develop Inspection

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35
Q

M2 Descum

A

ZSTRIP22L ZSTRIP22R ZSTRIP24 ZSTRIP26

AKA: Gasonics Pep 3510 Plasma Asher Trymax NEO2120 Plasma Stripper

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36
Q

M2 Wet Etch Al

A

ZSTRIP12B

AKA: Sun Valley Plastics Heated Quartz Bath; Al 16:1:1:2 Wet Etch

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37
Q

N/A

A

N/A

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38
Q

M2 Strip Resist Photo

A

ZCODEV04

AKA: TEL Clean Track Mark7 Coater Developer System; Photo Strip

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39
Q

VIA2 Wet Etch Defreckle

A

ZCLEAN47B

AKA: Sun Valley Plastics Heated Quartz Bath - Acid Hood Tank B; Defreckle

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40
Q

VIA2 ACI

A

ZINSP72

AKA: Nikon NWL-860 Wafer Microscope System; Clean Inspection

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41
Q

Padstack Metal Deposition

A

ZSPUTR09 ZSPUTR12

AKA: AMAT Endura HP Sputter System; Ti / NiV / Au Deposition

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42
Q

Padstack Photo Coat Bake

A

ZCODEV04 ZCODEV06

AKA: TEL Clean Track Mark7 Coater Developer System; Coat Track

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43
Q

Padstack Align Expose

A

ZALIGN15 ZALIGN16

AKA: EVG IQ Aligner/TBR 300; Neutronix-Quintel NXQ 8008 Mask Aligner

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44
Q

Padstack Photo Develop

A

ZCODEV04 ZCODEV06

AKA: TEL Clean Track Mark7 Coater Developer System; Develop

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45
Q

Padstack ADI

A

ZINSP71

AKA: Nikon NWL-860 Wafer Microscope System; Develop Inspection

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46
Q

Padstack Descum

A

ZSTRIP22L ZSTRIP22R ZSTRIP24 ZSTRIP26

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47
Q

Padstack Wet Etch Au

A

ZETCHW22

AKA: gold etch; CRP Wet Etch Hood

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48
Q

Padstack1 AEI

A

ZINSP72

AKA: Nikon NWL-860 Wafer Microscope System; Expose Inspection

49
Q

Padstack Wet Etch NiV

A

ZETCHW23

AKA: NiV etch; CRP Wet Etch Hood

50
Q

Padstack Dry Etch

A

ZETCHD21, 15

AKA: LAM 9600 TCP Metal Etcher; NiV Dry Etch

51
Q

N/A

A

N/A

52
Q

Padstack Strip Resist Wet

A

ZSTRIP21 PLUS SRD

AKA: ST-22; Fab Etch

53
Q

Padstack ACI

A

ZINSP72

AKA: Nikon Eclipse microscope; Clean Inspection

54
Q

IC Protect Coat

A

ZCOTCLEN01

AKA: Süss ACS200 (Coat/Clean); Coater

55
Q

IC Protect Bond

A

ZBNDDBN01

AKA: Süss XBS200 (Bond/Debond); Bonder

56
Q

Antenna Metal Deposition Au (GOLD)

A

ZSPUTR09 ZSPUTR12

AKA: AMAT Endura HP Sputter System; gold dep

57
Q

Antenna Photo Coat Bake

A

ZCODEV04C ZCODEV06C

AKA: TEL Clean Track Mark7 Coater Developer System; Coat Track

58
Q

Antenna Align Expose

A

ZALIGN15 ZALIGN16

AKA: EVG IQ Aligner/TBR 300; Neutronix-Quintel NXQ 8008 Mask Aligner

59
Q

Antenna Photo Develop

A

ZCODEV04D ZCODEV06D

AKA: TEL Clean Track Mark7 Coater Developer System; Develop

60
Q

Antenna ADI

A

ZINSP72

AKA: Nikon NWL-860 Wafer Microscope System; Develop Inspection

61
Q

Antenna Wet Etch1 Au

A

ZETCHW22

AKA: gold etch; CRP Wet Etch Hood

62
Q

Antenna Wet Etch TiFoil

A

ZETCHW25

AKA: TiFoil etch; SPEC SBXAT3-60 Automated HF Wet Hood

63
Q

Antenna AEI

A

ZINSP72

AKA: Nikon NWL-860 Wafer Microscope System; Expose Inspection

64
Q

Antenna Strip Resist Wet

A

ZSTRIP21

AKA: ST-22; Fab Etch

65
Q

Antenna Wet Etch2 Au

A

ZETCHW22

AKA: gold etch; CRP Wet Etch Hood

66
Q

Antenna ACI

A

ZINSP72

AKA: Nikon Eclipse microscope; Clean Inspection

67
Q

Electrode Metal Deposition Ti

A

ZSPUTR09 ZSPUTR12

AKA: AMAT Endura HP Sputter System; Ti Deposition

68
Q

Electrode Metal Deposition TiN

A

ZSPUTR09 ZSPUTR12

AKA: AMAT Endura HP Sputter System, TiN Deposition

69
Q

Electrode Spray Coat & Bake

A

ZCOAT09 ZCOAT10

AKA: EVG120 Automated Spray Coater; Spray Coat

70
Q

Electrode Align Expose

A

ZALIGN15 ZALIGN16

AKA: EVG IQ Aligner/TBR 300; Neutronix-Quintel NXQ 8008 Mask Aligner

71
Q

Electrode Photo Develop

A

ZCODEV04D ZCODEV06D

AKA: TEL Clean Track Mark7 Coater Developer System; Develop

72
Q

Electrode ADI

A

ZINSP71

AKA: Nikon NWL-860 Wafer Microscope System; Develop Inspection

73
Q

Electrode DryEtch TiN

A

ZETCHD21, 15

AKA: LAM 9600 TCP Metal Etcher; TiN Dry Etch

74
Q

SRD

A

ZCLEAN34

AKA: OEM Group SRD (Semitool Rinse Dryer); Semitool Rinse Dryer - Wafer Clean and Dry

75
Q

Electrode ACI

A

ZINSP72

AKA: Nikon Eclipse microscope; Clean Inspection

76
Q

IC Protect Debond

A

ZBNDDBND01; ZBNDDBND02

AKA: Suss XBS200 Bond and Debond Module; Debond

77
Q

IC Protect Clean

A

ZCOTCLEN01; also in Hood

AKA: Suss ACS Clean and Coat Module; Clean

78
Q

N/A

A

N/A

79
Q

Wafer Scribe

A

ZLASRMK3

AKA: Coherent-Rofin Waferlase 200D Marker UV SPECTRUM LSR MKR; Wafer Scribe

80
Q

ViaImageFab.0

A

ZEVAL71

AKA: Nikon VMZ-3020TZ Optical Measurement; Via Evaluation

81
Q

ViaImageFab.0

A

ZEVAL71

AKA: Nikon VMZ-3020TZ Optical Measurement; Via Evaluation

82
Q

N/A

A

N/A

83
Q

Test Keithley PCM

A

ZAUTOP10

AKA: Keithley S530/Accretech UF2000 Parametric Test System

84
Q

Test KS Keithley Site

A

ZAUTOP10

AKA: Site Test; Keithley S530/Accretech UF2000 Parametric Test System

85
Q

Engr Dispo FAB1

A

DISPO

86
Q

Post Keithley Adj

A

AUTOMATION

AKA: adjust; Fab Automation Adjustment

87
Q

Merge Review Fab

A

ZAUTOP10

AKA: end of fab; Keithley S530/Accretech UF2000 Parametric Test System

88
Q

N/A

A

N/A

89
Q

Solder Dispense (SMT)

A

ZAUTOP10

AKA: Datacon; Keithley S530/Accretech UF2000 Parametric Test System

90
Q

Component Placement Reflow

A

ZAUTOP10

AKA: Reflow Oven; Keithley S530/Accretech UF2000 Parametric Test System

91
Q

Stop Continuous Flow2

A

ZAUTOP10

AKA: Keithley S530/Accretech UF2000 Parametric Test System

92
Q

SMT Visual

A

ZSMTINSP38

AKA: microscope; inspection

93
Q

Post SMT Clean

A

ZCLEAN63A

AKA: Class One; Trident Solvent Spray Tool

94
Q

VIA Image SMT Nikon

A

ZEVAL71 ZEVAL75

AKA: Nikon VMZ-3020TZ Optical Measurement

95
Q

VIA Inspect SMT

A

TABLE690 TABLE812

AKA: Sovella; Via Deposition Station

96
Q

Test WP SPEA FAB

A

PSPEA07

AKA: SPEA test

97
Q

N/A

A

N/A

98
Q

Post SPEA Adj

A

AUTOMATION

AKA: Adjust

99
Q

Prod Review

A

MERGE REVIEW

100
Q

Post SPEA Clean

A

ZCLEAN63

AKA: Class One; Trident Solvent Spray Tool

101
Q

Bond Pre Bake

A

ZBNDOVEN01 ZBNDOVEN02

AKA: Pre Battery - Bond Oven Bake; VWR 1330GM Oven

102
Q

Backfill

A

ZBKFILL01

AKA: Helium backfill

103
Q

Start Continuous Flow3: Battery Bond

A

ZLSRBND03; ZLSRBND04; ZLSRBND05

AKA: ILT 8539 Laser Bonder; ILT 8624; ILT 8700

104
Q

Battery Bondwidth Inspection

A

ZLBINSP02

AKA: Leica

105
Q

FINAL DEVICE:

Sapphire Singulation

A

ZZLSRSNG01 and 02

AKA: ILT; Singulation

106
Q

Sapphire Shaping

A

ZZSHAPE01 and 02

AKA: Shape

107
Q

Post Shape Cleaning

A

ZZCLEAN01

108
Q

Shape Metrology

A

Post shape metrology

109
Q

Fine Leak Test

A

ZZHEBOMB01 and 02

AKA: Helium Bomb

110
Q

Gross Leak Test

A

ZZLEAK01 and 02

AKA: Leak Test; Pernicka01 and 02

111
Q

Accelerometer: Hyperion

A

PHXHDT 001 and 006

112
Q

Device Test- FInal Functional Titan

A

PHXDTS 001; PHXDTS 006

113
Q

Final Inspection

A

QNIINSP01

114
Q

Battery Prep

A

Battery Grind (ZBPGRND01)

Post Grind Clean (ZBPCLEAN01) AKA Ransohoff

Deburr Inspect (ZBPINSP01 and 03)

Battery Polish (ZBPPLSH01 and 02)

Polish Clean (ZBPCLEAN02) AKA Axus Cleaner

115
Q

Battery Assembly (FAB)

A

Post polish Clean Inspect (ZBPKINSP02 and 01)

Cavity Height Inspection (ZEVAL 73 and 76) AKA Keyence

Flatness Inspection AKa Zygo

WeldInspectIonograph (ZBECWELD 02 and 01)

116
Q

VIA1 Descum

A

ZSTRIP22L ZSTRIP22R ZSTRIP24 ZSTRIP26

AKA: Gasonics Pep 3510 Plasma Asher; Trymax NEO2120 Plasma Stripper

117
Q

VIA1 Descum

A

ZSTRIP22L ZSTRIP22R ZSTRIP24 ZSTRIP26

AKA: Gasonics Pep 3510 Plasma Asher; Trymax NEO2120 Plasma Stripper

118
Q

VIA1 Descum

A

ZSTRIP22L ZSTRIP22R ZSTRIP24 ZSTRIP26

AKA: Gasonics Pep 3510 Plasma Asher; Trymax NEO2120 Plasma Stripper

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